NL187461C - Halfgeleiderinrichting. - Google Patents
Halfgeleiderinrichting.Info
- Publication number
- NL187461C NL187461C NLAANVRAGE7604558,A NL7604558A NL187461C NL 187461 C NL187461 C NL 187461C NL 7604558 A NL7604558 A NL 7604558A NL 187461 C NL187461 C NL 187461C
- Authority
- NL
- Netherlands
- Prior art keywords
- semiconductor device
- semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/80—FETs having rectifying junction gate electrodes
- H10D30/801—FETs having heterojunction gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D10/00—Bipolar junction transistors [BJT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D10/00—Bipolar junction transistors [BJT]
- H10D10/80—Heterojunction BJTs
- H10D10/821—Vertical heterojunction BJTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D10/00—Bipolar junction transistors [BJT]
- H10D10/80—Heterojunction BJTs
- H10D10/821—Vertical heterojunction BJTs
- H10D10/861—Vertical heterojunction BJTs having an emitter region comprising one or more non-monocrystalline elements of Group IV, e.g. amorphous silicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
- H10D62/177—Base regions of bipolar transistors, e.g. BJTs or IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/40—Crystalline structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/82—Heterojunctions
- H10D62/822—Heterojunctions comprising only Group IV materials heterojunctions, e.g. Si/Ge heterojunctions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/602—Heterojunction gate electrodes for FETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/62—Electrodes ohmically coupled to a semiconductor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/40—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00 with at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of IGFETs with BJTs
- H10D84/401—Combinations of FETs or IGBTs with BJTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/24—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
- H10P14/2901—Materials
- H10P14/2902—Materials being Group IVA materials
- H10P14/2905—Silicon, silicon germanium or germanium
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3404—Deposited materials, e.g. layers characterised by the chemical composition being Group IVA materials
- H10P14/3411—Silicon, silicon germanium or germanium
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3438—Doping during depositing
- H10P14/3441—Conductivity type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6326—Deposition processes
- H10P14/6328—Deposition from the gas or vapour phase
- H10P14/6334—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
- H10P14/668—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials
- H10P14/6681—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si
- H10P14/6682—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si the compound being a silane, e.g. disilane, methylsilane or chlorosilane
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
- H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
- H10P14/69215—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material being a silicon oxide, e.g. SiO2
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
- H10W74/137—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being directly on the semiconductor body
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
- H10W74/147—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being multilayered
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/481—Encapsulations, e.g. protective coatings characterised by their materials comprising semiconductor materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/113—Nitrides of boron or aluminum or gallium
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/118—Oxide films
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/122—Polycrystalline
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/914—Doping
- Y10S438/918—Special or nonstandard dopant
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50052731A JPS51128268A (en) | 1975-04-30 | 1975-04-30 | Semiconductor unit |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| NL7604558A NL7604558A (nl) | 1976-11-02 |
| NL187461B NL187461B (nl) | 1991-05-01 |
| NL187461C true NL187461C (nl) | 1991-10-01 |
Family
ID=12923062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NLAANVRAGE7604558,A NL187461C (nl) | 1975-04-30 | 1976-04-28 | Halfgeleiderinrichting. |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US4062034A (nl) |
| JP (1) | JPS51128268A (nl) |
| CA (1) | CA1075373A (nl) |
| DE (1) | DE2618733C2 (nl) |
| FR (1) | FR2309981A1 (nl) |
| GB (1) | GB1542651A (nl) |
| NL (1) | NL187461C (nl) |
Families Citing this family (56)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL7612883A (nl) * | 1976-11-19 | 1978-05-23 | Philips Nv | Halfgeleiderinrichting, en werkwijze ter ver- vaardiging daarvan. |
| FR2376513A1 (fr) * | 1976-12-31 | 1978-07-28 | Radiotechnique Compelec | Dispositif semiconducteur muni d'un film protecteur |
| DE2730367A1 (de) * | 1977-07-05 | 1979-01-18 | Siemens Ag | Verfahren zum passivieren von halbleiterelementen |
| CA1123525A (en) * | 1977-10-12 | 1982-05-11 | Stanford R. Ovshinsky | High temperature amorphous semiconductor member and method of making same |
| CA1136773A (en) * | 1978-08-14 | 1982-11-30 | Norikazu Ohuchi | Semiconductor device |
| US4289550A (en) * | 1979-05-25 | 1981-09-15 | Raytheon Company | Method of forming closely spaced device regions utilizing selective etching and diffusion |
| JPS5619678A (en) * | 1979-07-27 | 1981-02-24 | Hitachi Ltd | Junction-type field effect semiconductor device |
| DE3070390D1 (en) * | 1979-11-13 | 1985-05-02 | Ibm | Process for the formation of the emitter zone of a transistor |
| IL61678A (en) * | 1979-12-13 | 1984-04-30 | Energy Conversion Devices Inc | Programmable cell and programmable electronic arrays comprising such cells |
| DE3176910D1 (en) * | 1980-02-15 | 1988-11-17 | Matsushita Electric Industrial Co Ltd | Semiconductor photoelectric device |
| JPS5713777A (en) * | 1980-06-30 | 1982-01-23 | Shunpei Yamazaki | Semiconductor device and manufacture thereof |
| JPS56124273A (en) * | 1980-03-04 | 1981-09-29 | Semiconductor Res Found | Semiconductor device |
| JPS5946103B2 (ja) * | 1980-03-10 | 1984-11-10 | 日本電信電話株式会社 | トランジスタ |
| JPS6026602Y2 (ja) * | 1980-03-19 | 1985-08-10 | ヤンマー農機株式会社 | コンバインにおける結束排藁の立体放出装置 |
| JPS56133867A (en) * | 1980-03-21 | 1981-10-20 | Semiconductor Res Found | Thermoelectric emission transistor |
| US5262350A (en) * | 1980-06-30 | 1993-11-16 | Semiconductor Energy Laboratory Co., Ltd. | Forming a non single crystal semiconductor layer by using an electric current |
| US6900463B1 (en) | 1980-06-30 | 2005-05-31 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| USRE34658E (en) * | 1980-06-30 | 1994-07-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device of non-single crystal-structure |
| US5859443A (en) * | 1980-06-30 | 1999-01-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US4433469A (en) | 1980-06-30 | 1984-02-28 | Rca Corporation | Method of forming a self aligned aluminum polycrystalline silicon line |
| US4803528A (en) * | 1980-07-28 | 1989-02-07 | General Electric Company | Insulating film having electrically conducting portions |
| US4499557A (en) * | 1980-10-28 | 1985-02-12 | Energy Conversion Devices, Inc. | Programmable cell for use in programmable electronic arrays |
| DE3381606D1 (de) * | 1982-02-19 | 1990-06-28 | Hitachi Ltd | Transistor mit heterouebergang und verfahren zu dessen herstellung. |
| AU562641B2 (en) | 1983-01-18 | 1987-06-18 | Energy Conversion Devices Inc. | Electronic matrix array |
| GB2141579A (en) * | 1983-06-17 | 1984-12-19 | Plessey Co Plc | Improvements in bipolar transistors |
| GB2143083B (en) * | 1983-07-06 | 1987-11-25 | Standard Telephones Cables Ltd | Semiconductor structures |
| US4620208A (en) * | 1983-11-08 | 1986-10-28 | Energy Conversion Devices, Inc. | High performance, small area thin film transistor |
| DE3586341T2 (de) * | 1984-02-03 | 1993-02-04 | Advanced Micro Devices Inc | Bipolartransistor mit in schlitzen gebildeten aktiven elementen. |
| US4672413A (en) * | 1984-04-16 | 1987-06-09 | Trw Inc. | Barrier emitter transistor |
| JPS60254657A (ja) * | 1984-05-31 | 1985-12-16 | Fujitsu Ltd | 半導体装置 |
| GB8410252D0 (en) * | 1984-04-19 | 1984-05-31 | Plessey Co Plc | Shallow source/drain structures |
| JPS6124275A (ja) * | 1984-07-13 | 1986-02-01 | Res Dev Corp Of Japan | バイポ−ラトランジスタ |
| NL8501769A (nl) * | 1984-10-02 | 1986-05-01 | Imec Interuniversitair Micro E | Bipolaire heterojunctie-transistor en werkwijze voor de vervaardiging daarvan. |
| JPS6221694A (ja) * | 1985-07-23 | 1987-01-30 | 河野 隆志 | 扛重機械制御装置 |
| GB2180688B (en) * | 1985-09-21 | 1989-09-13 | Stc Plc | Transistors |
| JPH0722130B2 (ja) * | 1985-11-25 | 1995-03-08 | 松下電器産業株式会社 | シリコン薄膜およびその作成方法 |
| US4682407A (en) * | 1986-01-21 | 1987-07-28 | Motorola, Inc. | Means and method for stabilizing polycrystalline semiconductor layers |
| US4755865A (en) * | 1986-01-21 | 1988-07-05 | Motorola Inc. | Means for stabilizing polycrystalline semiconductor layers |
| US5042917A (en) * | 1986-04-25 | 1991-08-27 | Matsushita Electric Industrial Co., Ltd. | Liquid crystal matrix display unit |
| US4771326A (en) * | 1986-07-09 | 1988-09-13 | Texas Instruments Incorporated | Composition double heterojunction transistor |
| JPH0616556B2 (ja) * | 1987-04-14 | 1994-03-02 | 株式会社東芝 | 半導体装置 |
| US4983534A (en) * | 1988-01-05 | 1991-01-08 | Nec Corporation | Semiconductor device and method of manufacturing the same |
| JPH01283838A (ja) * | 1988-05-10 | 1989-11-15 | Toshiba Corp | 半導体装置 |
| US5028973A (en) * | 1989-06-19 | 1991-07-02 | Harris Corporation | Bipolar transistor with high efficient emitter |
| GB8926414D0 (en) * | 1989-11-18 | 1990-01-10 | Lsi Logic Europ | Bipolar junction transistors |
| US5298455A (en) * | 1991-01-30 | 1994-03-29 | Tdk Corporation | Method for producing a non-single crystal semiconductor device |
| EP0501279A1 (en) * | 1991-02-28 | 1992-09-02 | Texas Instruments Incorporated | Microwave heterojunction bipolar transistors suitable for low-power, low-noise and high-power applications and method for fabricating same |
| US5446294A (en) * | 1991-07-31 | 1995-08-29 | Texas Instruments Incorporated | Microwave heterojunction bipolar transistors suitable for low-power, low-noise and high-power applications and method for fabricating same |
| US5576222A (en) * | 1992-01-27 | 1996-11-19 | Tdk Corp. | Method of making a semiconductor image sensor device |
| US5285083A (en) * | 1992-04-27 | 1994-02-08 | The University Of British Columbia | Inverted heterojunction bipolar device having undoped amorphous silicon layer |
| US5387813A (en) * | 1992-09-25 | 1995-02-07 | National Semiconductor Corporation | Transistors with emitters having at least three sides |
| JPH0851103A (ja) * | 1994-08-08 | 1996-02-20 | Fuji Electric Co Ltd | 薄膜の生成方法 |
| JP2904341B2 (ja) * | 1996-03-06 | 1999-06-14 | 日本電気株式会社 | 半導体装置およびその製造方法 |
| US5930658A (en) * | 1996-11-26 | 1999-07-27 | Advanced Micro Devices, Inc. | Oxidized oxygen-doped amorphous silicon ultrathin gate oxide structures |
| RU2155363C1 (ru) * | 1999-08-24 | 2000-08-27 | Экрам Абульфас оглы Исмиев | Регулятор потока |
| JPWO2002099890A1 (ja) * | 2001-06-05 | 2004-09-24 | ソニー株式会社 | 半導体層及びその形成方法、並びに半導体装置及びその製造方法 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1184178B (de) * | 1960-02-20 | 1964-12-23 | Standard Elektrik Lorenz Ag | Verfahren zum Stabilisieren der Oberflaeche von Halbleiterkoerpern mit pn-UEbergaengen durch Vakuumbedampfen |
| US3443175A (en) * | 1967-03-22 | 1969-05-06 | Rca Corp | Pn-junction semiconductor with polycrystalline layer on one region |
| US3460007A (en) * | 1967-07-03 | 1969-08-05 | Rca Corp | Semiconductor junction device |
| US3519901A (en) * | 1968-01-29 | 1970-07-07 | Texas Instruments Inc | Bi-layer insulation structure including polycrystalline semiconductor material for integrated circuit isolation |
| US3651385A (en) * | 1968-09-18 | 1972-03-21 | Sony Corp | Semiconductor device including a polycrystalline diode |
| US3664896A (en) * | 1969-07-28 | 1972-05-23 | David M Duncan | Deposited silicon diffusion sources |
| US3611070A (en) * | 1970-06-15 | 1971-10-05 | Gen Electric | Voltage-variable capacitor with controllably extendible pn junction region |
| BE792589A (fr) * | 1971-10-06 | 1973-03-30 | Ibm | Procede d'obtention de structures semiconductrices par implantation d'ions |
| JPS5314420B2 (nl) * | 1973-05-14 | 1978-05-17 | ||
| JPS523277B2 (nl) * | 1973-05-19 | 1977-01-27 | ||
| JPS5824951B2 (ja) * | 1974-10-09 | 1983-05-24 | ソニー株式会社 | コウガクソウチ |
| US3961997A (en) * | 1975-05-12 | 1976-06-08 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Fabrication of polycrystalline solar cells on low-cost substrates |
-
1975
- 1975-04-30 JP JP50052731A patent/JPS51128268A/ja active Granted
-
1976
- 1976-04-23 US US05/679,846 patent/US4062034A/en not_active Expired - Lifetime
- 1976-04-26 GB GB7616883A patent/GB1542651A/en not_active Expired
- 1976-04-27 CA CA251,094A patent/CA1075373A/en not_active Expired
- 1976-04-28 NL NLAANVRAGE7604558,A patent/NL187461C/nl not_active IP Right Cessation
- 1976-04-28 DE DE2618733A patent/DE2618733C2/de not_active Expired
- 1976-04-30 FR FR7613053A patent/FR2309981A1/fr active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| NL7604558A (nl) | 1976-11-02 |
| DE2618733A1 (de) | 1976-11-11 |
| JPS5637702B2 (nl) | 1981-09-02 |
| CA1075373A (en) | 1980-04-08 |
| US4062034A (en) | 1977-12-06 |
| FR2309981A1 (fr) | 1976-11-26 |
| DE2618733C2 (de) | 1987-03-26 |
| FR2309981B3 (nl) | 1980-07-18 |
| NL187461B (nl) | 1991-05-01 |
| JPS51128268A (en) | 1976-11-09 |
| GB1542651A (en) | 1979-03-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| NL187461C (nl) | Halfgeleiderinrichting. | |
| NL185884C (nl) | Halfgeleiderinrichting. | |
| NL7500550A (nl) | Halfgeleider-geheugeninrichting. | |
| NL7614537A (nl) | Halfgeleidergeheugeninrichting. | |
| NL7606846A (nl) | Halfgeleiderinrichting. | |
| NL7609320A (nl) | Halfgeleiderinrichting. | |
| NL7604237A (nl) | Halfgeleiderinrichting. | |
| SE410911B (sv) | Halvledaranordning | |
| NL7614249A (nl) | Halfgeleiderinrichting. | |
| NL7614340A (nl) | Plaatsbepalingsinrichting. | |
| NL7604493A (nl) | Bipolaire halfgeleiderinrichting. | |
| NL7611371A (nl) | Ontkrulinrichting. | |
| NL173572C (nl) | Halfgeleiderinrichting. | |
| NL7604238A (nl) | Halfgeleiderinrichting. | |
| NL7602043A (nl) | Opbrenginrichting. | |
| NO143890C (no) | Interferensstroemnings-roereinnretning. | |
| NL7612053A (nl) | Lading-gekoppelde inrichting. | |
| NL7514884A (nl) | Handsorteerinrichting. | |
| NL177364C (nl) | Halfgeleiderinrichting. | |
| NL7614307A (nl) | Halfgeleider inrichting. | |
| SE7606293L (sv) | Halvledaranordning | |
| NL7601784A (nl) | Halfgeleiderinrichting. | |
| NO139704C (no) | Passboltanording. | |
| NL7604289A (nl) | Halfgeleider-inrichting. | |
| ES234713Y (es) | Dispositivo limpia-cristales. |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| BA | A request for search or an international-type search has been filed | ||
| A85 | Still pending on 85-01-01 | ||
| BB | A search report has been drawn up | ||
| BC | A request for examination has been filed | ||
| V1 | Lapsed because of non-payment of the annual fee |