MY193375A - Conductive paste for forming external electrode of multilayer ceramic electronic component - Google Patents

Conductive paste for forming external electrode of multilayer ceramic electronic component

Info

Publication number
MY193375A
MY193375A MYPI2021000470A MYPI2021000470A MY193375A MY 193375 A MY193375 A MY 193375A MY PI2021000470 A MYPI2021000470 A MY PI2021000470A MY PI2021000470 A MYPI2021000470 A MY PI2021000470A MY 193375 A MY193375 A MY 193375A
Authority
MY
Malaysia
Prior art keywords
conductive paste
electronic component
external electrode
multilayer ceramic
ceramic electronic
Prior art date
Application number
MYPI2021000470A
Other languages
English (en)
Inventor
Soichiro ESAKI
Nobuo Nishioka
Hayato TATENO
Original Assignee
Shoei Chemical Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shoei Chemical Ind Co filed Critical Shoei Chemical Ind Co
Publication of MY193375A publication Critical patent/MY193375A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Coils Or Transformers For Communication (AREA)
MYPI2021000470A 2018-08-23 2019-08-20 Conductive paste for forming external electrode of multilayer ceramic electronic component MY193375A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018156627 2018-08-23
PCT/JP2019/032446 WO2020040138A1 (ja) 2018-08-23 2019-08-20 導電性ペースト

Publications (1)

Publication Number Publication Date
MY193375A true MY193375A (en) 2022-10-07

Family

ID=69593293

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2021000470A MY193375A (en) 2018-08-23 2019-08-20 Conductive paste for forming external electrode of multilayer ceramic electronic component

Country Status (6)

Country Link
JP (1) JP6950833B2 (ja)
KR (1) KR102441705B1 (ja)
CN (1) CN112602158B (ja)
MY (1) MY193375A (ja)
TW (1) TWI772671B (ja)
WO (1) WO2020040138A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102545056B1 (ko) * 2021-07-13 2023-06-21 (주)창성 가지형 분말을 적용한 구리페이스트 조성물 및 이를 이용한 세라믹제품
JP7434407B2 (ja) 2022-04-25 2024-02-20 株式会社ノリタケカンパニーリミテド 外部電極用ペースト

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63308803A (ja) * 1987-01-09 1988-12-16 Hitachi Ltd 導電ペーストおよびそれを用いた電子回路部品並びにその製法
JPH05242725A (ja) * 1992-02-27 1993-09-21 Taiyo Yuden Co Ltd 導電性ペースト
JP3206496B2 (ja) * 1997-06-02 2001-09-10 昭栄化学工業株式会社 金属粉末及びその製造方法
JP4789392B2 (ja) * 2002-11-22 2011-10-12 京セラ株式会社 セラミック積層体の製法
JP4291857B2 (ja) * 2007-01-24 2009-07-08 三ツ星ベルト株式会社 銅導体ペースト、導体回路板及び電子部品
JP4807581B2 (ja) * 2007-03-12 2011-11-02 昭栄化学工業株式会社 ニッケル粉末、その製造方法、導体ペーストおよびそれを用いた積層セラミック電子部品
TWI421882B (zh) * 2009-06-08 2014-01-01 Daiken Chemical Co Ltd Barium titanate powder, nickel paste, preparation method and laminated ceramic capacitors
WO2013018408A1 (ja) * 2011-07-29 2013-02-07 株式会社ノリタケカンパニーリミテド 太陽電池用導電性ペースト組成物
JP2013072091A (ja) * 2011-09-26 2013-04-22 Hitachi Cable Ltd 金属微粒子およびその製造方法、金属微粒子を含む金属ペースト、並びに金属ペーストから形成される金属被膜
JP5958749B2 (ja) 2012-06-22 2016-08-02 株式会社村田製作所 金属粉末の製造方法
JP5937904B2 (ja) * 2012-06-26 2016-06-22 株式会社ノリタケカンパニーリミテド 太陽電池電極用ペースト組成物
JP6324253B2 (ja) 2014-07-30 2018-05-16 Ｊｘ金属株式会社 導電性ペースト及びその製造方法
JP2016115448A (ja) * 2014-12-11 2016-06-23 株式会社村田製作所 導電性ペーストおよびセラミック電子部品
JP6354970B2 (ja) * 2015-10-01 2018-07-11 昭栄化学工業株式会社 導電性ペースト及び積層セラミック部品の端子電極形成方法
CN106024095B (zh) * 2016-05-25 2018-05-15 苏州晶银新材料股份有限公司 一种太阳能电池无氧玻璃导电浆料

Also Published As

Publication number Publication date
CN112602158B (zh) 2023-11-28
KR102441705B1 (ko) 2022-09-07
KR20210048503A (ko) 2021-05-03
TW202020895A (zh) 2020-06-01
TWI772671B (zh) 2022-08-01
JPWO2020040138A1 (ja) 2021-06-03
WO2020040138A1 (ja) 2020-02-27
JP6950833B2 (ja) 2021-10-13
CN112602158A (zh) 2021-04-02

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