MY187148A - Resin molding apparatus, resin molding method, discharge mechanism, and discharge apparatus - Google Patents

Resin molding apparatus, resin molding method, discharge mechanism, and discharge apparatus

Info

Publication number
MY187148A
MY187148A MYPI2018701915A MYPI2018701915A MY187148A MY 187148 A MY187148 A MY 187148A MY PI2018701915 A MYPI2018701915 A MY PI2018701915A MY PI2018701915 A MYPI2018701915 A MY PI2018701915A MY 187148 A MY187148 A MY 187148A
Authority
MY
Malaysia
Prior art keywords
fluid resin
storage portion
discharge
resin molding
resin
Prior art date
Application number
MYPI2018701915A
Other languages
English (en)
Inventor
Hanasaka Shuho
Yamada Tetsuya
Iwata Yasuhiro
Gotoh Tomoyuki
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of MY187148A publication Critical patent/MY187148A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
    • B29C31/04—Feeding of the material to be moulded, e.g. into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B29C45/77—Measuring, controlling or regulating of velocity or pressure of moulding material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
MYPI2018701915A 2015-11-30 2016-08-19 Resin molding apparatus, resin molding method, discharge mechanism, and discharge apparatus MY187148A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015232720A JP6549478B2 (ja) 2015-11-30 2015-11-30 吐出装置、樹脂成形装置、吐出方法及び樹脂成型品の製造方法
PCT/JP2016/074208 WO2017094293A1 (ja) 2015-11-30 2016-08-19 樹脂成形装置、樹脂成形方法、吐出機構、及び吐出装置

Publications (1)

Publication Number Publication Date
MY187148A true MY187148A (en) 2021-09-04

Family

ID=58796741

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2018701915A MY187148A (en) 2015-11-30 2016-08-19 Resin molding apparatus, resin molding method, discharge mechanism, and discharge apparatus

Country Status (6)

Country Link
JP (1) JP6549478B2 (zh)
KR (1) KR102158030B1 (zh)
CN (1) CN108290324B (zh)
MY (1) MY187148A (zh)
TW (1) TWI644735B (zh)
WO (1) WO2017094293A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6759176B2 (ja) * 2017-10-31 2020-09-23 Ｔｏｗａ株式会社 ノズル、樹脂成形装置、樹脂成形品の製造方法
CN108212689B (zh) * 2018-03-28 2018-11-20 郑全金 一种高性能的环保型胶粘剂设备
JP7206091B2 (ja) * 2018-10-05 2023-01-17 住友重機械工業株式会社 射出成形機
JP7193376B2 (ja) 2019-02-22 2022-12-20 Ｔｏｗａ株式会社 樹脂成型装置及び樹脂成型品の製造方法
JP7349869B2 (ja) * 2019-10-02 2023-09-25 ミネベアミツミ株式会社 圧力検出装置および良否判断方法
CN114867565B (zh) * 2019-12-24 2023-08-29 三键有限公司 材料涂敷装置
JP7417495B2 (ja) * 2020-08-28 2024-01-18 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品の製造方法
CN112289728A (zh) * 2020-11-03 2021-01-29 谭秀美 一种半导体环氧树脂封装设备

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07320B2 (ja) * 1987-02-25 1995-01-11 株式会社日立製作所 半導体封止用トランスファ成形装置
JP2997285B2 (ja) * 1990-02-27 2000-01-11 松下電器産業株式会社 射出成形機及び射出成形方法
NL1003366C2 (nl) * 1996-06-18 1997-12-19 Fico Bv Inrichting en werkwijze voor het omhullen van produkten.
JP3830453B2 (ja) * 2003-01-15 2006-10-04 ファナック株式会社 射出成形機のモニタ装置
JP2006192371A (ja) 2005-01-13 2006-07-27 Shinwa Shokai:Kk 液体定量吐出装置及びその制御方法
JP4858966B2 (ja) * 2006-11-02 2012-01-18 Ｔｏｗａ株式会社 電子部品の圧縮成形方法及び成形装置
JP5004872B2 (ja) * 2008-05-27 2012-08-22 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止方法
JP4378418B1 (ja) * 2008-09-12 2009-12-09 株式会社小松ライト製作所 成形装置及び成形方法
WO2013021816A1 (ja) * 2011-08-11 2013-02-14 東レ株式会社 離型用ポリアリーレンスルフィドフィルムおよびこれを用いた熱硬化性樹脂成形体の製造方法
JP2013153057A (ja) * 2012-01-25 2013-08-08 Renesas Electronics Corp 半導体装置の製造方法
JP6186113B2 (ja) * 2012-03-26 2017-08-23 住友重機械工業株式会社 射出成形機
TWI588160B (zh) * 2012-10-09 2017-06-21 積水化成品工業股份有限公司 發泡性聚苯乙烯系樹脂粒子及其製造方法、預備發泡粒子及發泡成形體
KR101981837B1 (ko) * 2012-12-21 2019-05-23 도레이 카부시키가이샤 섬유 강화 열가소성 수지 성형품, 섬유 강화 열가소성 수지 성형 재료, 및 섬유 강화 열가소성 수지 성형 재료의 제조 방법
JP6071869B2 (ja) * 2013-12-27 2017-02-01 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形方法
JP6169516B2 (ja) * 2014-03-31 2017-07-26 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形方法
JP6218666B2 (ja) * 2014-04-25 2017-10-25 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形方法

Also Published As

Publication number Publication date
KR20180088835A (ko) 2018-08-07
KR102158030B1 (ko) 2020-09-21
CN108290324B (zh) 2020-07-14
TW201722566A (zh) 2017-07-01
TWI644735B (zh) 2018-12-21
WO2017094293A1 (ja) 2017-06-08
CN108290324A (zh) 2018-07-17
JP6549478B2 (ja) 2019-07-24
JP2017100285A (ja) 2017-06-08

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