NL185432C - Halfgeleidercondensator, omvattende een halfgeleidersubstraat, voorzien van een elektrodegebied dat zich uitstrekt langs een van groeven voorzien deel van een oppervlak van het halfgeleidersubstraat. - Google Patents
Halfgeleidercondensator, omvattende een halfgeleidersubstraat, voorzien van een elektrodegebied dat zich uitstrekt langs een van groeven voorzien deel van een oppervlak van het halfgeleidersubstraat.Info
- Publication number
- NL185432C NL185432C NL7307686A NL7307686A NL185432C NL 185432 C NL185432 C NL 185432C NL 7307686 A NL7307686 A NL 7307686A NL 7307686 A NL7307686 A NL 7307686A NL 185432 C NL185432 C NL 185432C
- Authority
- NL
- Netherlands
- Prior art keywords
- semiconductor substrate
- semiconductor
- extending along
- electrode area
- area extending
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 3
- 239000000758 substrate Substances 0.000 title 2
- 239000003990 capacitor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/92—Capacitors having potential barriers
- H01L29/94—Metal-insulator-semiconductors, e.g. MOS
- H01L29/945—Trench capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4846—Connecting portions with multiple bonds on the same bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12032—Schottky diode
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Semiconductor Integrated Circuits (AREA)
- Electrodes Of Semiconductors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Semiconductor Memories (AREA)
- Bipolar Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US25933272A | 1972-06-02 | 1972-06-02 |
Publications (3)
Publication Number | Publication Date |
---|---|
NL7307686A NL7307686A (ja) | 1973-12-04 |
NL185432B NL185432B (nl) | 1989-11-01 |
NL185432C true NL185432C (nl) | 1990-04-02 |
Family
ID=22984501
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL7307686A NL185432C (nl) | 1972-06-02 | 1973-06-01 | Halfgeleidercondensator, omvattende een halfgeleidersubstraat, voorzien van een elektrodegebied dat zich uitstrekt langs een van groeven voorzien deel van een oppervlak van het halfgeleidersubstraat. |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS5648976B2 (ja) |
DE (1) | DE2328090A1 (ja) |
GB (1) | GB1439351A (ja) |
NL (1) | NL185432C (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51148385A (en) * | 1975-06-14 | 1976-12-20 | Fujitsu Ltd | Semiconductor memory cell |
JPS583259A (ja) * | 1981-06-29 | 1983-01-10 | Fujitsu Ltd | たて型キヤパシタの製造方法 |
JPS5891669A (ja) * | 1981-11-26 | 1983-05-31 | Seiko Epson Corp | 半導体装置 |
JPS58137242A (ja) * | 1982-02-09 | 1983-08-15 | Seiko Epson Corp | 集積回路装置 |
JPS6012752A (ja) * | 1983-07-01 | 1985-01-23 | Nippon Telegr & Teleph Corp <Ntt> | 半導体記憶装置およびその製造方法 |
JPS6023505B2 (ja) * | 1983-11-21 | 1985-06-07 | 株式会社日立製作所 | 半導体記憶装置 |
JPS6023506B2 (ja) * | 1983-11-21 | 1985-06-07 | 株式会社日立製作所 | 半導体記憶装置 |
JPS6023507B2 (ja) * | 1983-11-21 | 1985-06-07 | 株式会社日立製作所 | 半導体記憶装置 |
JPS60158654A (ja) * | 1984-01-28 | 1985-08-20 | Seiko Epson Corp | 半導体装置 |
JPS6151869A (ja) * | 1984-08-20 | 1986-03-14 | Mitsubishi Electric Corp | 半導体記憶装置およびその製造方法 |
JPS6099549U (ja) * | 1984-10-11 | 1985-07-06 | 日本電気株式会社 | 半導体装置 |
JPS61177767A (ja) * | 1985-01-31 | 1986-08-09 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
JPS61228660A (ja) * | 1985-04-02 | 1986-10-11 | Mitsubishi Electric Corp | 半導体集積回路の製造方法 |
JPH02191370A (ja) * | 1989-12-15 | 1990-07-27 | Seiko Epson Corp | 半導体装置 |
RU2082258C1 (ru) * | 1991-08-14 | 1997-06-20 | Сименс АГ | Схемная структура с по меньшей мере одним конденсатором и способ ее изготовления |
DE19713052A1 (de) * | 1997-03-27 | 1998-10-01 | Siemens Ag | Kondensatorstruktur |
FR2808924B1 (fr) * | 2000-05-09 | 2002-08-16 | Centre Nat Rech Scient | Condenseur a capacite variable |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE635797C (de) * | 1930-07-26 | 1936-09-28 | Hermsdorf Schomburg Isolatoren | Hochspannungskondensator mit einem Dielektrikum aus keramischem Stoff oder Glas |
DE897861C (de) * | 1951-06-29 | 1953-11-26 | Siemens Ag | Elektrischer Durchfuehrungskondensator |
DE1097563B (de) * | 1958-04-26 | 1961-01-19 | Elektroteile G M B H | Zugmagnet fuer Gleich- oder Wechselstrom mit vom Anker angetriebener Zahnstange |
US3149399A (en) * | 1962-09-25 | 1964-09-22 | Sprague Electric Co | Silicon capacitor |
GB1288278A (ja) * | 1968-12-31 | 1972-09-06 | ||
JPS512699Y2 (ja) * | 1971-01-23 | 1976-01-26 |
-
1973
- 1973-05-09 GB GB2203573A patent/GB1439351A/en not_active Expired
- 1973-06-01 NL NL7307686A patent/NL185432C/xx active Search and Examination
- 1973-06-01 JP JP6173973A patent/JPS5648976B2/ja not_active Expired
- 1973-06-01 DE DE19732328090 patent/DE2328090A1/de active Granted
Also Published As
Publication number | Publication date |
---|---|
NL7307686A (ja) | 1973-12-04 |
GB1439351A (en) | 1976-06-16 |
JPS5648976B2 (ja) | 1981-11-19 |
DE2328090A1 (de) | 1973-12-13 |
DE2328090C2 (ja) | 1987-01-22 |
NL185432B (nl) | 1989-11-01 |
JPS4957779A (ja) | 1974-06-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
BA | A request for search or an international-type search has been filed | ||
BB | A search report has been drawn up | ||
BC | A request for examination has been filed | ||
A85 | Still pending on 85-01-01 |