NL185432C - Semiconductor capacitor, comprising a semiconductor substrate, having an electrode area extending along a grooved part of a surface of the semiconductor substrate. - Google Patents
Semiconductor capacitor, comprising a semiconductor substrate, having an electrode area extending along a grooved part of a surface of the semiconductor substrate.Info
- Publication number
- NL185432C NL185432C NL7307686A NL7307686A NL185432C NL 185432 C NL185432 C NL 185432C NL 7307686 A NL7307686 A NL 7307686A NL 7307686 A NL7307686 A NL 7307686A NL 185432 C NL185432 C NL 185432C
- Authority
- NL
- Netherlands
- Prior art keywords
- semiconductor substrate
- semiconductor
- extending along
- electrode area
- area extending
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 3
- 239000000758 substrate Substances 0.000 title 2
- 239000003990 capacitor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/92—Capacitors having potential barriers
- H01L29/94—Metal-insulator-semiconductors, e.g. MOS
- H01L29/945—Trench capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4846—Connecting portions with multiple bonds on the same bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12032—Schottky diode
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Integrated Circuits (AREA)
- Electrodes Of Semiconductors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Semiconductor Memories (AREA)
- Bipolar Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US25933272A | 1972-06-02 | 1972-06-02 |
Publications (3)
Publication Number | Publication Date |
---|---|
NL7307686A NL7307686A (en) | 1973-12-04 |
NL185432B NL185432B (en) | 1989-11-01 |
NL185432C true NL185432C (en) | 1990-04-02 |
Family
ID=22984501
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL7307686A NL185432C (en) | 1972-06-02 | 1973-06-01 | Semiconductor capacitor, comprising a semiconductor substrate, having an electrode area extending along a grooved part of a surface of the semiconductor substrate. |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS5648976B2 (en) |
DE (1) | DE2328090C2 (en) |
GB (1) | GB1439351A (en) |
NL (1) | NL185432C (en) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51148385A (en) * | 1975-06-14 | 1976-12-20 | Fujitsu Ltd | Semiconductor memory cell |
JPS583259A (en) * | 1981-06-29 | 1983-01-10 | Fujitsu Ltd | Manufacture of vertical type capacitor |
JPS5891669A (en) * | 1981-11-26 | 1983-05-31 | Seiko Epson Corp | Semiconductor device |
JPS58137242A (en) * | 1982-02-09 | 1983-08-15 | Seiko Epson Corp | Integrated circuit device |
JPS6012752A (en) * | 1983-07-01 | 1985-01-23 | Nippon Telegr & Teleph Corp <Ntt> | Semiconductor memory device and manufacture thereof |
JPS6023507B2 (en) * | 1983-11-21 | 1985-06-07 | 株式会社日立製作所 | semiconductor storage device |
JPS6023505B2 (en) * | 1983-11-21 | 1985-06-07 | 株式会社日立製作所 | semiconductor storage device |
JPS6023506B2 (en) * | 1983-11-21 | 1985-06-07 | 株式会社日立製作所 | semiconductor storage device |
JPS60158654A (en) * | 1984-01-28 | 1985-08-20 | Seiko Epson Corp | Semiconductor device |
JPS6151869A (en) * | 1984-08-20 | 1986-03-14 | Mitsubishi Electric Corp | Semiconductor memory device and manufacture thereof |
JPS6099549U (en) * | 1984-10-11 | 1985-07-06 | 日本電気株式会社 | semiconductor equipment |
JPS61177767A (en) * | 1985-01-31 | 1986-08-09 | Mitsubishi Electric Corp | Manufacture of semiconductor device |
JPS61228660A (en) * | 1985-04-02 | 1986-10-11 | Mitsubishi Electric Corp | Manufacture of semiconductor integrated circuit |
JPH02191370A (en) * | 1989-12-15 | 1990-07-27 | Seiko Epson Corp | Semiconductor device |
RU2082258C1 (en) * | 1991-08-14 | 1997-06-20 | Сименс АГ | Circuit structure with at least one capacitor and its manufacturing process |
DE19713052A1 (en) * | 1997-03-27 | 1998-10-01 | Siemens Ag | Capacitor structure |
FR2808924B1 (en) * | 2000-05-09 | 2002-08-16 | Centre Nat Rech Scient | VARIABLE CAPACITY CONDENSER |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE635797C (en) * | 1930-07-26 | 1936-09-28 | Hermsdorf Schomburg Isolatoren | High-voltage capacitor with a dielectric made of ceramic material or glass |
DE897861C (en) * | 1951-06-29 | 1953-11-26 | Siemens Ag | Electrical feed-through capacitor |
DE1097563B (en) * | 1958-04-26 | 1961-01-19 | Elektroteile G M B H | Pull magnet for direct or alternating current with a rack driven by the armature |
US3149399A (en) * | 1962-09-25 | 1964-09-22 | Sprague Electric Co | Silicon capacitor |
GB1288278A (en) * | 1968-12-31 | 1972-09-06 | ||
JPS512699Y2 (en) * | 1971-01-23 | 1976-01-26 |
-
1973
- 1973-05-09 GB GB2203573A patent/GB1439351A/en not_active Expired
- 1973-06-01 NL NL7307686A patent/NL185432C/en active Search and Examination
- 1973-06-01 JP JP6173973A patent/JPS5648976B2/ja not_active Expired
- 1973-06-01 DE DE19732328090 patent/DE2328090C2/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
NL7307686A (en) | 1973-12-04 |
JPS5648976B2 (en) | 1981-11-19 |
NL185432B (en) | 1989-11-01 |
DE2328090A1 (en) | 1973-12-13 |
JPS4957779A (en) | 1974-06-05 |
DE2328090C2 (en) | 1987-01-22 |
GB1439351A (en) | 1976-06-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
BA | A request for search or an international-type search has been filed | ||
BB | A search report has been drawn up | ||
BC | A request for examination has been filed | ||
A85 | Still pending on 85-01-01 |