TWI465310B - 以受控切割刃分離產品的方法和裝置，以及分離的產品 - Google Patents

以受控切割刃分離產品的方法和裝置，以及分離的產品 Download PDF

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Publication number
TWI465310B
TWI465310B TW095109431A TW95109431A TWI465310B TW I465310 B TWI465310 B TW I465310B TW 095109431 A TW095109431 A TW 095109431A TW 95109431 A TW95109431 A TW 95109431A TW I465310 B TWI465310 B TW I465310B
Authority
TW
Taiwan
Prior art keywords
laser beam
product
laser
relative
carrier
Prior art date
Application number
TW095109431A
Other languages
English (en)
Chinese (zh)
Other versions
TW200633809A (en
Inventor
Egmond Henri Joseph Va
Joannes Leonardus Jurrian Zijl
Original Assignee
Besi Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Besi Netherlands Bv filed Critical Besi Netherlands Bv
Publication of TW200633809A publication Critical patent/TW200633809A/zh
Application granted granted Critical
Publication of TWI465310B publication Critical patent/TWI465310B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/3568—Modifying rugosity
    • B23K26/3576—Diminishing rugosity, e.g. grinding; Polishing; Smoothing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/08—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for flash removal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW095109431A 2005-03-22 2006-03-20 以受控切割刃分離產品的方法和裝置，以及分離的產品 TWI465310B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL1028588A NL1028588C2 (nl) 2005-03-22 2005-03-22 Werkwijze en inrichting voor het separeren van producten met een gecontroleerde snederand en gesepareerd product.

Publications (2)

Publication Number Publication Date
TW200633809A TW200633809A (en) 2006-10-01
TWI465310B true TWI465310B (zh) 2014-12-21

Family

ID=35453332

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095109431A TWI465310B (zh) 2005-03-22 2006-03-20 以受控切割刃分離產品的方法和裝置，以及分離的產品

Country Status (7)

Country Link
EP (1) EP1905067A1 (ja)
JP (1) JP2008537511A (ja)
KR (1) KR20070121793A (ja)
CN (1) CN101147241B (ja)
NL (1) NL1028588C2 (ja)
TW (1) TWI465310B (ja)
WO (1) WO2006118454A1 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102473651B (zh) 2009-07-06 2014-12-17 瑞萨电子株式会社 半导体器件的制造方法
CN114603249A (zh) * 2014-08-28 2022-06-10 Ipg光子公司 用于切割和切割后加工硬质电介质材料的多激光器系统和方法
CN106346143B (zh) * 2016-11-24 2018-05-25 武汉华星光电技术有限公司 一种激光切割机及其切割方法
SI25748A (sl) * 2018-12-07 2020-06-30 Intech-Les, Razvojni Center D.O.O. Izboljšanje hrapavosti površine s laserjem
EP3685954B1 (en) * 2019-01-22 2024-01-24 Synova S.A. Method for cutting a workpiece with a complex fluid-jet-guided laser beam
EP3914418B1 (de) * 2019-02-25 2022-02-23 Wsoptics Technologies GmbH Prozess zur strahlbearbeitung eines platten- oder rohrförmigen werkstücks
WO2021018431A1 (de) * 2019-07-29 2021-02-04 Wsoptics Technologies Gmbh Prozess zur strahlbearbeitung eines platten- oder rohrförmigen werkstücks
CN113199149B (zh) * 2020-01-15 2023-08-11 大族激光科技产业集团股份有限公司 激光去除镀层的加工工艺
CN112404745A (zh) * 2020-11-02 2021-02-26 中国航空工业集团公司北京长城航空测控技术研究所 一种薄片晶体器件切割面的超快激光平整方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6413839B1 (en) * 1998-10-23 2002-07-02 Emcore Corporation Semiconductor device separation using a patterned laser projection
US20020086544A1 (en) * 2000-12-15 2002-07-04 Adrian Boyle Laser machining of semiconductor materials
US20030047545A1 (en) * 2000-04-11 2003-03-13 Mckee Terry Method for laser drilling

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3626143A (en) * 1969-04-02 1971-12-07 American Can Co Scoring of materials with laser energy
US5368900A (en) * 1991-11-04 1994-11-29 Motorola, Inc. Multistep laser ablation method for making optical waveguide reflector
JPH11503880A (ja) * 1996-02-09 1999-03-30 フィリップス エレクトロニクス ネムローゼ フェンノートシャップ 半導体材料のウエファに形成された半導体素子のレーザ分割方法
US6407360B1 (en) * 1998-08-26 2002-06-18 Samsung Electronics, Co., Ltd. Laser cutting apparatus and method
US6420678B1 (en) * 1998-12-01 2002-07-16 Brian L. Hoekstra Method for separating non-metallic substrates
EP1201108B1 (en) * 1999-08-03 2003-10-22 Xsil Technology Limited A circuit singulation system and method
KR100634750B1 (ko) * 1999-12-07 2006-10-16 삼성전자주식회사 레이저 커팅 장치
US6677552B1 (en) * 2001-11-30 2004-01-13 Positive Light, Inc. System and method for laser micro-machining

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6413839B1 (en) * 1998-10-23 2002-07-02 Emcore Corporation Semiconductor device separation using a patterned laser projection
US20030047545A1 (en) * 2000-04-11 2003-03-13 Mckee Terry Method for laser drilling
US20020086544A1 (en) * 2000-12-15 2002-07-04 Adrian Boyle Laser machining of semiconductor materials

Also Published As

Publication number Publication date
KR20070121793A (ko) 2007-12-27
WO2006118454A1 (en) 2006-11-09
EP1905067A1 (en) 2008-04-02
JP2008537511A (ja) 2008-09-18
TW200633809A (en) 2006-10-01
CN101147241B (zh) 2011-01-12
CN101147241A (zh) 2008-03-19
NL1028588C2 (nl) 2006-09-25

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