NL7908310A - Werkwijze voor het vervaardigen van een geintegreerde schakeling. - Google Patents
Werkwijze voor het vervaardigen van een geintegreerde schakeling. Download PDFInfo
- Publication number
- NL7908310A NL7908310A NL7908310A NL7908310A NL7908310A NL 7908310 A NL7908310 A NL 7908310A NL 7908310 A NL7908310 A NL 7908310A NL 7908310 A NL7908310 A NL 7908310A NL 7908310 A NL7908310 A NL 7908310A
- Authority
- NL
- Netherlands
- Prior art keywords
- oxide
- openings
- region
- impurities
- base
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 32
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000012535 impurity Substances 0.000 claims description 24
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 18
- 229910052710 silicon Inorganic materials 0.000 claims description 18
- 239000010703 silicon Substances 0.000 claims description 18
- 238000009413 insulation Methods 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 13
- 230000001590 oxidative effect Effects 0.000 claims description 11
- 238000005530 etching Methods 0.000 claims description 9
- 238000002955 isolation Methods 0.000 claims description 9
- 239000002019 doping agent Substances 0.000 claims description 8
- 238000005468 ion implantation Methods 0.000 claims description 8
- 229910052796 boron Inorganic materials 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 4
- 229910052785 arsenic Inorganic materials 0.000 claims description 4
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims description 4
- 239000000356 contaminant Substances 0.000 claims description 4
- 238000000059 patterning Methods 0.000 claims 2
- 238000010276 construction Methods 0.000 description 14
- 229920002120 photoresistant polymer Polymers 0.000 description 12
- 238000009792 diffusion process Methods 0.000 description 10
- 230000015556 catabolic process Effects 0.000 description 6
- 150000002500 ions Chemical class 0.000 description 5
- 230000007704 transition Effects 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- -1 Boron ions Chemical class 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 239000007943 implant Substances 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76202—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/113—Isolations within a component, i.e. internal isolations
- H10D62/115—Dielectric isolations, e.g. air gaps
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Bipolar Transistors (AREA)
- Element Separation (AREA)
- Local Oxidation Of Silicon (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US96014378 | 1978-11-13 | ||
US05/960,143 US4199380A (en) | 1978-11-13 | 1978-11-13 | Integrated circuit method |
Publications (1)
Publication Number | Publication Date |
---|---|
NL7908310A true NL7908310A (nl) | 1980-05-16 |
Family
ID=25502843
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL7908310A NL7908310A (nl) | 1978-11-13 | 1979-11-13 | Werkwijze voor het vervaardigen van een geintegreerde schakeling. |
Country Status (3)
Country | Link |
---|---|
US (1) | US4199380A (en, 2012) |
JP (1) | JPS5571036A (en, 2012) |
NL (1) | NL7908310A (en, 2012) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5852339B2 (ja) * | 1979-03-20 | 1983-11-22 | 富士通株式会社 | 半導体装置の製造方法 |
JPS575358A (en) * | 1980-06-13 | 1982-01-12 | Fujitsu Ltd | Semiconductor device and manufacture thereof |
JPS57104240A (en) * | 1980-12-22 | 1982-06-29 | Nec Corp | Semiconductor device |
JPS57139965A (en) * | 1981-02-24 | 1982-08-30 | Toshiba Corp | Manufacture of semiconductor device |
JPS57149770A (en) * | 1981-03-11 | 1982-09-16 | Mitsubishi Electric Corp | Manufacture of semiconductor device |
JPS57194572A (en) * | 1981-05-27 | 1982-11-30 | Clarion Co Ltd | Semiconductor device and manufacture thereof |
US4465528A (en) * | 1981-07-15 | 1984-08-14 | Fujitsu Limited | Method of producing a walled emitter semiconductor device |
DE3174397D1 (en) * | 1981-08-08 | 1986-05-22 | Itt Ind Gmbh Deutsche | Method of producing a monolithic integrated solid-state circuit with at a least one bipolar planar transistor |
US4443931A (en) * | 1982-06-28 | 1984-04-24 | General Electric Company | Method of fabricating a semiconductor device with a base region having a deep portion |
JPS59161067A (ja) * | 1983-03-04 | 1984-09-11 | Hitachi Micro Comput Eng Ltd | バイポ−ラ型半導体装置の製造方法 |
US4498227A (en) * | 1983-07-05 | 1985-02-12 | Fairchild Camera & Instrument Corporation | Wafer fabrication by implanting through protective layer |
US4630096A (en) * | 1984-05-30 | 1986-12-16 | Motorola, Inc. | High density IC module assembly |
US4574469A (en) * | 1984-09-14 | 1986-03-11 | Motorola, Inc. | Process for self-aligned buried layer, channel-stop, and isolation |
US4583282A (en) * | 1984-09-14 | 1986-04-22 | Motorola, Inc. | Process for self-aligned buried layer, field guard, and isolation |
US4573257A (en) * | 1984-09-14 | 1986-03-04 | Motorola, Inc. | Method of forming self-aligned implanted channel-stop and buried layer utilizing non-single crystal alignment key |
JPS61222137A (ja) * | 1985-03-06 | 1986-10-02 | Sharp Corp | チップ識別用凹凸パターン形成方法 |
JPS63114261A (ja) * | 1986-09-11 | 1988-05-19 | フェアチャイルド セミコンダクタ コーポレーション | トランジスタ用の自己整合型ベース分路 |
US4883772A (en) * | 1986-09-11 | 1989-11-28 | National Semiconductor Corporation | Process for making a self-aligned silicide shunt |
IT1231913B (it) * | 1987-10-23 | 1992-01-15 | Sgs Microelettronica Spa | Procedimento di fabbricazione di transistori ad alta frequenza. |
US5338695A (en) * | 1992-11-24 | 1994-08-16 | National Semiconductor Corporation | Making walled emitter bipolar transistor with reduced base narrowing |
GB0318146D0 (en) * | 2003-08-02 | 2003-09-03 | Zetex Plc | Bipolar transistor with a low saturation voltage |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS507422A (en, 2012) * | 1973-05-18 | 1975-01-25 | ||
JPS5648981B2 (en, 2012) * | 1973-05-25 | 1981-11-19 | ||
US4079402A (en) * | 1973-07-09 | 1978-03-14 | National Semiconductor Corporation | Zener diode incorporating an ion implanted layer establishing the breakdown point below the surface |
JPS5119484A (en) * | 1974-08-09 | 1976-02-16 | Hitachi Ltd | Handotaisochito sonoseizohoho |
JPS5248978A (en) * | 1975-10-17 | 1977-04-19 | Hitachi Ltd | Process for production of semiconductor device |
JPS5278387A (en) * | 1975-12-24 | 1977-07-01 | Fujitsu Ltd | Production of semiconductor device |
JPS52114280A (en) * | 1976-03-22 | 1977-09-24 | Nec Corp | Bipolar type transistor |
US4060427A (en) * | 1976-04-05 | 1977-11-29 | Ibm Corporation | Method of forming an integrated circuit region through the combination of ion implantation and diffusion steps |
US4066473A (en) * | 1976-07-15 | 1978-01-03 | Fairchild Camera And Instrument Corporation | Method of fabricating high-gain transistors |
US4110125A (en) * | 1977-03-03 | 1978-08-29 | International Business Machines Corporation | Method for fabricating semiconductor devices |
US4111726A (en) * | 1977-04-01 | 1978-09-05 | Burroughs Corporation | Bipolar integrated circuit process by separately forming active and inactive base regions |
US4131497A (en) * | 1977-07-12 | 1978-12-26 | International Business Machines Corporation | Method of manufacturing self-aligned semiconductor devices |
US4135954A (en) * | 1977-07-12 | 1979-01-23 | International Business Machines Corporation | Method for fabricating self-aligned semiconductor devices utilizing selectively etchable masking layers |
US4118250A (en) * | 1977-12-30 | 1978-10-03 | International Business Machines Corporation | Process for producing integrated circuit devices by ion implantation |
US4155778A (en) * | 1977-12-30 | 1979-05-22 | International Business Machines Corporation | Forming semiconductor devices having ion implanted and diffused regions |
-
1978
- 1978-11-13 US US05/960,143 patent/US4199380A/en not_active Expired - Lifetime
-
1979
- 1979-11-09 JP JP14533979A patent/JPS5571036A/ja active Granted
- 1979-11-13 NL NL7908310A patent/NL7908310A/nl not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
JPS5571036A (en) | 1980-05-28 |
US4199380A (en) | 1980-04-22 |
JPH0252422B2 (en, 2012) | 1990-11-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A1A | A request for search or an international-type search has been filed | ||
BB | A search report has been drawn up | ||
BC | A request for examination has been filed | ||
A85 | Still pending on 85-01-01 | ||
BV | The patent application has lapsed |