NL1035095A1 - Multi-bundel afbuiger-array-inrichting voor maskerloze deeltjesbundel verwerking. - Google Patents

Multi-bundel afbuiger-array-inrichting voor maskerloze deeltjesbundel verwerking.

Info

Publication number
NL1035095A1
NL1035095A1 NL1035095A NL1035095A NL1035095A1 NL 1035095 A1 NL1035095 A1 NL 1035095A1 NL 1035095 A NL1035095 A NL 1035095A NL 1035095 A NL1035095 A NL 1035095A NL 1035095 A1 NL1035095 A1 NL 1035095A1
Authority
NL
Netherlands
Prior art keywords
particle beam
array device
beam processing
deflector array
maskless particle
Prior art date
Application number
NL1035095A
Other languages
English (en)
Other versions
NL1035095C2 (nl
Inventor
Elmar Platzgummer
Hans Loeschner
Samuel Kvasnica
Reinhard Springer
Mathias Irmscher
Florian Letzkus
Joerg Butschke
Original Assignee
Ims Nanofabrication Ag
Inst Für Mikroelektronik Stutt
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ims Nanofabrication Ag, Inst Für Mikroelektronik Stutt filed Critical Ims Nanofabrication Ag
Publication of NL1035095A1 publication Critical patent/NL1035095A1/nl
Application granted granted Critical
Publication of NL1035095C2 publication Critical patent/NL1035095C2/nl

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/20—Masks or mask blanks for imaging by charged particle beam [CPB] radiation, e.g. by electron beam; Preparation thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/045—Beam blanking or chopping, i.e. arrangements for momentarily interrupting exposure to the discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
    • H01J37/3177—Multi-beam, e.g. fly's eye, comb probe
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/04—Means for controlling the discharge
    • H01J2237/043—Beam blanking
    • H01J2237/0435—Multi-aperture
    • H01J2237/0437—Semiconductor substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Electron Beam Exposure (AREA)
NL1035095A 2007-02-28 2008-02-27 Multi-bundel afbuiger-array-inrichting voor maskerloze deeltjesbundel verwerking. NL1035095C2 (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
AT3112007 2007-02-28
AT3112007 2007-02-28

Publications (2)

Publication Number Publication Date
NL1035095A1 true NL1035095A1 (nl) 2008-09-01
NL1035095C2 NL1035095C2 (nl) 2010-06-15

Family

ID=39670320

Family Applications (1)

Application Number Title Priority Date Filing Date
NL1035095A NL1035095C2 (nl) 2007-02-28 2008-02-27 Multi-bundel afbuiger-array-inrichting voor maskerloze deeltjesbundel verwerking.

Country Status (4)

Country Link
US (1) US7687783B2 (nl)
JP (1) JP5422131B2 (nl)
DE (1) DE102008010123A1 (nl)
NL (1) NL1035095C2 (nl)

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DE102008010123A1 (de) * 2007-02-28 2008-09-04 Ims Nanofabrication Ag Vielstrahl-Ablenkarray-Einrichtung für maskenlose Teilchenstrahl-Bearbeitung
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CN101604036B (zh) * 2008-06-10 2012-07-18 鸿富锦精密工业（深圳）有限公司 光圈及其制作方法
US8198601B2 (en) * 2009-01-28 2012-06-12 Ims Nanofabrication Ag Method for producing a multi-beam deflector array device having electrodes
EP2228817B1 (en) * 2009-03-09 2012-07-18 IMS Nanofabrication AG Global point spreading function in multi-beam patterning
EP2251893B1 (en) * 2009-05-14 2014-10-29 IMS Nanofabrication AG Multi-beam deflector array means with bonded electrodes
NL2005584C2 (en) * 2009-10-26 2014-09-04 Mapper Lithography Ip Bv Charged particle multi-beamlet lithography system with modulation device.
US8138068B2 (en) * 2010-08-11 2012-03-20 International Business Machines Corporation Method to form nanopore array
JP5253532B2 (ja) * 2011-03-01 2013-07-31 キヤノン株式会社 偏向器アレイ、偏向器アレイの製造方法、描画装置、および物品の製造方法
EP2757571B1 (en) * 2013-01-17 2017-09-20 IMS Nanofabrication AG High-voltage insulation device for charged-particle optical apparatus
JP2015023286A (ja) 2013-07-17 2015-02-02 アイエムエス ナノファブリケーション アーゲー 複数のブランキングアレイを有するパターン画定装置
EP2830083B1 (en) 2013-07-25 2016-05-04 IMS Nanofabrication AG Method for charged-particle multi-beam exposure
US20150069260A1 (en) 2013-09-11 2015-03-12 Ims Nanofabrication Ag Charged-particle multi-beam apparatus having correction plate
EP2913838B1 (en) 2014-02-28 2018-09-19 IMS Nanofabrication GmbH Compensation of defective beamlets in a charged-particle multi-beam exposure tool
US9443699B2 (en) 2014-04-25 2016-09-13 Ims Nanofabrication Ag Multi-beam tool for cutting patterns
EP3358599B1 (en) 2014-05-30 2021-01-27 IMS Nanofabrication GmbH Compensation of dose inhomogeneity using row calibration
JP6890373B2 (ja) 2014-07-10 2021-06-18 アイエムエス ナノファブリケーション ゲーエムベーハー 畳み込みカーネルを使用する粒子ビーム描画機における結像偏向の補償
US9390891B2 (en) 2014-08-15 2016-07-12 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus for charged particle lithography system
JP6553973B2 (ja) * 2014-09-01 2019-07-31 株式会社ニューフレアテクノロジー マルチ荷電粒子ビーム用のブランキング装置及びマルチ荷電粒子ビーム描画装置
US9330881B2 (en) * 2014-09-01 2016-05-03 Nuflare Technology, Inc. Blanking device for multi charged particle beams, and multi charged particle beam writing apparatus
US9568907B2 (en) 2014-09-05 2017-02-14 Ims Nanofabrication Ag Correction of short-range dislocations in a multi-beam writer
JP6500383B2 (ja) * 2014-10-03 2019-04-17 株式会社ニューフレアテクノロジー ブランキングアパーチャアレイ及び荷電粒子ビーム描画装置
JP5816739B1 (ja) * 2014-12-02 2015-11-18 株式会社ニューフレアテクノロジー マルチビームのブランキングアパーチャアレイ装置、及びマルチビームのブランキングアパーチャアレイ装置の製造方法
US9653263B2 (en) 2015-03-17 2017-05-16 Ims Nanofabrication Ag Multi-beam writing of pattern areas of relaxed critical dimension
EP3096342B1 (en) 2015-03-18 2017-09-20 IMS Nanofabrication AG Bi-directional double-pass multi-beam writing
US10410831B2 (en) 2015-05-12 2019-09-10 Ims Nanofabrication Gmbh Multi-beam writing using inclined exposure stripes
US10325756B2 (en) 2016-06-13 2019-06-18 Ims Nanofabrication Gmbh Method for compensating pattern placement errors caused by variation of pattern exposure density in a multi-beam writer
US10325757B2 (en) 2017-01-27 2019-06-18 Ims Nanofabrication Gmbh Advanced dose-level quantization of multibeam-writers
US10840056B2 (en) * 2017-02-03 2020-11-17 Kla Corporation Multi-column scanning electron microscopy system
JP6772962B2 (ja) 2017-06-02 2020-10-21 株式会社ニューフレアテクノロジー マルチ荷電粒子ビーム描画装置及びマルチ荷電粒子ビーム描画方法
US10522329B2 (en) 2017-08-25 2019-12-31 Ims Nanofabrication Gmbh Dose-related feature reshaping in an exposure pattern to be exposed in a multi beam writing apparatus
US11569064B2 (en) 2017-09-18 2023-01-31 Ims Nanofabrication Gmbh Method for irradiating a target using restricted placement grids
US10651010B2 (en) 2018-01-09 2020-05-12 Ims Nanofabrication Gmbh Non-linear dose- and blur-dependent edge placement correction
US10840054B2 (en) 2018-01-30 2020-11-17 Ims Nanofabrication Gmbh Charged-particle source and method for cleaning a charged-particle source using back-sputtering
US11099482B2 (en) 2019-05-03 2021-08-24 Ims Nanofabrication Gmbh Adapting the duration of exposure slots in multi-beam writers
US11120965B2 (en) * 2019-12-04 2021-09-14 ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH Beam blanking device for a multi-beamlet charged particle beam apparatus
JP7359050B2 (ja) * 2020-03-18 2023-10-11 株式会社ニューフレアテクノロジー マルチビーム用のブランキング装置及びマルチ荷電粒子ビーム描画装置
KR20210132599A (ko) 2020-04-24 2021-11-04 아이엠에스 나노패브릭케이션 게엠베하 대전 입자 소스
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WO2023018496A1 (en) 2021-08-08 2023-02-16 ViaMEMS Technologies, Inc. Electrostatic devices to influence beams of charged particles

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Also Published As

Publication number Publication date
US20080203317A1 (en) 2008-08-28
NL1035095C2 (nl) 2010-06-15
DE102008010123A1 (de) 2008-09-04
JP5422131B2 (ja) 2014-02-19
US7687783B2 (en) 2010-03-30
JP2008235266A (ja) 2008-10-02

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Legal Events

Date Code Title Description
AD1A A request for search or an international type search has been filed
PD Change of ownership

Owner name: INSTITUT FUER MIKROELEKTRONIK STUTTGART; DE

Free format text: DETAILS ASSIGNMENT: CHANGE OF OWNER(S), CHANGE OF LEGAL ENTITY; FORMER OWNER NAME: INSTITUT FUER MIKROELEKTRONIK STUTTGART

Effective date: 20171214