NL1012488C2 - Inrichting en werkwijze voor het omhullen van op een drager bevestigde elektronische componenten. - Google Patents

Inrichting en werkwijze voor het omhullen van op een drager bevestigde elektronische componenten. Download PDF

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Publication number
NL1012488C2
NL1012488C2 NL1012488A NL1012488A NL1012488C2 NL 1012488 C2 NL1012488 C2 NL 1012488C2 NL 1012488 A NL1012488 A NL 1012488A NL 1012488 A NL1012488 A NL 1012488A NL 1012488 C2 NL1012488 C2 NL 1012488C2
Authority
NL
Netherlands
Prior art keywords
mold
carrier
holder member
mold cavity
encapsulating material
Prior art date
Application number
NL1012488A
Other languages
English (en)
Dutch (nl)
Inventor
Hendrikus Johannes Bern Peters
Richard Theodorus Vermeulen
Original Assignee
Fico Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico Bv filed Critical Fico Bv
Priority to NL1012488A priority Critical patent/NL1012488C2/nl
Priority to TW88113708A priority patent/TW421868B/zh
Priority to MYPI20002967 priority patent/MY141931A/en
Priority to EP00946518A priority patent/EP1259981B1/en
Priority to PCT/NL2000/000458 priority patent/WO2001017012A1/en
Priority to JP2001520461A priority patent/JP2003508911A/ja
Application granted granted Critical
Publication of NL1012488C2 publication Critical patent/NL1012488C2/nl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B29C45/2701—Details not specific to hot or cold runner channels
    • B29C45/2708—Gates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0025—Preventing defects on the moulded article, e.g. weld lines, shrinkage marks
    • B29C2045/0027—Gate or gate mark locations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B29C45/2701—Details not specific to hot or cold runner channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
NL1012488A 1999-07-01 1999-07-01 Inrichting en werkwijze voor het omhullen van op een drager bevestigde elektronische componenten. NL1012488C2 (nl)

Priority Applications (6)

Application Number Priority Date Filing Date Title
NL1012488A NL1012488C2 (nl) 1999-07-01 1999-07-01 Inrichting en werkwijze voor het omhullen van op een drager bevestigde elektronische componenten.
TW88113708A TW421868B (en) 1999-07-01 1999-08-11 Device and method for encapsulating electronic component mounted on a carrier
MYPI20002967 MY141931A (en) 1999-07-01 2000-06-29 Device and method for encapsulating electronic components mounted on a carrier
EP00946518A EP1259981B1 (en) 1999-07-01 2000-06-30 Device and method for encapsulating electronic components mounted on a carrier
PCT/NL2000/000458 WO2001017012A1 (en) 1999-07-01 2000-06-30 Device and method for encapsulating electronic components mounted on a carrier
JP2001520461A JP2003508911A (ja) 1999-07-01 2000-06-30 担体上に取り付けた電子部品を封入するための装置及び方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1012488 1999-07-01
NL1012488A NL1012488C2 (nl) 1999-07-01 1999-07-01 Inrichting en werkwijze voor het omhullen van op een drager bevestigde elektronische componenten.

Publications (1)

Publication Number Publication Date
NL1012488C2 true NL1012488C2 (nl) 2001-01-03

Family

ID=19769489

Family Applications (1)

Application Number Title Priority Date Filing Date
NL1012488A NL1012488C2 (nl) 1999-07-01 1999-07-01 Inrichting en werkwijze voor het omhullen van op een drager bevestigde elektronische componenten.

Country Status (6)

Country Link
EP (1) EP1259981B1 (ja)
JP (1) JP2003508911A (ja)
MY (1) MY141931A (ja)
NL (1) NL1012488C2 (ja)
TW (1) TW421868B (ja)
WO (1) WO2001017012A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6508970B2 (en) * 1999-07-15 2003-01-21 Infineon Technologies North America Corp. Liquid transfer molding system for encapsulating semiconductor integrated circuits
NL1022323C2 (nl) 2003-01-08 2004-07-09 Fico Bv Inrichting en werkwijze voor het met omhulmateriaal omhullen van een op een drager bevestigde elektronische component.
CN101927550B (zh) * 2006-04-25 2014-06-25 贝斯荷兰有限公司 带有板形框架的压力机和操作这种板式压力机的方法
FR2989020B1 (fr) 2012-04-05 2014-12-12 Snecma Procede de fabrication d'une piece epaisse de turbomachine en materiau composite par injection de resine sous pression

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57128930A (en) * 1981-02-04 1982-08-10 Yamagata Nippon Denki Kk Resin sealing
JPH02129933A (ja) * 1988-11-09 1990-05-18 Mitsubishi Electric Corp Ｉｃカード用のモジュールの製造方法
US4954308A (en) * 1988-03-04 1990-09-04 Citizen Watch Co., Ltd. Resin encapsulating method
JPH04184944A (ja) * 1990-11-20 1992-07-01 Citizen Watch Co Ltd Ｉｃの樹脂封止方法
GB2266856A (en) * 1992-05-05 1993-11-17 Advanced Systems Automation Pt Encapsulation of lead frames
EP0692820A1 (en) * 1994-07-15 1996-01-17 Shinko Electric Industries Co. Ltd. Manufacturing one sided resin sealed semiconductor devices and a carrier used for it
NL9401682A (nl) * 1994-10-12 1996-05-01 Fico Bv Werkwijze voor het omhullen van een chip en scheidingsstrip en matrijshelft te gebruiken met deze werkwijze.

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2984240B2 (ja) * 1997-01-09 1999-11-29 住友重機械工業株式会社 半導体素子の樹脂封止装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57128930A (en) * 1981-02-04 1982-08-10 Yamagata Nippon Denki Kk Resin sealing
US4954308A (en) * 1988-03-04 1990-09-04 Citizen Watch Co., Ltd. Resin encapsulating method
JPH02129933A (ja) * 1988-11-09 1990-05-18 Mitsubishi Electric Corp Ｉｃカード用のモジュールの製造方法
JPH04184944A (ja) * 1990-11-20 1992-07-01 Citizen Watch Co Ltd Ｉｃの樹脂封止方法
GB2266856A (en) * 1992-05-05 1993-11-17 Advanced Systems Automation Pt Encapsulation of lead frames
EP0692820A1 (en) * 1994-07-15 1996-01-17 Shinko Electric Industries Co. Ltd. Manufacturing one sided resin sealed semiconductor devices and a carrier used for it
NL9401682A (nl) * 1994-10-12 1996-05-01 Fico Bv Werkwijze voor het omhullen van een chip en scheidingsstrip en matrijshelft te gebruiken met deze werkwijze.

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 006, no. 226 (E - 141) 11 November 1982 (1982-11-11) *
PATENT ABSTRACTS OF JAPAN vol. 014, no. 365 (E - 0961) 8 August 1990 (1990-08-08) *
PATENT ABSTRACTS OF JAPAN vol. 016, no. 499 (E - 1280) 15 October 1992 (1992-10-15) *

Also Published As

Publication number Publication date
MY141931A (en) 2010-07-30
JP2003508911A (ja) 2003-03-04
WO2001017012A1 (en) 2001-03-08
TW421868B (en) 2001-02-11
EP1259981A1 (en) 2002-11-27
EP1259981B1 (en) 2011-08-10

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Effective date: 20130201