KR20070121793A - 제어된 절단 에지를 갖는 제품을 분리하는 방법 및 장치와,이와 같이 분리되는 제품 - Google Patents

제어된 절단 에지를 갖는 제품을 분리하는 방법 및 장치와,이와 같이 분리되는 제품 Download PDF

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Publication number
KR20070121793A
KR20070121793A KR1020077024212A KR20077024212A KR20070121793A KR 20070121793 A KR20070121793 A KR 20070121793A KR 1020077024212 A KR1020077024212 A KR 1020077024212A KR 20077024212 A KR20077024212 A KR 20077024212A KR 20070121793 A KR20070121793 A KR 20070121793A
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KR
South Korea
Prior art keywords
laser beam
laser
product
cutting
article
Prior art date
Application number
KR1020077024212A
Other languages
English (en)
Korean (ko)
Inventor
에그몬드 헨리 조셉 반
조한네스 레오나르더스 주리안 지즐
Original Assignee
피코 비. 브이.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 피코 비. 브이. filed Critical 피코 비. 브이.
Publication of KR20070121793A publication Critical patent/KR20070121793A/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/3568—Modifying rugosity
    • B23K26/3576—Diminishing rugosity, e.g. grinding; Polishing; Smoothing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/08—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for flash removal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR1020077024212A 2005-03-22 2006-03-21 제어된 절단 에지를 갖는 제품을 분리하는 방법 및 장치와,이와 같이 분리되는 제품 KR20070121793A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1028588 2005-03-22
NL1028588A NL1028588C2 (nl) 2005-03-22 2005-03-22 Werkwijze en inrichting voor het separeren van producten met een gecontroleerde snederand en gesepareerd product.

Publications (1)

Publication Number Publication Date
KR20070121793A true KR20070121793A (ko) 2007-12-27

Family

ID=35453332

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077024212A KR20070121793A (ko) 2005-03-22 2006-03-21 제어된 절단 에지를 갖는 제품을 분리하는 방법 및 장치와,이와 같이 분리되는 제품

Country Status (7)

Country Link
EP (1) EP1905067A1 (ja)
JP (1) JP2008537511A (ja)
KR (1) KR20070121793A (ja)
CN (1) CN101147241B (ja)
NL (1) NL1028588C2 (ja)
TW (1) TWI465310B (ja)
WO (1) WO2006118454A1 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9087850B2 (en) 2009-07-06 2015-07-21 Renesas Electronics Corporation Method for manufacturing semiconductor device
CN107148324A (zh) * 2014-08-28 2017-09-08 Ipg光子公司 用于切割和切割后加工硬质电介质材料的多激光器系统和方法
CN106346143B (zh) * 2016-11-24 2018-05-25 武汉华星光电技术有限公司 一种激光切割机及其切割方法
SI25748A (sl) * 2018-12-07 2020-06-30 Intech-Les, Razvojni Center D.O.O. Izboljšanje hrapavosti površine s laserjem
EP3685954B1 (en) * 2019-01-22 2024-01-24 Synova S.A. Method for cutting a workpiece with a complex fluid-jet-guided laser beam
WO2020173970A1 (de) * 2019-02-25 2020-09-03 Wsoptics Technologies Gmbh Prozess zur strahlbearbeitung eines platten- oder rohrförmigen werkstücks
CN114173982B (zh) * 2019-07-29 2023-08-11 Ws光学技术有限责任公司 用于射束加工板状或管状工件的方法
CN113199149B (zh) * 2020-01-15 2023-08-11 大族激光科技产业集团股份有限公司 激光去除镀层的加工工艺
CN112404745A (zh) * 2020-11-02 2021-02-26 中国航空工业集团公司北京长城航空测控技术研究所 一种薄片晶体器件切割面的超快激光平整方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3626143A (en) * 1969-04-02 1971-12-07 American Can Co Scoring of materials with laser energy
US5368900A (en) * 1991-11-04 1994-11-29 Motorola, Inc. Multistep laser ablation method for making optical waveguide reflector
EP0820640B1 (en) * 1996-02-09 2011-07-13 Advanced Laser Separation International (ALSI) B.V. Laser separation of semiconductor elements formed in a wafer of semiconductor material
JP4396953B2 (ja) * 1998-08-26 2010-01-13 三星電子株式会社 レーザ切断装置および切断方法
US6413839B1 (en) * 1998-10-23 2002-07-02 Emcore Corporation Semiconductor device separation using a patterned laser projection
US6420678B1 (en) * 1998-12-01 2002-07-16 Brian L. Hoekstra Method for separating non-metallic substrates
WO2001010177A1 (en) * 1999-08-03 2001-02-08 Xsil Technology Limited A circuit singulation system and method
KR100634750B1 (ko) * 1999-12-07 2006-10-16 삼성전자주식회사 레이저 커팅 장치
WO2001076808A2 (en) * 2000-04-11 2001-10-18 Gsi Lumonics Inc. A method and system for laser drilling
EP1341638B1 (en) * 2000-12-15 2006-02-01 Xsil Technology Limited Laser machining of semiconductor materials
US6677552B1 (en) * 2001-11-30 2004-01-13 Positive Light, Inc. System and method for laser micro-machining

Also Published As

Publication number Publication date
CN101147241B (zh) 2011-01-12
NL1028588C2 (nl) 2006-09-25
CN101147241A (zh) 2008-03-19
JP2008537511A (ja) 2008-09-18
TWI465310B (zh) 2014-12-21
EP1905067A1 (en) 2008-04-02
TW200633809A (en) 2006-10-01
WO2006118454A1 (en) 2006-11-09

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