NL153721B - Werkwijze voor het vormen van elektrische verbindingen tussen een drager en een, in een uitsparing van de drager opgenomen halfgeleiderplaatje en voortbrengsel verkregen volgens deze werkwijze. - Google Patents

Werkwijze voor het vormen van elektrische verbindingen tussen een drager en een, in een uitsparing van de drager opgenomen halfgeleiderplaatje en voortbrengsel verkregen volgens deze werkwijze.

Info

Publication number
NL153721B
NL153721B NL666608622A NL6608622A NL153721B NL 153721 B NL153721 B NL 153721B NL 666608622 A NL666608622 A NL 666608622A NL 6608622 A NL6608622 A NL 6608622A NL 153721 B NL153721 B NL 153721B
Authority
NL
Netherlands
Prior art keywords
carrier
procedure
obtained according
electrical connections
forming electrical
Prior art date
Application number
NL666608622A
Other languages
English (en)
Dutch (nl)
Other versions
NL6608622A (xx
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of NL6608622A publication Critical patent/NL6608622A/xx
Publication of NL153721B publication Critical patent/NL153721B/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/241—Disposition
    • H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/24221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/24225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/24227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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    • H01L2224/732—Location after the connecting process
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/05—Etch and refill
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10S148/00—Metal treatment
    • Y10S148/085—Isolated-integrated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4981—Utilizing transitory attached element or associated separate material

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
NL666608622A 1965-06-23 1966-06-22 Werkwijze voor het vormen van elektrische verbindingen tussen een drager en een, in een uitsparing van de drager opgenomen halfgeleiderplaatje en voortbrengsel verkregen volgens deze werkwijze. NL153721B (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US466182A US3325882A (en) 1965-06-23 1965-06-23 Method for forming electrical connections to a solid state device including electrical packaging arrangement therefor

Publications (2)

Publication Number Publication Date
NL6608622A NL6608622A (xx) 1966-12-27
NL153721B true NL153721B (nl) 1977-06-15

Family

ID=23850828

Family Applications (1)

Application Number Title Priority Date Filing Date
NL666608622A NL153721B (nl) 1965-06-23 1966-06-22 Werkwijze voor het vormen van elektrische verbindingen tussen een drager en een, in een uitsparing van de drager opgenomen halfgeleiderplaatje en voortbrengsel verkregen volgens deze werkwijze.

Country Status (7)

Country Link
US (1) US3325882A (xx)
JP (1) JPS512792B1 (xx)
CH (1) CH454985A (xx)
DE (1) DE1640457B1 (xx)
FR (1) FR1483570A (xx)
GB (1) GB1073910A (xx)
NL (1) NL153721B (xx)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3428866A (en) * 1965-06-23 1969-02-18 Ibm Solid state device including electrical packaging arrangement with improved electrical connections
US3433686A (en) * 1966-01-06 1969-03-18 Ibm Process of bonding chips in a substrate recess by epitaxial growth of the bonding material
DE1539692A1 (de) * 1966-06-23 1969-10-16 Blume & Redecker Gmbh Umklebevorrichtung fuer Spulen
US3484534A (en) * 1966-07-29 1969-12-16 Texas Instruments Inc Multilead package for a multilead electrical device
US3461524A (en) * 1966-11-02 1969-08-19 Bell Telephone Labor Inc Method for making closely spaced conductive layers
US3748726A (en) * 1969-09-24 1973-07-31 Siemens Ag Method for mounting semiconductor components
US3753290A (en) * 1971-09-30 1973-08-21 Tektronix Inc Electrical connection members for electronic devices and method of making same
JPS4988563A (xx) * 1972-12-23 1974-08-23
US3964157A (en) * 1974-10-31 1976-06-22 Bell Telephone Laboratories, Incorporated Method of mounting semiconductor chips
JPS52109289U (xx) * 1976-02-16 1977-08-19
US4439918A (en) * 1979-03-12 1984-04-03 Western Electric Co., Inc. Methods of packaging an electronic device
US4251852A (en) * 1979-06-18 1981-02-17 International Business Machines Corporation Integrated circuit package
US5237485A (en) * 1985-04-26 1993-08-17 Sgs Microelettronica S.P.A. Apparatus and method for improved thermal coupling of a semiconductor package to a cooling plate and increased electrical coupling of package leads on more than one side of the package to a circuit board
US4774630A (en) * 1985-09-30 1988-09-27 Microelectronics Center Of North Carolina Apparatus for mounting a semiconductor chip and making electrical connections thereto
US4768077A (en) * 1986-02-20 1988-08-30 Aegis, Inc. Lead frame having non-conductive tie-bar for use in integrated circuit packages
GB2202673B (en) * 1987-03-26 1990-11-14 Haroon Ahmed The semi-conductor fabrication
FR2625067A1 (fr) * 1987-12-22 1989-06-23 Sgs Thomson Microelectronics Procede pour fixer sur un support un composant electronique et ses contacts
USRE35385E (en) * 1988-12-12 1996-12-03 Sgs-Thomson Microelectronics, Sa. Method for fixing an electronic component and its contacts to a support
USRE35578E (en) * 1988-12-12 1997-08-12 Sgs-Thomson Microelectronics, Inc. Method to install an electronic component and its electrical connections on a support, and product obtained thereby
JPH02306690A (ja) * 1989-05-22 1990-12-20 Toshiba Corp 表面実装用配線基板の製造方法
US5605863A (en) * 1990-08-31 1997-02-25 Texas Instruments Incorporated Device packaging using heat spreaders and assisted deposition of wire bonds
DE19914718B4 (de) * 1999-03-31 2006-04-13 Siemens Ag Verfahren zum gleichzeitigen Herstellen einer Mehrzahl von Leuchtdiodenelementen mit integrierten Kontakten
DE19964471B4 (de) * 1999-03-31 2013-02-21 Osram Ag Leuchtdiode und Verfahren zur Herstellung einer Mehrzahl von Leuchtdioden
US6882044B2 (en) * 2002-05-17 2005-04-19 Agilent Technologies, Inc. High speed electronic interconnection using a detachable substrate
US7343758B1 (en) * 2004-08-09 2008-03-18 Continental Carbonic Products, Inc. Dry ice compaction method
DE102006009723A1 (de) * 2006-03-02 2007-09-06 Siemens Ag Verfahren zum Herstellen und planaren Kontaktieren einer elektronischen Vorrichtung und entsprechend hergestellte Vorrichtung
CN102835193A (zh) * 2010-04-15 2012-12-19 古河电气工业株式会社 基板以及基板的制造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3169892A (en) * 1959-04-08 1965-02-16 Jerome H Lemelson Method of making a multi-layer electrical circuit
US3098951A (en) * 1959-10-29 1963-07-23 Sippican Corp Weldable circuit cards
US3235428A (en) * 1963-04-10 1966-02-15 Bell Telephone Labor Inc Method of making integrated semiconductor devices

Also Published As

Publication number Publication date
FR1483570A (xx) 1967-09-06
NL6608622A (xx) 1966-12-27
CH454985A (de) 1968-04-30
US3325882A (en) 1967-06-20
JPS512792B1 (xx) 1976-01-28
DE1640457B1 (de) 1970-10-29
GB1073910A (en) 1967-06-28

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