NL1023892A1 - Inspectiewerkwijze en een fotomasker. - Google Patents

Inspectiewerkwijze en een fotomasker.

Info

Publication number
NL1023892A1
NL1023892A1 NL1023892A NL1023892A NL1023892A1 NL 1023892 A1 NL1023892 A1 NL 1023892A1 NL 1023892 A NL1023892 A NL 1023892A NL 1023892 A NL1023892 A NL 1023892A NL 1023892 A1 NL1023892 A1 NL 1023892A1
Authority
NL
Netherlands
Prior art keywords
inspection method
photo mask
photo
mask
inspection
Prior art date
Application number
NL1023892A
Other languages
English (en)
Other versions
NL1023892C2 (nl
Inventor
Kazuya Fukuhara
Satoshi Tanaka
Soichi Inoue
Original Assignee
Toshiba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Kk filed Critical Toshiba Kk
Publication of NL1023892A1 publication Critical patent/NL1023892A1/nl
Application granted granted Critical
Publication of NL1023892C2 publication Critical patent/NL1023892C2/nl

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • G03F7/70566—Polarisation control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70591—Testing optical components
    • G03F7/706—Aberration measurement

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Testing Of Optical Devices Or Fibers (AREA)
  • Polarising Elements (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
NL1023892A 2002-07-11 2003-07-11 Inspectiewerkwijze en een fotomasker. NL1023892C2 (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002203194 2002-07-11
JP2002203194A JP3651676B2 (ja) 2002-07-11 2002-07-11 検査方法及びフォトマスク

Publications (2)

Publication Number Publication Date
NL1023892A1 true NL1023892A1 (nl) 2004-01-13
NL1023892C2 NL1023892C2 (nl) 2005-12-20

Family

ID=30112665

Family Applications (1)

Application Number Title Priority Date Filing Date
NL1023892A NL1023892C2 (nl) 2002-07-11 2003-07-11 Inspectiewerkwijze en een fotomasker.

Country Status (5)

Country Link
US (2) US7186485B2 (nl)
JP (1) JP3651676B2 (nl)
CN (1) CN1288508C (nl)
NL (1) NL1023892C2 (nl)
TW (1) TWI233005B (nl)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113341495A (zh) * 2015-10-05 2021-09-03 日东电工株式会社 具有非偏振部的偏振片的制造方法

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JP3787123B2 (ja) * 2003-02-13 2006-06-21 株式会社東芝 検査方法、プロセッサ及び半導体装置の製造方法
AU2003304304A1 (en) * 2003-07-05 2005-01-21 Carl Zeiss Smt Ag Device for the polarization-specific examination of an optical system
US7848594B2 (en) 2004-02-13 2010-12-07 Nikon Corporation Measurement method, transfer characteristic measurement method, adjustment method of exposure apparatus, and device manufacturing method
KR100684872B1 (ko) * 2004-08-03 2007-02-20 삼성전자주식회사 빛의 편광을 공간적으로 제어하는 광학 시스템 및 이를제작하는 방법
US20060045383A1 (en) * 2004-08-31 2006-03-02 Picciotto Carl E Displacement estimation system and method
JP2006165398A (ja) * 2004-12-09 2006-06-22 Toshiba Corp 収差測定方法及び半導体装置の製造方法
JP2006173305A (ja) * 2004-12-15 2006-06-29 Canon Inc 露光装置及び方法、並びに、デバイス製造方法
US7619747B2 (en) * 2004-12-17 2009-11-17 Asml Netherlands B.V. Lithographic apparatus, analyzer plate, subassembly, method of measuring a parameter of a projection system and patterning device
KR100604941B1 (ko) * 2005-06-15 2006-07-28 삼성전자주식회사 변형 조명을 구현하는 포토마스크, 제조방법 및 이를이용한 패턴 형성방법
WO2006137011A2 (en) * 2005-06-24 2006-12-28 Koninklijke Philips Electronics N.V. Methods and devices for characterizing polarization of illumination system
JP4675745B2 (ja) * 2005-10-25 2011-04-27 株式会社東芝 フォトマスク用基板の選別方法、フォトマスク作製方法及び半導体装置製造方法
US20070097347A1 (en) * 2005-10-28 2007-05-03 Toppan Chungwa Electronics Co., Ltd. Method for forming a circuit pattern by using two photo-masks
JP4928897B2 (ja) * 2005-12-01 2012-05-09 株式会社東芝 偏光評価マスク、偏光評価方法、及び偏光計測装置
JP4825569B2 (ja) * 2006-04-12 2011-11-30 株式会社東芝 測定座標設定システム及び測定座標設定方法
JP5002221B2 (ja) * 2006-09-11 2012-08-15 キヤノン株式会社 マークの位置を検出する装置
JP4752695B2 (ja) * 2006-09-15 2011-08-17 ソニー株式会社 マスクパターン補正方法，マスクパターン補正装置およびそのプログラム
JP2008070730A (ja) * 2006-09-15 2008-03-27 Sony Corp マスクブランクス選定方法、複屈折性指標の算出方法、リソグラフィ方法、マスクブランクス選定装置、複屈折性指標算出装置およびそのプログラム
US7943273B2 (en) * 2007-04-20 2011-05-17 Photronics, Inc. Photomask with detector for optimizing an integrated circuit production process and method of manufacturing an integrated circuit using the same
US20080299499A1 (en) * 2007-05-30 2008-12-04 Naomasa Shiraishi Exposure method, method of manufacturing plate for flat panel display, and exposure apparatus
TWI431408B (zh) * 2007-07-23 2014-03-21 Hoya Corp 光罩資訊之取得方法、光罩之品質顯示方法、顯示裝置之製造方法以及光罩製品
US20090088997A1 (en) * 2007-09-28 2009-04-02 Hitachi High Technologies Corporation Data processing system
JP2009175587A (ja) * 2008-01-28 2009-08-06 Toshiba Corp 露光装置検査用マスク、その製造方法、及び露光装置検査用マスクを用いた露光装置の検査方法
JP5571289B2 (ja) * 2008-02-08 2014-08-13 ピーエスフォー ルクスコ エスエイアールエル 露光用マスク及びパターン形成方法
JP2009194041A (ja) * 2008-02-12 2009-08-27 Canon Inc 評価方法、調整方法、露光装置、およびコンピュータプログラム
JP4568340B2 (ja) * 2008-03-12 2010-10-27 株式会社東芝 半導体装置の製造方法
JP2009277711A (ja) * 2008-05-12 2009-11-26 Canon Inc 露光装置、補正方法及びデバイス製造方法
JP5191851B2 (ja) * 2008-09-25 2013-05-08 株式会社東芝 偏光状態検査装置および偏光状態検査方法
JP5218111B2 (ja) * 2009-02-03 2013-06-26 凸版印刷株式会社 反射型フォトマスクブランクス、反射型フォトマスク、反射型フォトマスクの検査装置及びその検査方法
CN103472004B (zh) * 2012-06-08 2016-04-20 上海微电子装备有限公司 一种光刻工艺参数测量装置及方法
CA3030495A1 (en) 2014-03-04 2015-09-11 Novadaq Technologies ULC Spatial and spectral filtering apertures and optical imaging systems including the same
KR20160084949A (ko) * 2015-01-06 2016-07-15 삼성디스플레이 주식회사 포토 마스크, 및 이를 이용한 박막 트랜지스터 기판의 제조 방법
US9842724B2 (en) 2015-02-03 2017-12-12 Kla-Tencor Corporation Method and system for imaging of a photomask through a pellicle
WO2017035646A1 (en) * 2015-08-31 2017-03-09 Novadaq Technologies Inc. Polarization dependent filter, system using the same, and associated kits and methods
US10451564B2 (en) * 2017-10-27 2019-10-22 Applied Materials, Inc. Empirical detection of lens aberration for diffraction-limited optical system
CN111413847A (zh) * 2019-01-08 2020-07-14 长鑫存储技术有限公司 光掩膜以及光刻光学式叠对标记测量方法
CN110045582B (zh) * 2019-04-19 2020-12-18 东莞市多普光电设备有限公司 一种基于数字微镜ldi的装置及倾斜扫描方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5541026A (en) 1991-06-13 1996-07-30 Nikon Corporation Exposure apparatus and photo mask
KR950002172B1 (ko) 1991-06-13 1995-03-14 금성일렉트론주식회사 편광자를 사용한 편광노광장치 및 편광마스크 제조방법
JPH06181167A (ja) 1992-10-14 1994-06-28 Canon Inc 像形成方法及び該方法を用いてデバイスを製造する方法及び該方法に用いるフォトマスク
JPH088177A (ja) 1994-04-22 1996-01-12 Canon Inc 投影露光装置及びそれを用いたデバイスの製造方法
JP3256678B2 (ja) 1998-02-19 2002-02-12 株式会社東芝 レンズの収差測定方法
JP3495983B2 (ja) 2000-12-28 2004-02-09 キヤノン株式会社 マスク及び投影露光装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113341495A (zh) * 2015-10-05 2021-09-03 日东电工株式会社 具有非偏振部的偏振片的制造方法
CN113341495B (zh) * 2015-10-05 2022-12-06 日东电工株式会社 具有非偏振部的偏振片的制造方法

Also Published As

Publication number Publication date
US7556896B2 (en) 2009-07-07
CN1288508C (zh) 2006-12-06
NL1023892C2 (nl) 2005-12-20
CN1493923A (zh) 2004-05-05
TW200413859A (en) 2004-08-01
TWI233005B (en) 2005-05-21
JP3651676B2 (ja) 2005-05-25
US7186485B2 (en) 2007-03-06
US20070071306A1 (en) 2007-03-29
JP2004047737A (ja) 2004-02-12
US20040010385A1 (en) 2004-01-15

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RD2N Patents in respect of which a decision has been taken or a report has been made (novelty report)

Effective date: 20050818

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Effective date: 20140201