NL187461C - Halfgeleiderinrichting. - Google Patents

Halfgeleiderinrichting.

Info

Publication number
NL187461C
NL187461C NLAANVRAGE7604558,A NL7604558A NL187461C NL 187461 C NL187461 C NL 187461C NL 7604558 A NL7604558 A NL 7604558A NL 187461 C NL187461 C NL 187461C
Authority
NL
Netherlands
Prior art keywords
semiconductor device
semiconductor
Prior art date
Application number
NLAANVRAGE7604558,A
Other languages
English (en)
Other versions
NL187461B (nl
NL7604558A (nl
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of NL7604558A publication Critical patent/NL7604558A/nl
Publication of NL187461B publication Critical patent/NL187461B/nl
Application granted granted Critical
Publication of NL187461C publication Critical patent/NL187461C/nl

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/80Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier
    • H01L29/802Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier with heterojunction gate, e.g. transistors with semiconductor layer acting as gate insulating layer, MIS-like transistors
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    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/02109Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02123Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
    • H01L21/02164Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon oxide, e.g. SiO2
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    • H01L21/02205Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
    • H01L21/02208Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si
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    • H01L2924/3011Impedance
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10S148/00Metal treatment
    • Y10S148/113Nitrides of boron or aluminum or gallium
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10S148/122Polycrystalline
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10S438/00Semiconductor device manufacturing: process
    • Y10S438/914Doping
    • Y10S438/918Special or nonstandard dopant

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Bipolar Transistors (AREA)
  • Formation Of Insulating Films (AREA)
  • Junction Field-Effect Transistors (AREA)
NLAANVRAGE7604558,A 1975-04-30 1976-04-28 Halfgeleiderinrichting. NL187461C (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50052731A JPS51128268A (en) 1975-04-30 1975-04-30 Semiconductor unit

Publications (3)

Publication Number Publication Date
NL7604558A NL7604558A (nl) 1976-11-02
NL187461B NL187461B (nl) 1991-05-01
NL187461C true NL187461C (nl) 1991-10-01

Family

ID=12923062

Family Applications (1)

Application Number Title Priority Date Filing Date
NLAANVRAGE7604558,A NL187461C (nl) 1975-04-30 1976-04-28 Halfgeleiderinrichting.

Country Status (7)

Country Link
US (1) US4062034A (nl)
JP (1) JPS51128268A (nl)
CA (1) CA1075373A (nl)
DE (1) DE2618733C2 (nl)
FR (1) FR2309981A1 (nl)
GB (1) GB1542651A (nl)
NL (1) NL187461C (nl)

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7612883A (nl) * 1976-11-19 1978-05-23 Philips Nv Halfgeleiderinrichting, en werkwijze ter ver- vaardiging daarvan.
FR2376513A1 (fr) * 1976-12-31 1978-07-28 Radiotechnique Compelec Dispositif semiconducteur muni d'un film protecteur
DE2730367A1 (de) * 1977-07-05 1979-01-18 Siemens Ag Verfahren zum passivieren von halbleiterelementen
CA1123525A (en) * 1977-10-12 1982-05-11 Stanford R. Ovshinsky High temperature amorphous semiconductor member and method of making same
CA1136773A (en) * 1978-08-14 1982-11-30 Norikazu Ohuchi Semiconductor device
US4289550A (en) * 1979-05-25 1981-09-15 Raytheon Company Method of forming closely spaced device regions utilizing selective etching and diffusion
JPS5619678A (en) * 1979-07-27 1981-02-24 Hitachi Ltd Junction-type field effect semiconductor device
DE3070390D1 (en) * 1979-11-13 1985-05-02 Ibm Process for the formation of the emitter zone of a transistor
IL61678A (en) * 1979-12-13 1984-04-30 Energy Conversion Devices Inc Programmable cell and programmable electronic arrays comprising such cells
EP0035146B1 (en) * 1980-02-15 1988-10-12 Matsushita Electric Industrial Co., Ltd. Semiconductor photoelectric device
JPS5713777A (en) * 1980-06-30 1982-01-23 Shunpei Yamazaki Semiconductor device and manufacture thereof
JPS56124273A (en) * 1980-03-04 1981-09-29 Semiconductor Res Found Semiconductor device
JPS5946103B2 (ja) * 1980-03-10 1984-11-10 日本電信電話株式会社 トランジスタ
JPS6026602Y2 (ja) * 1980-03-19 1985-08-10 ヤンマー農機株式会社 コンバインにおける結束排藁の立体放出装置
JPS56133867A (en) * 1980-03-21 1981-10-20 Semiconductor Res Found Thermoelectric emission transistor
US5859443A (en) * 1980-06-30 1999-01-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US6900463B1 (en) 1980-06-30 2005-05-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
USRE34658E (en) * 1980-06-30 1994-07-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device of non-single crystal-structure
US5262350A (en) * 1980-06-30 1993-11-16 Semiconductor Energy Laboratory Co., Ltd. Forming a non single crystal semiconductor layer by using an electric current
US4803528A (en) * 1980-07-28 1989-02-07 General Electric Company Insulating film having electrically conducting portions
US4499557A (en) * 1980-10-28 1985-02-12 Energy Conversion Devices, Inc. Programmable cell for use in programmable electronic arrays
DE3381606D1 (de) * 1982-02-19 1990-06-28 Hitachi Ltd Transistor mit heterouebergang und verfahren zu dessen herstellung.
AU562641B2 (en) 1983-01-18 1987-06-18 Energy Conversion Devices Inc. Electronic matrix array
GB2141579A (en) * 1983-06-17 1984-12-19 Plessey Co Plc Improvements in bipolar transistors
GB2143083B (en) * 1983-07-06 1987-11-25 Standard Telephones Cables Ltd Semiconductor structures
US4620208A (en) * 1983-11-08 1986-10-28 Energy Conversion Devices, Inc. High performance, small area thin film transistor
WO1985003597A1 (en) * 1984-02-03 1985-08-15 Advanced Micro Devices, Inc. A bipolar transistor with active elements formed in slots
US4672413A (en) * 1984-04-16 1987-06-09 Trw Inc. Barrier emitter transistor
JPS60254657A (ja) * 1984-05-31 1985-12-16 Fujitsu Ltd 半導体装置
GB8410252D0 (en) * 1984-04-19 1984-05-31 Plessey Co Plc Shallow source/drain structures
JPS6124275A (ja) * 1984-07-13 1986-02-01 Res Dev Corp Of Japan バイポ−ラトランジスタ
NL8501769A (nl) * 1984-10-02 1986-05-01 Imec Interuniversitair Micro E Bipolaire heterojunctie-transistor en werkwijze voor de vervaardiging daarvan.
JPS6221694A (ja) * 1985-07-23 1987-01-30 河野 隆志 扛重機械制御装置
GB2180688B (en) * 1985-09-21 1989-09-13 Stc Plc Transistors
JPH0722130B2 (ja) * 1985-11-25 1995-03-08 松下電器産業株式会社 シリコン薄膜およびその作成方法
US4682407A (en) * 1986-01-21 1987-07-28 Motorola, Inc. Means and method for stabilizing polycrystalline semiconductor layers
US4755865A (en) * 1986-01-21 1988-07-05 Motorola Inc. Means for stabilizing polycrystalline semiconductor layers
US5042917A (en) * 1986-04-25 1991-08-27 Matsushita Electric Industrial Co., Ltd. Liquid crystal matrix display unit
US4771326A (en) * 1986-07-09 1988-09-13 Texas Instruments Incorporated Composition double heterojunction transistor
JPH0616556B2 (ja) * 1987-04-14 1994-03-02 株式会社東芝 半導体装置
US4983534A (en) * 1988-01-05 1991-01-08 Nec Corporation Semiconductor device and method of manufacturing the same
JPH01283838A (ja) * 1988-05-10 1989-11-15 Toshiba Corp 半導体装置
US5028973A (en) * 1989-06-19 1991-07-02 Harris Corporation Bipolar transistor with high efficient emitter
GB8926414D0 (en) * 1989-11-18 1990-01-10 Lsi Logic Europ Bipolar junction transistors
US5298455A (en) * 1991-01-30 1994-03-29 Tdk Corporation Method for producing a non-single crystal semiconductor device
EP0501279A1 (en) * 1991-02-28 1992-09-02 Texas Instruments Incorporated Microwave heterojunction bipolar transistors suitable for low-power, low-noise and high-power applications and method for fabricating same
US5446294A (en) * 1991-07-31 1995-08-29 Texas Instruments Incorporated Microwave heterojunction bipolar transistors suitable for low-power, low-noise and high-power applications and method for fabricating same
US5576222A (en) * 1992-01-27 1996-11-19 Tdk Corp. Method of making a semiconductor image sensor device
US5285083A (en) * 1992-04-27 1994-02-08 The University Of British Columbia Inverted heterojunction bipolar device having undoped amorphous silicon layer
US5387813A (en) * 1992-09-25 1995-02-07 National Semiconductor Corporation Transistors with emitters having at least three sides
JPH0851103A (ja) * 1994-08-08 1996-02-20 Fuji Electric Co Ltd 薄膜の生成方法
JP2904341B2 (ja) * 1996-03-06 1999-06-14 日本電気株式会社 半導体装置およびその製造方法
US5930658A (en) * 1996-11-26 1999-07-27 Advanced Micro Devices, Inc. Oxidized oxygen-doped amorphous silicon ultrathin gate oxide structures
WO2002099890A1 (fr) * 2001-06-05 2002-12-12 Sony Corporation Couche semi-conductrice et son procede de formation, et dispositif semi-conducteur et son procede de production

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1184178B (de) * 1960-02-20 1964-12-23 Standard Elektrik Lorenz Ag Verfahren zum Stabilisieren der Oberflaeche von Halbleiterkoerpern mit pn-UEbergaengen durch Vakuumbedampfen
US3443175A (en) * 1967-03-22 1969-05-06 Rca Corp Pn-junction semiconductor with polycrystalline layer on one region
US3460007A (en) * 1967-07-03 1969-08-05 Rca Corp Semiconductor junction device
US3519901A (en) * 1968-01-29 1970-07-07 Texas Instruments Inc Bi-layer insulation structure including polycrystalline semiconductor material for integrated circuit isolation
US3651385A (en) * 1968-09-18 1972-03-21 Sony Corp Semiconductor device including a polycrystalline diode
US3664896A (en) * 1969-07-28 1972-05-23 David M Duncan Deposited silicon diffusion sources
US3611070A (en) * 1970-06-15 1971-10-05 Gen Electric Voltage-variable capacitor with controllably extendible pn junction region
BE792589A (fr) * 1971-10-06 1973-03-30 Ibm Procede d'obtention de structures semiconductrices par implantation d'ions
JPS5314420B2 (nl) * 1973-05-14 1978-05-17
JPS523277B2 (nl) * 1973-05-19 1977-01-27
JPS5824951B2 (ja) * 1974-10-09 1983-05-24 ソニー株式会社 コウガクソウチ
US3961997A (en) * 1975-05-12 1976-06-08 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Fabrication of polycrystalline solar cells on low-cost substrates

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Publication number Publication date
FR2309981A1 (fr) 1976-11-26
JPS51128268A (en) 1976-11-09
NL187461B (nl) 1991-05-01
JPS5637702B2 (nl) 1981-09-02
GB1542651A (en) 1979-03-21
DE2618733A1 (de) 1976-11-11
CA1075373A (en) 1980-04-08
FR2309981B3 (nl) 1980-07-18
NL7604558A (nl) 1976-11-02
DE2618733C2 (de) 1987-03-26
US4062034A (en) 1977-12-06

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