NL1027187A1 - Een masker voor inspectie van een belichtingsinrichting, een werkwijze voor inspectie van een belichtingsinrichting, en een belichtingsinrichting. - Google Patents
Een masker voor inspectie van een belichtingsinrichting, een werkwijze voor inspectie van een belichtingsinrichting, en een belichtingsinrichting.Info
- Publication number
- NL1027187A1 NL1027187A1 NL1027187A NL1027187A NL1027187A1 NL 1027187 A1 NL1027187 A1 NL 1027187A1 NL 1027187 A NL1027187 A NL 1027187A NL 1027187 A NL1027187 A NL 1027187A NL 1027187 A1 NL1027187 A1 NL 1027187A1
- Authority
- NL
- Netherlands
- Prior art keywords
- exposure device
- inspecting
- mask
- exposure
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70125—Use of illumination settings tailored to particular mask patterns
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
- G03F1/44—Testing or measuring features, e.g. grid patterns, focus monitors, sawtooth scales or notched scales
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
- G03F7/70566—Polarisation control
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70591—Testing optical components
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003348132A JP3718511B2 (ja) | 2003-10-07 | 2003-10-07 | 露光装置検査用マスク、露光装置検査方法及び露光装置 |
JP2003348132 | 2003-10-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
NL1027187A1 true NL1027187A1 (nl) | 2005-04-08 |
NL1027187C2 NL1027187C2 (nl) | 2008-02-12 |
Family
ID=34540418
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL1027187A NL1027187C2 (nl) | 2003-10-07 | 2004-10-06 | Een masker voor inspectie van een belichtingsinrichting, een werkwijze voor inspectie van een belichtingsinrichting, en een belichtingsinrichting. |
Country Status (4)
Country | Link |
---|---|
US (1) | US7072040B2 (nl) |
JP (1) | JP3718511B2 (nl) |
CN (1) | CN1267788C (nl) |
NL (1) | NL1027187C2 (nl) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3787123B2 (ja) * | 2003-02-13 | 2006-06-21 | 株式会社東芝 | 検査方法、プロセッサ及び半導体装置の製造方法 |
WO2005106593A2 (en) * | 2004-04-14 | 2005-11-10 | Litel Instruments | Method and apparatus for measurement of exit pupil transmittance |
US7619747B2 (en) | 2004-12-17 | 2009-11-17 | Asml Netherlands B.V. | Lithographic apparatus, analyzer plate, subassembly, method of measuring a parameter of a projection system and patterning device |
US7697138B2 (en) * | 2005-01-19 | 2010-04-13 | Litel Instruments | Method and apparatus for determination of source polarization matrix |
US7375799B2 (en) * | 2005-02-25 | 2008-05-20 | Asml Netherlands B.V. | Lithographic apparatus |
JP4580797B2 (ja) * | 2005-03-28 | 2010-11-17 | 株式会社東芝 | 偏光状態検査方法及び半導体装置の製造方法 |
CN101253451B (zh) * | 2005-06-13 | 2010-09-29 | Asml荷兰有限公司 | 被动式掩模版工具、光刻设备以及在光刻工具中对器件图案化的方法 |
WO2007009535A1 (en) * | 2005-06-13 | 2007-01-25 | Asml Netherlands B.V. | Active reticle tool and lithographic apparatus |
WO2006137011A2 (en) * | 2005-06-24 | 2006-12-28 | Koninklijke Philips Electronics N.V. | Methods and devices for characterizing polarization of illumination system |
JP2007140212A (ja) * | 2005-11-18 | 2007-06-07 | Toshiba Corp | フォトマスク及び半導体装置の製造方法 |
JP4928897B2 (ja) * | 2005-12-01 | 2012-05-09 | 株式会社東芝 | 偏光評価マスク、偏光評価方法、及び偏光計測装置 |
US20080062385A1 (en) * | 2006-04-07 | 2008-03-13 | Asml Netherlands B.V. | Method of monitoring polarization performance, polarization measurement assembly, lithographic apparatus and computer program product using the same |
US20070264581A1 (en) * | 2006-05-09 | 2007-11-15 | Schwarz Christian J | Patterning masks and methods |
EP1857879A1 (en) | 2006-05-15 | 2007-11-21 | Advanced Mask Technology Center GmbH & Co. KG | An illumination system and a photolithography apparatus |
US7799486B2 (en) * | 2006-11-21 | 2010-09-21 | Infineon Technologies Ag | Lithography masks and methods of manufacture thereof |
NL1036069A1 (nl) * | 2007-10-30 | 2009-05-07 | Asml Netherlands Bv | An Immersion Lithography Apparatus. |
TW200938957A (en) * | 2008-03-05 | 2009-09-16 | Nanya Technology Corp | Feedback system and feedback method for controlling power ratio of light source |
JP2010034478A (ja) * | 2008-07-31 | 2010-02-12 | Toshiba Corp | 露光装置の管理方法、半導体装置の製造方法及びフォトマスク |
JP5191851B2 (ja) * | 2008-09-25 | 2013-05-08 | 株式会社東芝 | 偏光状態検査装置および偏光状態検査方法 |
US8368890B2 (en) * | 2009-02-19 | 2013-02-05 | International Business Machines Corporation | Polarization monitoring reticle design for high numerical aperture lithography systems |
KR101037899B1 (ko) * | 2010-03-24 | 2011-05-30 | 한국기계연구원 | 리소그래피 장치 및 리소그래피 방법 |
CN102435418B (zh) * | 2011-09-15 | 2013-08-21 | 中国科学院长春光学精密机械与物理研究所 | ArF激光光学薄膜元件综合偏振测量装置及测量方法 |
DE102013200961A1 (de) * | 2013-01-22 | 2014-07-24 | Carl Zeiss Smt Gmbh | Polarisationsmessvorrichtung für eine Projektionsbelichtungsanlage |
US11131929B2 (en) * | 2018-11-07 | 2021-09-28 | Waymo Llc | Systems and methods that utilize angled photolithography for manufacturing light guide elements |
CN109596541A (zh) * | 2018-11-07 | 2019-04-09 | 北京东方安杰科技有限公司 | 一种光源状态检测系统及其检测方法 |
JP7167999B2 (ja) * | 2018-11-14 | 2022-11-09 | 株式会社村田製作所 | 測定装置及び測定装置を用いた投光システム |
JP7336922B2 (ja) * | 2019-09-03 | 2023-09-01 | キヤノン株式会社 | 露光装置及び物品の製造方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6344624A (ja) * | 1986-08-12 | 1988-02-25 | Fuji Photo Film Co Ltd | 液晶デバイス |
JP3246615B2 (ja) | 1992-07-27 | 2002-01-15 | 株式会社ニコン | 照明光学装置、露光装置、及び露光方法 |
US5459000A (en) * | 1992-10-14 | 1995-10-17 | Canon Kabushiki Kaisha | Image projection method and device manufacturing method using the image projection method |
JP2836483B2 (ja) | 1994-05-13 | 1998-12-14 | 日本電気株式会社 | 照明光学装置 |
US5973771A (en) * | 1997-03-26 | 1999-10-26 | International Business Machines Corporation | Pupil imaging reticle for photo steppers |
JP3302926B2 (ja) | 1998-07-02 | 2002-07-15 | 株式会社東芝 | 露光装置の検査方法 |
US6048651A (en) | 1998-10-23 | 2000-04-11 | International Business Machines Corporation | Fresnel zone mask for pupilgram |
JP3302966B2 (ja) * | 2000-02-15 | 2002-07-15 | 株式会社東芝 | 露光装置の検査方法及び露光装置検査用フォトマスク |
JP2002139406A (ja) * | 2000-11-06 | 2002-05-17 | Nikon Corp | 光学特性計測用マスク、光学特性計測方法、及び露光装置の製造方法 |
US6884552B2 (en) * | 2001-11-09 | 2005-04-26 | Kla-Tencor Technologies Corporation | Focus masking structures, focus patterns and measurements thereof |
-
2003
- 2003-10-07 JP JP2003348132A patent/JP3718511B2/ja not_active Expired - Fee Related
-
2004
- 2004-09-30 CN CNB2004100811652A patent/CN1267788C/zh not_active Expired - Fee Related
- 2004-10-06 NL NL1027187A patent/NL1027187C2/nl not_active IP Right Cessation
- 2004-10-06 US US10/958,594 patent/US7072040B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
NL1027187C2 (nl) | 2008-02-12 |
US20050099613A1 (en) | 2005-05-12 |
CN1605934A (zh) | 2005-04-13 |
JP2005116733A (ja) | 2005-04-28 |
JP3718511B2 (ja) | 2005-11-24 |
CN1267788C (zh) | 2006-08-02 |
US7072040B2 (en) | 2006-07-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AD1A | A request for search or an international type search has been filed | ||
RD2N | Patents in respect of which a decision has been taken or a report has been made (novelty report) |
Effective date: 20071010 |
|
PD2B | A search report has been drawn up | ||
V1 | Lapsed because of non-payment of the annual fee |
Effective date: 20130501 |