NL204333A - - Google Patents

Info

Publication number
NL204333A
NL204333A NL204333DA NL204333A NL 204333 A NL204333 A NL 204333A NL 204333D A NL204333D A NL 204333DA NL 204333 A NL204333 A NL 204333A
Authority
NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication date
Publication of NL204333A publication Critical patent/NL204333A/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/161—Containers comprising no base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/625—Clamping parts not primarily conducting heat
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
NL204333D 1954-01-14 NL204333A (en:Method)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US404086A US2933662A (en) 1954-01-14 1954-01-14 Semiconductor rectifier device
DES42833A DE1000534B (de) 1954-01-14 1955-02-26 Flaechengleichrichter bzw. -transistor
DES43586A DE1017291B (de) 1954-01-14 1955-04-20 Flaechengleichrichter bzw. Transistor
US529304A US2780759A (en) 1954-01-14 1955-08-18 Semiconductor rectifier device

Publications (1)

Publication Number Publication Date
NL204333A true NL204333A (en:Method) 1900-01-01

Family

ID=27437477

Family Applications (3)

Application Number Title Priority Date Filing Date
NL193055D NL193055A (en:Method) 1954-01-14
NL204333D NL204333A (en:Method) 1954-01-14
NL96864D NL96864C (en:Method) 1954-01-14

Family Applications Before (1)

Application Number Title Priority Date Filing Date
NL193055D NL193055A (en:Method) 1954-01-14

Family Applications After (1)

Application Number Title Priority Date Filing Date
NL96864D NL96864C (en:Method) 1954-01-14

Country Status (7)

Country Link
US (2) US2933662A (en:Method)
BE (1) BE534817A (en:Method)
CH (1) CH342660A (en:Method)
DE (2) DE1000534B (en:Method)
FR (1) FR1119805A (en:Method)
GB (2) GB777985A (en:Method)
NL (3) NL96864C (en:Method)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL86185C (en:Method) * 1951-06-08 1900-01-01
GB806596A (en) * 1955-04-01 1958-12-31 Gen Electric Co Ltd Improvements in or relating to semi-conductor devices
NL207356A (en:Method) * 1955-05-23
US2889498A (en) * 1955-11-08 1959-06-02 Westinghouse Electric Corp Semiconductor rectifier assembly
DE1206528B (de) * 1956-07-11 1965-12-09 Bosch Gmbh Robert Verfahren zur Herstellung einer Halbleiter-anordnung aus n-Germanium
US2994017A (en) * 1956-09-07 1961-07-25 Int Rectifier Corp Air-cooled rectifier assembly
DE1087706B (de) * 1956-09-24 1960-08-25 Siemens Ag Flaechengleichrichteranordnung und Verfahren zu ihrer Herstellung
DE1192322C2 (de) * 1956-09-24 1966-01-13 Siemens Ag Verfahren zur Herstellung einer Halbleiteranordnung
GB859849A (en) * 1957-04-03 1961-01-25 Gen Electric Co Ltd Improvements in or relating to semiconductor devices
DE1087707B (de) * 1957-04-18 1960-08-25 Siemens Ag Verfahren zur Herstellung einer Flaechengleichrichter- bzw. Flaechentransistoranordnung und Vorrichtung zur Durchfuehrung dieses Verfahrens
DE1088619B (de) * 1957-04-18 1960-09-08 Siemens Ag Flaechengleichrichter- bzw. Flaechentransistoranordnung und Verfahren und Einrichtung zu ihrer Herstellung
DE1062823B (de) * 1957-07-13 1959-08-06 Telefunken Gmbh Verfahren zur Herstellung von Kristalloden des Legierungstyps
US3007088A (en) * 1957-09-26 1961-10-31 Int Rectifier Corp Rectifier and means for mounting the same
NL231561A (en:Method) * 1957-12-20
US3064178A (en) * 1958-05-19 1962-11-13 Union Carbide Corp Inert-gas arc rectifier
DE1098618B (de) * 1958-07-25 1961-02-02 Telefunken Gmbh Gehaeuse fuer Halbleiteranordnungen kleinster Abmessungen
US2983853A (en) * 1958-10-01 1961-05-09 Raytheon Co Semiconductor assembly structures
US2994121A (en) * 1958-11-21 1961-08-01 Shockley William Method of making a semiconductive switching array
US3025436A (en) * 1959-08-19 1962-03-13 Itt High current rectifier
DE1109794B (de) * 1959-08-22 1961-06-29 Elektronik M B H Verfahren zum Einbau eines Flaechengleichrichterelements in ein luftdicht verschlossenes Gehaeuse
DE1211293B (de) * 1960-05-11 1966-02-24 Ass Elect Ind Halbleiteranordnung mit einem in einen Hohlleiter eingesetzten Halbleiterelement
DE1185728B (de) * 1960-05-18 1965-01-21 Siemens Ag Halbleiteranordnung, insbesondere Flaechengleichrichter oder -transistor mit einem einkristallinen Halbleiterelement
US3068382A (en) * 1960-05-23 1962-12-11 Westinghouse Electric Corp Hermetically sealed semiconductor devices
US3010057A (en) * 1960-09-06 1961-11-21 Westinghouse Electric Corp Semiconductor device
DE1191044B (de) * 1960-12-03 1965-04-15 Siemens Ag Verfahren zur Herstellung von Halbleiteranordnungen, wie Silizium-Flaechengleichrichter, -Transistoren oder Halbleiterstromtore
US3217379A (en) * 1960-12-09 1965-11-16 Texas Instruments Inc Method for forming pn junctions in indium antimonide with special application to infrared detection
US3144501A (en) * 1961-01-19 1964-08-11 Int Rectifier Corp Seal for semiconductor rectifier
DE1248811B (en:Method) * 1961-03-28
DE1263190B (de) * 1961-07-12 1968-03-14 Siemens Ag Halbleiteranordnung mit einem in ein Gehaeuse eingeschlossenen Halbleiterkoerper
DE1277445B (de) * 1961-08-26 1968-09-12 Siemens Ag Isolierter, gasdichter, koaxial zu einem Anschlussbolzen liegender Steuerelektroden-anschluss fuer Halbleiterbauelemente
DE1213924B (de) * 1961-08-30 1966-04-07 Siemens Ag Halbleiterbauelement mit einem in einem Gehaeuse gasdicht eingeschlossenen Halbleiterelement
US3218524A (en) * 1961-10-12 1965-11-16 Westinghouse Electric Corp Semiconductor devices
BE624012A (en:Method) * 1961-10-27
CH397058A (de) * 1962-01-10 1965-08-15 Bbc Brown Boveri & Cie Anordnung für das Anschliessen der Steuerelektrode bei einem steuerbaren Halbleiter-Gleichrichter
DE1248808B (en:Method) * 1962-03-23 1900-01-01
GB1004020A (en) * 1964-04-24 1965-09-08 Standard Telephones Cables Ltd Improvements in or relating to the mounting of electrical components
US3413532A (en) * 1965-02-08 1968-11-26 Westinghouse Electric Corp Compression bonded semiconductor device
NL136731C (en:Method) * 1965-06-23
US3581163A (en) * 1968-04-09 1971-05-25 Gen Electric High-current semiconductor rectifier assemblies
SE350874B (en:Method) * 1970-03-05 1972-11-06 Asea Ab
DE2603813C2 (de) * 1976-02-02 1982-11-18 Brown, Boveri & Cie Ag, 6800 Mannheim Spannvorrichtung für ein thermisch und elektrisch druckkontaktiertes Halbleiterbauelement in Scheibenzellenbauweise
DE2638909A1 (de) * 1976-08-28 1978-03-02 Semikron Gleichrichterbau Halbleiteranordnung
US4161747A (en) * 1978-02-24 1979-07-17 Nasa Shock isolator for operating a diode laser on a closed-cycle refrigerator
US4333101A (en) * 1979-07-19 1982-06-01 Flight Systems, Inc. Semiconductor heat sink mounting assembly
EP0042693B1 (en) * 1980-06-21 1985-03-27 LUCAS INDUSTRIES public limited company Semi-conductor power device assembly and method of manufacture thereof
US4538171A (en) * 1980-10-30 1985-08-27 Cableform Limited High power semiconductor heat sink assembly
JP6464362B2 (ja) * 2017-02-14 2019-02-06 パナソニックＩｐマネジメント株式会社 スクリーン印刷装置及びスクリーン印刷方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE303833C (en:Method) *
US2468051A (en) * 1949-04-26 escoffery
US1751360A (en) * 1924-09-22 1930-03-18 Ruben Rectifier Corp Electric-current rectifier
US1799854A (en) * 1926-10-20 1931-04-07 Levy Lucien Current rectifier
US1728537A (en) * 1927-08-25 1929-09-17 Union Switch & Signal Co Electrical rectifier
US1905703A (en) * 1929-12-12 1933-04-25 Gen Electric Contact rectifier
US2383735A (en) * 1943-04-02 1945-08-28 William A Ray Rectifier
US2441603A (en) * 1943-07-28 1948-05-18 Bell Telephone Labor Inc Electrical translating materials and method of making them
NL171020B (nl) * 1948-12-29 Union Carbide Corp Werkwijze om zure gassen af te scheiden uit een stoom bevattend gasmengsel.
US2662997A (en) * 1951-11-23 1953-12-15 Bell Telephone Labor Inc Mounting for semiconductors
BE525428A (en:Method) * 1952-12-30
BE527420A (en:Method) * 1953-03-20
US2790089A (en) * 1953-03-23 1957-04-23 Nat Aircraft Corp Three-element semi-conductor device
US2734154A (en) * 1953-07-27 1956-02-07 Semiconductor devices
US2781480A (en) * 1953-07-31 1957-02-12 Rca Corp Semiconductor rectifiers
US2720617A (en) * 1953-11-02 1955-10-11 Raytheon Mfg Co Transistor packages
US2861230A (en) * 1953-11-24 1958-11-18 Gen Electric Calorized point contact electrode for semiconductor devices
US2725505A (en) * 1953-11-30 1955-11-29 Rca Corp Semiconductor power devices
US2796563A (en) * 1955-06-10 1957-06-18 Bell Telephone Labor Inc Semiconductive devices

Also Published As

Publication number Publication date
BE534817A (en:Method) 1900-01-01
US2780759A (en) 1957-02-05
GB803295A (en) 1958-10-22
NL193055A (en:Method) 1900-01-01
GB777985A (en) 1957-07-03
DE1000534B (de) 1957-01-10
CH342660A (de) 1959-11-30
NL96864C (en:Method) 1900-01-01
DE1017291B (de) 1957-10-10
FR1119805A (fr) 1956-06-26
US2933662A (en) 1960-04-19

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