MY187148A - Resin molding apparatus, resin molding method, discharge mechanism, and discharge apparatus - Google Patents

Resin molding apparatus, resin molding method, discharge mechanism, and discharge apparatus

Info

Publication number
MY187148A
MY187148A MYPI2018701915A MYPI2018701915A MY187148A MY 187148 A MY187148 A MY 187148A MY PI2018701915 A MYPI2018701915 A MY PI2018701915A MY PI2018701915 A MYPI2018701915 A MY PI2018701915A MY 187148 A MY187148 A MY 187148A
Authority
MY
Malaysia
Prior art keywords
fluid resin
storage portion
discharge
resin molding
resin
Prior art date
Application number
MYPI2018701915A
Inventor
Hanasaka Shuho
Yamada Tetsuya
Iwata Yasuhiro
Gotoh Tomoyuki
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of MY187148A publication Critical patent/MY187148A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
    • B29C31/04—Feeding of the material to be moulded, e.g. into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B29C45/77—Measuring, controlling or regulating of velocity or pressure of moulding material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

There is provided a configuration that has a simple structure and a reduced size and discharges a fluid resin in a stable manner. A resin molding apparatus (1) includes: a delivery mechanism (27), provided in a supply mechanism (19), configured to deliver a fluid resin (30); a storage portion (28), connected to the delivery mechanism, configured to store the fluid resin; a discharge portion (29), connected to the storage portion, configured to discharge the fluid resin; a rotation mechanism (31) provided in the delivery mechanism; a movement member (35) configured to move forward and backward along an inner wall of the storage portion based on rotation of the rotation mechanism, and thereby press the fluid resin stored in the storage portion; a detection portion (39) configured to detect a torque value applied to the rotation mechanism via the movement member due to a resin pressure of the fluid resin in the storage portion; and a controller (22) configured to control a movement speed of the movement member or a rotation speed of the rotation mechanism based on the detected torque value. The controller controls the movement member to move forward and then stop, and subsequently to move backward, thereby controls an amount of supply of the fluid resin supplied to an accommodation portion. Figure 3
MYPI2018701915A 2015-11-30 2016-08-19 Resin molding apparatus, resin molding method, discharge mechanism, and discharge apparatus MY187148A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015232720A JP6549478B2 (en) 2015-11-30 2015-11-30 Discharge device, resin molding device, discharge method, and method of manufacturing resin molded product
PCT/JP2016/074208 WO2017094293A1 (en) 2015-11-30 2016-08-19 Resin molding apparatus, resin molding method, ejection mechanism, and ejection apparatus

Publications (1)

Publication Number Publication Date
MY187148A true MY187148A (en) 2021-09-04

Family

ID=58796741

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2018701915A MY187148A (en) 2015-11-30 2016-08-19 Resin molding apparatus, resin molding method, discharge mechanism, and discharge apparatus

Country Status (6)

Country Link
JP (1) JP6549478B2 (en)
KR (1) KR102158030B1 (en)
CN (1) CN108290324B (en)
MY (1) MY187148A (en)
TW (1) TWI644735B (en)
WO (1) WO2017094293A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6759176B2 (en) * 2017-10-31 2020-09-23 Ｔｏｗａ株式会社 Nozzle, resin molding equipment, manufacturing method of resin molded products
CN108212689B (en) * 2018-03-28 2018-11-20 郑全金 A kind of high-performance environmentally-friendly type adhesive equipment
JP7206091B2 (en) * 2018-10-05 2023-01-17 住友重機械工業株式会社 Injection molding machine
JP7193376B2 (en) * 2019-02-22 2022-12-20 Ｔｏｗａ株式会社 RESIN MOLDING APPARATUS AND RESIN MOLDED PRODUCT MANUFACTURING METHOD
JP7349869B2 (en) * 2019-10-02 2023-09-25 ミネベアミツミ株式会社 Pressure detection device and pass/fail judgment method
US11911789B2 (en) 2019-12-24 2024-02-27 Threebond Co., Ltd. Material application device and pushing member
JP7417495B2 (en) * 2020-08-28 2024-01-18 Ｔｏｗａ株式会社 Resin molding equipment and method for manufacturing resin molded products
CN112289728A (en) * 2020-11-03 2021-01-29 谭秀美 Semiconductor epoxy resin encapsulation equipment

Family Cites Families (16)

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JPH07320B2 (en) * 1987-02-25 1995-01-11 株式会社日立製作所 Transfer molding equipment for semiconductor encapsulation
JP2997285B2 (en) * 1990-02-27 2000-01-11 松下電器産業株式会社 Injection molding machine and injection molding method
NL1003366C2 (en) * 1996-06-18 1997-12-19 Fico Bv Apparatus and method for encapsulating products.
JP3830453B2 (en) * 2003-01-15 2006-10-04 ファナック株式会社 Monitor for injection molding machine
JP2006192371A (en) 2005-01-13 2006-07-27 Shinwa Shokai:Kk Quantitative liquid discharge apparatus and its controlling method
JP4858966B2 (en) * 2006-11-02 2012-01-18 Ｔｏｗａ株式会社 Electronic component compression molding method and molding apparatus
JP5004872B2 (en) * 2008-05-27 2012-08-22 Ｔｏｗａ株式会社 Resin sealing device and resin sealing method
JP4378418B1 (en) * 2008-09-12 2009-12-09 株式会社小松ライト製作所 Molding apparatus and molding method
WO2013021816A1 (en) * 2011-08-11 2013-02-14 東レ株式会社 Mold release polyarylene sulfide film and manufacturing method for thermally hardened resin formed body using same
JP2013153057A (en) * 2012-01-25 2013-08-08 Renesas Electronics Corp Manufacturing method of semiconductor device
JP6186113B2 (en) * 2012-03-26 2017-08-23 住友重機械工業株式会社 Injection molding machine
TWI588160B (en) * 2012-10-09 2017-06-21 積水化成品工業股份有限公司 Foaming polystyrene resin particle and manufacturing method thereof, pre-foamed particle and foamed molded article
EP3473665B1 (en) * 2012-12-21 2020-08-12 Toray Industries, Inc. Fiber-reinforced thermoplastic-resin molding material and method for manufacturing fiber-reinforced thermoplastic-resin molding material
JP6071869B2 (en) * 2013-12-27 2017-02-01 Ｔｏｗａ株式会社 Resin molding apparatus and resin molding method
JP6169516B2 (en) * 2014-03-31 2017-07-26 Ｔｏｗａ株式会社 Resin molding apparatus and resin molding method
JP6218666B2 (en) * 2014-04-25 2017-10-25 Ｔｏｗａ株式会社 Resin molding apparatus and resin molding method

Also Published As

Publication number Publication date
CN108290324B (en) 2020-07-14
KR102158030B1 (en) 2020-09-21
KR20180088835A (en) 2018-08-07
TWI644735B (en) 2018-12-21
JP6549478B2 (en) 2019-07-24
WO2017094293A1 (en) 2017-06-08
JP2017100285A (en) 2017-06-08
CN108290324A (en) 2018-07-17
TW201722566A (en) 2017-07-01

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