NL1011077C2 - Werkwijze en inrichting voor het langs een snijlijn(en) van elkaar scheiden van met een gemeenschappelijke drager gevormde producten. - Google Patents
Werkwijze en inrichting voor het langs een snijlijn(en) van elkaar scheiden van met een gemeenschappelijke drager gevormde producten. Download PDFInfo
- Publication number
- NL1011077C2 NL1011077C2 NL1011077A NL1011077A NL1011077C2 NL 1011077 C2 NL1011077 C2 NL 1011077C2 NL 1011077 A NL1011077 A NL 1011077A NL 1011077 A NL1011077 A NL 1011077A NL 1011077 C2 NL1011077 C2 NL 1011077C2
- Authority
- NL
- Netherlands
- Prior art keywords
- carrier
- products
- cutting
- cutting blade
- support member
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/04—Processes
- Y10T83/0405—With preparatory or simultaneous ancillary treatment of work
- Y10T83/041—By heating or cooling
- Y10T83/0414—At localized area [e.g., line of separation]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/04—Processes
- Y10T83/0405—With preparatory or simultaneous ancillary treatment of work
- Y10T83/0443—By fluid application
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/04—Processes
- Y10T83/0495—Making and using a registration cut
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/263—With means to apply transient nonpropellant fluent material to tool or work
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/283—With means to control or modify temperature of apparatus or work
- Y10T83/293—Of tool
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/525—Operation controlled by detector means responsive to work
- Y10T83/533—With photo-electric work-sensing means
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Nonmetal Cutting Devices (AREA)
- Processing Of Solid Wastes (AREA)
Priority Applications (12)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL1011077A NL1011077C2 (nl) | 1999-01-19 | 1999-01-19 | Werkwijze en inrichting voor het langs een snijlijn(en) van elkaar scheiden van met een gemeenschappelijke drager gevormde producten. |
EP99203838A EP1022779A1 (en) | 1999-01-19 | 1999-11-16 | Method and device for separating products, mounted on a common substrate, from each other, along (a) cutting line(s) |
US09/447,954 US6588308B2 (en) | 1999-01-19 | 1999-11-29 | Method and device for separating products, mounted on a common substrate, from each other along (a) cutting line(s) |
KR10-1999-0054414A KR100366922B1 (ko) | 1999-01-19 | 1999-12-02 | 공통기판상에 장착된 제품을 절단선을 따라 서로 분리하기 위한 방법 및 장치 |
SG9906120A SG85684A1 (en) | 1999-01-19 | 1999-12-07 | Method and device for separating products, mounted on a common substrate, from each other along (a) cutting line (s) |
TW088121543A TW437003B (en) | 1999-01-19 | 1999-12-09 | Method and device for separating products, mounted on a common substrate, from each other along a cutting line |
JP2000006089A JP3641646B2 (ja) | 1999-01-19 | 2000-01-11 | 製品の分離方法及び分離装置 |
CA002295421A CA2295421A1 (en) | 1999-01-19 | 2000-01-14 | Method and device for separating products, mounted on a common substrate, from each other along (a) cutting line (s) |
CNB001011049A CN1155994C (zh) | 1999-01-19 | 2000-01-17 | 使处于一共同基片上的产品沿切割线互相分离的方法和装置 |
MYPI20000135A MY124915A (en) | 1999-01-19 | 2000-01-17 | Method and device for separating products, mounted on a common substrate, from each other along (a) cutting line(s) |
IDP20000016A ID24404A (id) | 1999-01-19 | 2000-01-17 | Metoda dan alat untuk memisahkan produk, yang dipasang pada suatu substrad biasa, satu dengan yang lain sepanjang jalur pemotongan |
HK00105917A HK1026770A1 (en) | 1999-01-19 | 2000-09-20 | Method and device for separating products, mountedon a common substrate, from each other along (a) cutting line(s). |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL1011077A NL1011077C2 (nl) | 1999-01-19 | 1999-01-19 | Werkwijze en inrichting voor het langs een snijlijn(en) van elkaar scheiden van met een gemeenschappelijke drager gevormde producten. |
NL1011077 | 1999-01-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
NL1011077C2 true NL1011077C2 (nl) | 2000-07-20 |
Family
ID=19768507
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL1011077A NL1011077C2 (nl) | 1999-01-19 | 1999-01-19 | Werkwijze en inrichting voor het langs een snijlijn(en) van elkaar scheiden van met een gemeenschappelijke drager gevormde producten. |
Country Status (12)
Country | Link |
---|---|
US (1) | US6588308B2 (ja) |
EP (1) | EP1022779A1 (ja) |
JP (1) | JP3641646B2 (ja) |
KR (1) | KR100366922B1 (ja) |
CN (1) | CN1155994C (ja) |
CA (1) | CA2295421A1 (ja) |
HK (1) | HK1026770A1 (ja) |
ID (1) | ID24404A (ja) |
MY (1) | MY124915A (ja) |
NL (1) | NL1011077C2 (ja) |
SG (1) | SG85684A1 (ja) |
TW (1) | TW437003B (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4860177B2 (ja) * | 2005-05-09 | 2012-01-25 | エステック株式会社 | ガラス板等ワークの切断方法及び装置 |
WO2007084952A2 (en) * | 2006-01-18 | 2007-07-26 | Akrion Technologies, Inc. | Systems and methods for drying a rotating substrate |
WO2008003502A1 (de) * | 2006-07-06 | 2008-01-10 | Rena Sondermaschinen Gmbh | Vorrichtung und verfahren zum vereinzeln und transportieren von substraten |
JP5709370B2 (ja) * | 2009-11-26 | 2015-04-30 | 株式会社ディスコ | 切削装置及び切削方法 |
KR20110005473U (ko) * | 2009-11-26 | 2011-06-01 | 세크론 주식회사 | 냉각용수 공급이 가능한 반도체소자 절단장치의 진공척테이블 |
JP7019241B2 (ja) * | 2017-09-21 | 2022-02-15 | 株式会社ディスコ | 切削ブレードの装着機構 |
CN108823944B (zh) * | 2018-07-02 | 2024-04-12 | 江苏湛德医疗用品有限公司 | 一种无纺布生产过程剪裁机系统 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55118647A (en) * | 1979-03-06 | 1980-09-11 | Toshiba Corp | Method of dicing semiconductor wafer |
DE3137301A1 (de) * | 1981-09-18 | 1983-04-14 | Presco Inc., Beverly Hills, Calif. | "verfahren und vorrichtung zur handhabung kleiner teile in der fertigung" |
JPH03198363A (ja) * | 1989-12-27 | 1991-08-29 | Ricoh Co Ltd | 半導体ユニットのダイシング方法 |
JPH06326185A (ja) * | 1993-05-17 | 1994-11-25 | Hitachi Ltd | ダイシング装置およびダイシング用ブレード |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2191916A (en) * | 1938-02-28 | 1940-02-27 | Bower Roller Bearing Co | Method of forming roller bearing cups |
US3407690A (en) * | 1966-12-12 | 1968-10-29 | Armstrong Cork Co | Method of trimming and cutting in register |
US3798782A (en) * | 1971-10-18 | 1974-03-26 | R Lindahl | Register mark punch system and method |
US3818790A (en) * | 1972-11-29 | 1974-06-25 | Armstrong Cork Co | Carpet tile cutter |
US4054070A (en) * | 1976-05-17 | 1977-10-18 | Globe Machine Manufacturing Company | Panel saw mechanism |
US4209129A (en) * | 1978-12-29 | 1980-06-24 | International Business Machines Corporation | Cooling manifold for multiple solenoid operated punching apparatus |
US4484417A (en) * | 1982-11-22 | 1984-11-27 | W. J. Savage Company | Sawing apparatus |
US4578203A (en) * | 1983-04-01 | 1986-03-25 | Ppg Industries, Inc. | Polymer solution working fluid for finishing processes |
NZ213316A (en) * | 1985-08-30 | 1988-10-28 | Trigon Packaging Systems | Forming arrays of evacuated packages on independent magazines which packages are separated after sealing |
JPS62249446A (ja) | 1986-04-23 | 1987-10-30 | Hitachi Ltd | 保持装置およびその使用方法 |
JPH01188308A (ja) | 1988-01-22 | 1989-07-27 | Nec Corp | 半導体ウェハのダイシング装置 |
US4920947A (en) * | 1988-04-14 | 1990-05-01 | Blount, Inc. | Chain saw components and system for cutting masonry and the like |
US4872381A (en) * | 1988-07-13 | 1989-10-10 | International Business Machines Corp. | Programmable magnetic repulsion punching apparatus |
JPH02102559A (ja) | 1988-10-11 | 1990-04-16 | Rohm Co Ltd | 半導体製造装置 |
JPH0348443A (ja) | 1989-06-23 | 1991-03-01 | Nec Kansai Ltd | 半導体ウェーハ切断方法 |
US5074178A (en) * | 1990-05-04 | 1991-12-24 | Cad Futures Corporation | Apparatus and method for cutting drawings from a web of sheet material |
US5062334A (en) * | 1990-05-21 | 1991-11-05 | Killilea Timothy R | Apparatus for cleaning cutting table support surface |
JPH0435846A (ja) | 1990-05-31 | 1992-02-06 | Toshiba Corp | 半導体ウエハの位置合せ方法 |
JPH04147622A (ja) * | 1990-10-11 | 1992-05-21 | Nec Kyushu Ltd | 水中加工用ウエハチャッキングテーブル |
DE4309134C2 (de) * | 1993-03-22 | 1999-03-04 | Wilfried Wahl | Verfahren zur Schmierung und Kühlung von Schneiden und/oder Werkstücken bei zerspanenden Arbeitsprozessen |
JPH06275712A (ja) | 1993-03-24 | 1994-09-30 | Nec Kansai Ltd | ダイシング装置 |
ES2111786T5 (es) * | 1993-03-26 | 2000-12-16 | Alfons Haar Maschb Gmbh & Co | Prensa con un sistema de alimentacion de tablas y de avance. |
US5790402A (en) * | 1994-09-16 | 1998-08-04 | E-Z Max Apparel Systems, Inc. | Spreading table with electronic splice zone display |
US5839337A (en) * | 1995-04-28 | 1998-11-24 | Neu; H. Karl | Semiconductor carrier strip trimming apparatus |
JPH0917752A (ja) * | 1995-06-28 | 1997-01-17 | Sony Corp | 偏平な被切削物の切断方法及びその装置 |
KR100475524B1 (ko) * | 1996-11-27 | 2005-05-17 | 삼성전자주식회사 | 기판의절단방법 |
KR100225909B1 (ko) * | 1997-05-29 | 1999-10-15 | 윤종용 | 웨이퍼 소잉 장치 |
-
1999
- 1999-01-19 NL NL1011077A patent/NL1011077C2/nl not_active IP Right Cessation
- 1999-11-16 EP EP99203838A patent/EP1022779A1/en not_active Withdrawn
- 1999-11-29 US US09/447,954 patent/US6588308B2/en not_active Expired - Fee Related
- 1999-12-02 KR KR10-1999-0054414A patent/KR100366922B1/ko not_active IP Right Cessation
- 1999-12-07 SG SG9906120A patent/SG85684A1/en unknown
- 1999-12-09 TW TW088121543A patent/TW437003B/zh not_active IP Right Cessation
-
2000
- 2000-01-11 JP JP2000006089A patent/JP3641646B2/ja not_active Expired - Fee Related
- 2000-01-14 CA CA002295421A patent/CA2295421A1/en not_active Abandoned
- 2000-01-17 CN CNB001011049A patent/CN1155994C/zh not_active Expired - Fee Related
- 2000-01-17 ID IDP20000016A patent/ID24404A/id unknown
- 2000-01-17 MY MYPI20000135A patent/MY124915A/en unknown
- 2000-09-20 HK HK00105917A patent/HK1026770A1/xx not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55118647A (en) * | 1979-03-06 | 1980-09-11 | Toshiba Corp | Method of dicing semiconductor wafer |
DE3137301A1 (de) * | 1981-09-18 | 1983-04-14 | Presco Inc., Beverly Hills, Calif. | "verfahren und vorrichtung zur handhabung kleiner teile in der fertigung" |
JPH03198363A (ja) * | 1989-12-27 | 1991-08-29 | Ricoh Co Ltd | 半導体ユニットのダイシング方法 |
JPH06326185A (ja) * | 1993-05-17 | 1994-11-25 | Hitachi Ltd | ダイシング装置およびダイシング用ブレード |
Non-Patent Citations (3)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 004, no. 170 (E - 035) 22 November 1980 (1980-11-22) * |
PATENT ABSTRACTS OF JAPAN vol. 015, no. 464 (E - 1137) 25 November 1991 (1991-11-25) * |
PATENT ABSTRACTS OF JAPAN vol. 095, no. 002 31 March 1995 (1995-03-31) * |
Also Published As
Publication number | Publication date |
---|---|
MY124915A (en) | 2006-07-31 |
CN1155994C (zh) | 2004-06-30 |
JP3641646B2 (ja) | 2005-04-27 |
ID24404A (id) | 2000-07-20 |
EP1022779A1 (en) | 2000-07-26 |
HK1026770A1 (en) | 2000-12-22 |
SG85684A1 (en) | 2002-01-15 |
US20010029820A1 (en) | 2001-10-18 |
CN1261204A (zh) | 2000-07-26 |
CA2295421A1 (en) | 2000-07-19 |
TW437003B (en) | 2001-05-28 |
KR100366922B1 (ko) | 2003-01-06 |
JP2000216113A (ja) | 2000-08-04 |
US6588308B2 (en) | 2003-07-08 |
KR20000052404A (ko) | 2000-08-25 |
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Legal Events
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PD2B | A search report has been drawn up | ||
SD | Assignments of patents |
Owner name: BESI SINGULATION B.V. |
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TD | Modifications of names of proprietors of patents |
Owner name: BESI PLATING B.V. |
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SD | Assignments of patents |
Owner name: FICO B.V. Effective date: 20081010 |
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TD | Modifications of names of proprietors of patents |
Owner name: FICO SINGULATION B.V. Effective date: 20081010 |
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V1 | Lapsed because of non-payment of the annual fee |
Effective date: 20130801 |