NL7406783A - Werkwijze voor het aanbrengen van een draad- verbinding aan een halfgeleiderinrichting. - Google Patents

Werkwijze voor het aanbrengen van een draad- verbinding aan een halfgeleiderinrichting.

Info

Publication number
NL7406783A
NL7406783A NL7406783A NL7406783A NL7406783A NL 7406783 A NL7406783 A NL 7406783A NL 7406783 A NL7406783 A NL 7406783A NL 7406783 A NL7406783 A NL 7406783A NL 7406783 A NL7406783 A NL 7406783A
Authority
NL
Netherlands
Prior art keywords
welding
wire
ball
tool
discharge
Prior art date
Application number
NL7406783A
Other languages
English (en)
Dutch (nl)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Priority to NL7406783A priority Critical patent/NL7406783A/xx
Priority to IT2343475A priority patent/IT1038208B/it
Priority to GB2084075A priority patent/GB1502965A/en
Priority to DE2522022A priority patent/DE2522022C3/de
Priority to JP5877875A priority patent/JPS5118477A/ja
Priority to FR7515783A priority patent/FR2272491B1/fr
Publication of NL7406783A publication Critical patent/NL7406783A/xx
Priority to HK10/79A priority patent/HK1079A/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5438—Dispositions of bond wires the bond wires having multiple connections on the same bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]

Landscapes

  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
NL7406783A 1974-05-21 1974-05-21 Werkwijze voor het aanbrengen van een draad- verbinding aan een halfgeleiderinrichting. NL7406783A (nl)

Priority Applications (7)

Application Number Priority Date Filing Date Title
NL7406783A NL7406783A (nl) 1974-05-21 1974-05-21 Werkwijze voor het aanbrengen van een draad- verbinding aan een halfgeleiderinrichting.
IT2343475A IT1038208B (it) 1974-05-21 1975-05-16 Metodo per applicare un filo di connessione ad un dispositivo semiconduttore
GB2084075A GB1502965A (en) 1974-05-21 1975-05-16 Provision of wire connections for semiconductor devices
DE2522022A DE2522022C3 (de) 1974-05-21 1975-05-17 Verfahren zum Anbringen einer Drahtverbindung zwischen einer Kontaktstelle auf einer Halbleiteranordnung und einem Zuführungsleiter
JP5877875A JPS5118477A (en) 1974-05-21 1975-05-19 Handotaisochino waiyasetsuzokuhoho
FR7515783A FR2272491B1 (https=) 1974-05-21 1975-05-21
HK10/79A HK1079A (en) 1974-05-21 1979-01-04 Provision of wire connections for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7406783A NL7406783A (nl) 1974-05-21 1974-05-21 Werkwijze voor het aanbrengen van een draad- verbinding aan een halfgeleiderinrichting.

Publications (1)

Publication Number Publication Date
NL7406783A true NL7406783A (nl) 1975-11-25

Family

ID=19821385

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7406783A NL7406783A (nl) 1974-05-21 1974-05-21 Werkwijze voor het aanbrengen van een draad- verbinding aan een halfgeleiderinrichting.

Country Status (7)

Country Link
JP (1) JPS5118477A (https=)
DE (1) DE2522022C3 (https=)
FR (1) FR2272491B1 (https=)
GB (1) GB1502965A (https=)
HK (1) HK1079A (https=)
IT (1) IT1038208B (https=)
NL (1) NL7406783A (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1600021A (en) * 1977-07-26 1981-10-14 Welding Inst Electrical inter-connection method and apparatus
NL8005922A (nl) * 1980-10-29 1982-05-17 Philips Nv Werkwijze voor het vormen van een draadverbinding.
AU569998B2 (en) * 1981-03-27 1988-03-03 Dow Chemical Company, The Process for preparation of diene styrene alpha- methylstyrene block polymers
FR2555813B1 (fr) * 1983-09-28 1986-06-20 Hitachi Ltd Dispositif a semi-conducteurs et procede de fabrication d'un tel dispositif
CH673908A5 (https=) * 1987-05-26 1990-04-12 Vyacheslav Gennadievich Sizov
JPH0614322U (ja) * 1992-07-28 1994-02-22 東洋化学株式会社 合成樹脂製軒樋継手

Also Published As

Publication number Publication date
FR2272491A1 (https=) 1975-12-19
HK1079A (en) 1979-01-12
JPS5118477A (en) 1976-02-14
DE2522022B2 (de) 1979-05-17
IT1038208B (it) 1979-11-20
FR2272491B1 (https=) 1978-10-27
JPS5310427B2 (https=) 1978-04-13
DE2522022C3 (de) 1980-01-10
GB1502965A (en) 1978-03-08
DE2522022A1 (de) 1975-12-11

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Legal Events

Date Code Title Description
BC A request for examination has been filed
BV The patent application has lapsed