NL1028588C2 - Werkwijze en inrichting voor het separeren van producten met een gecontroleerde snederand en gesepareerd product. - Google Patents

Werkwijze en inrichting voor het separeren van producten met een gecontroleerde snederand en gesepareerd product. Download PDF

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Publication number
NL1028588C2
NL1028588C2 NL1028588A NL1028588A NL1028588C2 NL 1028588 C2 NL1028588 C2 NL 1028588C2 NL 1028588 A NL1028588 A NL 1028588A NL 1028588 A NL1028588 A NL 1028588A NL 1028588 C2 NL1028588 C2 NL 1028588C2
Authority
NL
Netherlands
Prior art keywords
laser beam
laser
product
cut
cut edge
Prior art date
Application number
NL1028588A
Other languages
English (en)
Dutch (nl)
Inventor
Joannes Leonardus Jurrian Zijl
Henri Joseph Van Egmond
Original Assignee
Fico Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico Bv filed Critical Fico Bv
Priority to NL1028588A priority Critical patent/NL1028588C2/nl
Priority to TW095109431A priority patent/TWI465310B/zh
Priority to CN2006800092257A priority patent/CN101147241B/zh
Priority to EP06716694A priority patent/EP1905067A1/en
Priority to PCT/NL2006/050061 priority patent/WO2006118454A1/en
Priority to JP2008502936A priority patent/JP2008537511A/ja
Priority to KR1020077024212A priority patent/KR20070121793A/ko
Application granted granted Critical
Publication of NL1028588C2 publication Critical patent/NL1028588C2/nl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/3568—Modifying rugosity
    • B23K26/3576—Diminishing rugosity, e.g. grinding; Polishing; Smoothing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/08—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for flash removal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
NL1028588A 2005-03-22 2005-03-22 Werkwijze en inrichting voor het separeren van producten met een gecontroleerde snederand en gesepareerd product. NL1028588C2 (nl)

Priority Applications (7)

Application Number Priority Date Filing Date Title
NL1028588A NL1028588C2 (nl) 2005-03-22 2005-03-22 Werkwijze en inrichting voor het separeren van producten met een gecontroleerde snederand en gesepareerd product.
TW095109431A TWI465310B (zh) 2005-03-22 2006-03-20 以受控切割刃分離產品的方法和裝置，以及分離的產品
CN2006800092257A CN101147241B (zh) 2005-03-22 2006-03-21 用于分离具有可控切割边产品的方法和设备及分离的产品
EP06716694A EP1905067A1 (en) 2005-03-22 2006-03-21 Method and device for separating products with a controlled cut edge, and separated product
PCT/NL2006/050061 WO2006118454A1 (en) 2005-03-22 2006-03-21 Method and device for separating products with a controlled cut edge, and separated product
JP2008502936A JP2008537511A (ja) 2005-03-22 2006-03-21 制御された切断端面（ｃｕｔｅｄｇｅ）で製品（ｐｒｏｄｕｃｔ）を分離する方法および装置、並びにこれにより分離された製品
KR1020077024212A KR20070121793A (ko) 2005-03-22 2006-03-21 제어된 절단 에지를 갖는 제품을 분리하는 방법 및 장치와,이와 같이 분리되는 제품

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1028588A NL1028588C2 (nl) 2005-03-22 2005-03-22 Werkwijze en inrichting voor het separeren van producten met een gecontroleerde snederand en gesepareerd product.
NL1028588 2005-03-22

Publications (1)

Publication Number Publication Date
NL1028588C2 true NL1028588C2 (nl) 2006-09-25

Family

ID=35453332

Family Applications (1)

Application Number Title Priority Date Filing Date
NL1028588A NL1028588C2 (nl) 2005-03-22 2005-03-22 Werkwijze en inrichting voor het separeren van producten met een gecontroleerde snederand en gesepareerd product.

Country Status (7)

Country Link
EP (1) EP1905067A1 (ja)
JP (1) JP2008537511A (ja)
KR (1) KR20070121793A (ja)
CN (1) CN101147241B (ja)
NL (1) NL1028588C2 (ja)
TW (1) TWI465310B (ja)
WO (1) WO2006118454A1 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102473651B (zh) * 2009-07-06 2014-12-17 瑞萨电子株式会社 半导体器件的制造方法
CN107148324A (zh) * 2014-08-28 2017-09-08 Ipg光子公司 用于切割和切割后加工硬质电介质材料的多激光器系统和方法
CN106346143B (zh) * 2016-11-24 2018-05-25 武汉华星光电技术有限公司 一种激光切割机及其切割方法
SI25748A (sl) * 2018-12-07 2020-06-30 Intech-Les, Razvojni Center D.O.O. Izboljšanje hrapavosti površine s laserjem
EP3685954B1 (en) * 2019-01-22 2024-01-24 Synova S.A. Method for cutting a workpiece with a complex fluid-jet-guided laser beam
CN113646124B (zh) * 2019-02-25 2022-09-27 Ws光学技术有限责任公司 用于射束加工板状或管状工件的方法
CN114173982B (zh) * 2019-07-29 2023-08-11 Ws光学技术有限责任公司 用于射束加工板状或管状工件的方法
CN113199149B (zh) * 2020-01-15 2023-08-11 大族激光科技产业集团股份有限公司 激光去除镀层的加工工艺
CN112404745A (zh) * 2020-11-02 2021-02-26 中国航空工业集团公司北京长城航空测控技术研究所 一种薄片晶体器件切割面的超快激光平整方法

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3626143A (en) * 1969-04-02 1971-12-07 American Can Co Scoring of materials with laser energy
US5368900A (en) * 1991-11-04 1994-11-29 Motorola, Inc. Multistep laser ablation method for making optical waveguide reflector
US5922224A (en) * 1996-02-09 1999-07-13 U.S. Philips Corporation Laser separation of semiconductor elements formed in a wafer of semiconductor material
KR20010054662A (ko) * 1999-12-07 2001-07-02 윤종용 레이저 커팅 장치
US6413839B1 (en) * 1998-10-23 2002-07-02 Emcore Corporation Semiconductor device separation using a patterned laser projection
US20020086544A1 (en) * 2000-12-15 2002-07-04 Adrian Boyle Laser machining of semiconductor materials
US6420678B1 (en) * 1998-12-01 2002-07-16 Brian L. Hoekstra Method for separating non-metallic substrates
US20020125232A1 (en) * 1998-08-26 2002-09-12 Choo Dae-Ho Laser cutting apparatus and method
US20030047545A1 (en) * 2000-04-11 2003-03-13 Mckee Terry Method for laser drilling
WO2003049155A1 (en) * 2001-11-30 2003-06-12 Positive Light, Inc. System and method for laser micro- machining

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU6178200A (en) * 1999-08-03 2001-02-19 Xsil Technology Limited A circuit singulation system and method

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3626143A (en) * 1969-04-02 1971-12-07 American Can Co Scoring of materials with laser energy
US5368900A (en) * 1991-11-04 1994-11-29 Motorola, Inc. Multistep laser ablation method for making optical waveguide reflector
US5922224A (en) * 1996-02-09 1999-07-13 U.S. Philips Corporation Laser separation of semiconductor elements formed in a wafer of semiconductor material
US20020125232A1 (en) * 1998-08-26 2002-09-12 Choo Dae-Ho Laser cutting apparatus and method
US6413839B1 (en) * 1998-10-23 2002-07-02 Emcore Corporation Semiconductor device separation using a patterned laser projection
US6420678B1 (en) * 1998-12-01 2002-07-16 Brian L. Hoekstra Method for separating non-metallic substrates
KR20010054662A (ko) * 1999-12-07 2001-07-02 윤종용 레이저 커팅 장치
US20030047545A1 (en) * 2000-04-11 2003-03-13 Mckee Terry Method for laser drilling
US20020086544A1 (en) * 2000-12-15 2002-07-04 Adrian Boyle Laser machining of semiconductor materials
WO2003049155A1 (en) * 2001-11-30 2003-06-12 Positive Light, Inc. System and method for laser micro- machining

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Section Ch Week 200210, Derwent World Patents Index; Class L01, AN 2002-072797, XP002359270 *

Also Published As

Publication number Publication date
TWI465310B (zh) 2014-12-21
CN101147241B (zh) 2011-01-12
EP1905067A1 (en) 2008-04-02
CN101147241A (zh) 2008-03-19
WO2006118454A1 (en) 2006-11-09
KR20070121793A (ko) 2007-12-27
TW200633809A (en) 2006-10-01
JP2008537511A (ja) 2008-09-18

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Effective date: 20160401