CN112289728A - Semiconductor epoxy resin encapsulation equipment - Google Patents
Semiconductor epoxy resin encapsulation equipment Download PDFInfo
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- CN112289728A CN112289728A CN202011212482.9A CN202011212482A CN112289728A CN 112289728 A CN112289728 A CN 112289728A CN 202011212482 A CN202011212482 A CN 202011212482A CN 112289728 A CN112289728 A CN 112289728A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
Abstract
The invention discloses semiconductor epoxy resin packaging equipment which comprises a packaging machine body, wherein the upper end surface of the packaging machine body is communicated with a packaging cavity with an upward opening, a pulley cavity is arranged at the lower side of the packaging cavity, a transmission device is arranged in the pulley cavity, control cavities are symmetrically arranged at the left side and the right side of the packaging cavity at the upper side of the pulley cavity, and a main rotating shaft penetrating through the upper wall surface and the lower wall surface at the left side of the pulley cavity is rotationally arranged on the lower wall surface at the left side of the control cavity at the left side; according to the invention, the semiconductor element is placed in the equipment, the semiconductor is positioned by using the pins of the semiconductor, the coverage of the epoxy resin can be effectively controlled by combining the lifting of the upper pressing plate and the release of the epoxy resin, the quality of the cured epoxy resin is effectively improved by the accelerated curing treatment of the epoxy resin, the packaging time of the semiconductor is shortened, the condition that the service life of the semiconductor is influenced by vibration and oxidation is effectively enhanced, and the quality of the semiconductor is improved.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a semiconductor epoxy resin packaging device.
Background
Semiconductor package covers the circuit of arranging on the semiconductor, the effectual contact of avoiding semiconductor circuit and air, reduce the ageing speed of circuit, the semiconductor after the encapsulation can deal with comparatively abominable operational environment simultaneously, the life of effectual extension semiconductor, among the current semiconductor package technique, because the semiconductor is small, the quality is light, difficult fixed in the packaging process, cause the semiconductor to take place to remove when the encapsulation, influence semiconductor package thickness, and then influence the heat dissipation of semiconductor, also can influence the subsequent installation of semiconductor simultaneously, semiconductor package in-process thickness is inhomogeneous, produce great influence to the encapsulation of product.
Disclosure of Invention
The invention aims to provide a semiconductor epoxy resin packaging device, which solves the problem that a semiconductor is easy to move during packaging.
The invention is realized by the following technical scheme.
The invention relates to a semiconductor epoxy resin packaging device, which comprises a packaging machine body, wherein the upper end surface of the packaging machine body is communicated with a packaging cavity with an upward opening, a pulley cavity is arranged at the lower side of the packaging cavity, a transmission device is arranged in the pulley cavity, control cavities are symmetrically arranged at the left side and the right side of the packaging cavity at the upper side of the pulley cavity, the lower wall surface of the control cavity at the left side is rotatably provided with a main rotating shaft penetrating through the upper wall surface and the lower wall surface at the left side of the pulley cavity, the lower wall surface of the control cavity at the right side is rotatably provided with an auxiliary rotating shaft extending to the right side of the pulley cavity, the upper end surface of the main rotating shaft is communicated with a main rotating cavity with an upward opening, the upper end surface of the auxiliary rotating shaft is communicated with an auxiliary rotating cavity with an upward opening, an epoxy resin storage cavity is arranged between the control cavity at the left side and the packaging cavity, epoxy resin, an upper pressure plate capable of sliding up and down is arranged in the upper pressure plate groove, a sealing plate is fixedly arranged on the inner wall surface of the lower side of the packaging cavity, pin through holes which are bilaterally symmetrical are communicated between the upper end surface and the lower end surface of the sealing plate between the pin through holes on the left side and the right side, a dismounting through hole is communicated between the upper end surface and the lower end surface of the sealing plate, a pushing cavity extending downwards is communicated with the lower end surface of the packaging cavity at the position corresponding to the dismounting through hole, a pushing head capable of moving up and down is arranged in the pushing cavity, a semiconductor can be placed at the upper end of the sealing plate, a plurality of pins are fixedly arranged on the left end surface and the right end surface of the semiconductor, the pins can pass through the pin through holes at the corresponding positions, a lifting rod capable of moving up and down is in threaded fit with the inner part of the main rotating, the lower end face of the accelerated curing block is communicated with a curing cavity with a downward opening, and an epoxy resin curing device is arranged in the curing cavity.
Preferably, a lifting motor is fixedly arranged in the packaging machine body at a position corresponding to the lower end of the main rotating shaft, the lower end of the main rotating shaft is in power connection with the upper end face of the lifting motor, a driving pulley is fixedly arranged on the outer circular surface of the main rotating shaft and located in the pulley cavity, a driven pulley is fixedly arranged at the lower end of the auxiliary rotating shaft, and a transmission belt is wound between the driving pulley and the driven pulley.
Preferably, one end face of the lifting rod, which is far away from the shaft center of the pushing head, is provided with a lifting groove with an outward opening, the inner wall surface of the control cavity, which corresponds to the lifting groove, is fixedly provided with a lifting support rod, and one end of the lifting support rod, which is close to the shaft center of the pushing head, can extend into the lifting groove.
Preferably, the left side control chamber downside internal face intercommunication is equipped with annular supply chamber, with supply chamber corresponds the position main rotation intracavity face with the control hole that the intercommunication was equipped with four annular array between the outer disc of main axis of rotation, the control hole is inside to be equipped with can be along being close to or keeping away from the control lever that main axis of rotation axle center direction removed, with the control hole corresponds the position the inside annular array of main axis of rotation is equipped with four and resets the chamber, with the chamber that resets corresponds the position the outer disc of control lever is fixed and is equipped with the reset plate, the reset plate is kept away from main axis of rotation axle center a side end face and same position the chamber that resets is kept away from fixedly be equipped with reset spring between the main axis of rotation axle center a side wall.
Preferably, the epoxy deposits and is equipped with the intake pipe between chamber upper wall and the external world in the intercommunication, the intake pipe can to epoxy deposits the intracavity and supplies high-pressure gas all the time, epoxy deposit the chamber lower wall with the closure plate upside the intercommunication is equipped with the epoxy transfer passage between the encapsulation chamber right wall, the epoxy transfer passage can with epoxy deposits the intracavity portion epoxy carry extremely the encapsulation intracavity, epoxy deposits the chamber downside epoxy transfer passage with supply and be equipped with the switching passageway between the chamber right wall, switching passageway inside be equipped with can with epoxy transfer passage confined device.
Preferably, a supply plate capable of sliding left and right is arranged between the upper wall surface and the lower wall surface of one side, close to the axis of the main rotating shaft, of the supply cavity at a position corresponding to the opening and closing channel, the right end of the control rod at the right side is abutted against the left end surface of the supply plate, a push block extending into the opening and closing channel is fixedly arranged on the right end surface of the supply plate, a push rod extending right is fixedly arranged on the right end surface of the push block, a sealing block capable of sealing the epoxy resin conveying channel is fixedly arranged on the right end of the push rod, a supply spring is fixedly arranged between the right end surface of the supply plate and the wall surface of the supply cavity at the corresponding position, a secondary closed cavity communicated with the epoxy resin conveying channel is arranged on the right side of the packaging cavity, a secondary closed electromagnet is fixedly arranged on the upper wall surface of the secondary closed cavity, the epoxy resin conveying channel can be sealed when the secondary sealing baffle is at the lower limit, and a secondary sealing spring is fixedly arranged between the upper end face of the secondary sealing baffle and the upper wall face of the secondary sealing cavity.
Preferably, the fixed top board branch that is equipped with bilateral symmetry and upwards extends of top board up end, the fixed thickness inductor that is equipped with of top board lower extreme terminal surface, the thickness inductor can respond to semiconductor upside epoxy covers thickness, the left and right sides top board branch upper end with terminal surface fixed connection under the solidification piece with higher speed, with the solidification chamber corresponds the position be equipped with higher speed under the solidification piece terminal surface fixed time can with solidification chamber confined lamp shade, the fixed plate that is equipped with of solidification intracavity wall, the fixed ultraviolet lamp that is equipped with of terminal surface under the fixed plate, ultraviolet lamp can take place the purple light and solidify with higher speed epoxy when circular telegram.
Preferably, wall intercommunication is equipped with downwardly extending's the chamber that triggers under the top board groove, it is equipped with the trigger plate that can reciprocate to trigger intracavity wall face, the fixed trigger bar that upwards extends that is equipped with of trigger plate up end, the fixed trigger block that is equipped with of trigger chamber lower wall face, terminal surface and homonymy under the trigger plate trigger fixedly between the chamber lower wall face and be equipped with trigger spring, under the trigger block terminal surface with fixedly connected with wire between the fixed plate up end, trigger plate with can put through when triggering the block contact ultraviolet lamp's power, the fixed propelling movement electromagnetic core that is equipped with of propelling movement chamber lower wall face, propelling movement head lower terminal surface with fixedly be equipped with propelling movement electromagnetic spring between the propelling movement chamber lower wall face, the epoxy after the propelling movement head can assist the solidification dismantles.
The invention has the beneficial effects that: according to the invention, the semiconductor element is placed in the equipment, the semiconductor is positioned by using the pins of the semiconductor, the coverage of the epoxy resin can be effectively controlled by combining the lifting of the upper pressing plate and the release of the epoxy resin, the quality of the cured epoxy resin is effectively improved by the accelerated curing treatment of the epoxy resin, the packaging time of the semiconductor is shortened, the condition that the service life of the semiconductor is influenced by vibration and oxidation is effectively enhanced, and the quality of the semiconductor is improved.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the invention, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.
FIG. 1 is a schematic structural diagram of an embodiment of the present invention;
FIG. 2 is an enlarged schematic view of the embodiment of the present invention at A in FIG. 1;
FIG. 3 is an enlarged schematic view of the embodiment of the present invention at B in FIG. 1;
FIG. 4 is an enlarged schematic view of the embodiment of the present invention at C in FIG. 1;
FIG. 5 is an enlarged schematic view of the embodiment of the present invention at D in FIG. 1;
FIG. 6 is a schematic structural diagram at E-E in FIG. 2 according to an embodiment of the present invention.
Detailed Description
The invention will now be described in detail with reference to fig. 1-6, wherein for ease of description the orientations described hereinafter are now defined as follows: the up, down, left, right, and front-back directions described below correspond to the up, down, left, right, and front-back directions in the projection relationship of fig. 1 itself.
The semiconductor epoxy resin packaging equipment described by combining the attached drawings 1-6 comprises a packaging machine body 11, wherein the upper end surface of the packaging machine body 11 is communicated with a packaging cavity 12 with an upward opening, a pulley cavity 13 is arranged on the lower side of the packaging cavity 12, a transmission device is arranged in the pulley cavity 13, control cavities 15 are symmetrically arranged on the left side and the right side of the packaging cavity 12 on the upper side of the pulley cavity 13, a main rotating shaft 18 penetrating through the upper wall surface and the lower wall surface of the left side of the pulley cavity 13 is rotatably arranged on the lower wall surface of the left side of the control cavity 15, an auxiliary rotating shaft 19 extending to the right side of the pulley cavity 13 is rotatably arranged on the lower wall surface of the right side of the control cavity 15, a main rotating cavity 26 with an upward opening is communicated with the upper end surface of the main rotating shaft 18, an auxiliary rotating cavity 20 with an upward opening is communicated with the upper end surface of the auxiliary rotating shaft 19, an, epoxy resin is stored in the epoxy resin storage cavity 16, the left wall surface and the right wall surface of the packaging cavity 12 are respectively communicated with an upper pressure plate groove 57 with an inward opening, an upper pressure plate 58 capable of sliding up and down is arranged in the upper pressure plate groove 57, a sealing plate 48 is fixedly arranged on the inner wall surface of the lower side of the packaging cavity 12, pin through holes 49 which are symmetrical left and right are communicated and arranged between the upper end surface and the lower end surface of the sealing plate 48 between the pin through holes 49 at the left side and the right side, a disassembly through hole 50 is communicated and arranged between the upper end surface and the lower end surface of the sealing plate 48 at the left side and the right side, a pushing cavity 53 extending downwards is communicated and arranged on the lower wall surface of the packaging cavity 12 corresponding to the disassembly through hole 50, a pushing head 54 capable of moving up and down is arranged in the pushing cavity 53, a semiconductor 51 can be placed on the upper end surface of, vice chamber 20 that rotates with the main lifter 21 that has the ability to reciprocate that rotates 26 inside screw-thread fit in chamber, lifter 21 upper end is fixed and is equipped with lifter plate 24, lifter plate 24 is close to fixedly between the terminal surface with one side each other and is equipped with solidification piece 25 with higher speed, the terminal surface intercommunication is equipped with the decurrent solidification chamber 30 of opening under the solidification piece 25 with higher speed, the inside epoxy solidification equipment that is equipped with of solidification chamber 30.
Advantageously, a lifting motor 14 is fixedly disposed in the enclosure body 11 at a position corresponding to the lower end of the main rotating shaft 18, the lower end of the main rotating shaft 18 is in power connection with the upper end surface of the lifting motor 14, a driving pulley 27 is fixedly disposed on the outer circumferential surface of the main rotating shaft 18 inside the pulley cavity 13, a driven pulley 28 is fixedly disposed at the lower end of the auxiliary rotating shaft 19, and a transmission belt 29 is wound between the driving pulley 27 and the driven pulley 28.
Beneficially, an end face of one side of the lifting rod 21, which is away from the axis of the pushing head 54, is provided with a lifting groove 22 with an outward opening, a lifting support rod 23 is fixedly arranged on an inner wall surface of the control cavity 15 at a position corresponding to the lifting groove 22, and one end of the lifting support rod 23, which is close to the axis of the pushing head 54, can extend into the lifting groove 22.
Beneficially, an annular replenishment cavity 37 is communicated with the inner wall surface of the lower side of the control cavity 15 on the left side, four control holes 44 in annular arrays are communicated between the inner wall surface of the main rotating cavity 26 at a position corresponding to the replenishment cavity 37 and the outer circumferential surface of the main rotating shaft 18, a control rod 46 capable of moving along the direction close to or away from the axis of the main rotating shaft 18 is arranged inside the control hole 44, four reset cavities 43 are arranged in annular arrays inside the main rotating shaft 18 at a position corresponding to the control holes 44, a reset plate 45 is fixedly arranged on the outer circumferential surface of the control rod 46 at a position corresponding to the reset cavities 43, and a reset spring 47 is fixedly arranged between one side end surface of the reset plate 45 away from the axis of the main rotating shaft 18 and one side wall surface of the reset cavity 43 away from the axis of the main rotating.
Beneficially, an air inlet pipe 17 is communicated between the upper wall surface of the epoxy resin storage cavity 16 and the outside, the air inlet pipe 17 can supply high-pressure air into the epoxy resin storage cavity 16 all the time, an epoxy resin conveying channel 35 is communicated between the lower wall surface of the epoxy resin storage cavity 16 and the right wall surface of the packaging cavity 12 on the upper side of the closing plate 48, the epoxy resin conveying channel 35 can convey epoxy resin in the epoxy resin storage cavity 16 into the packaging cavity 12, an opening and closing channel 36 is communicated between the epoxy resin conveying channel 35 on the lower side of the epoxy resin storage cavity 16 and the right wall surface of the supply cavity 37, and a device capable of closing the epoxy resin conveying channel 35 is arranged in the opening and closing channel 36.
Beneficially, a replenishment plate 38 capable of sliding left and right is disposed between the upper and lower wall surfaces of the replenishment chamber 37 at a position corresponding to the opening and closing passage 36 and on a side close to the axis of the main rotating shaft 18, a right end of the control rod 46 at a right side is abutted against a left end surface of the replenishment plate 38, a push block 39 extending into the opening and closing passage 36 is fixedly disposed on a right end surface of the replenishment plate 38, a push rod 41 extending rightward is fixedly disposed on a right end surface of the push block 39, a sealing block 42 capable of sealing the epoxy resin conveying passage 35 is fixedly disposed on a right end of the push rod 41, a replenishment spring 40 is fixedly disposed between the right end surface of the replenishment plate 38 and the wall surface of the replenishment chamber 37 at a corresponding position, a secondary sealing chamber 65 communicated with the epoxy resin conveying passage 35 is disposed on a right side of the packaging chamber 12, and a secondary sealing electromagnet 67 is fixedly disposed on, the lower end of the secondary closed cavity 65 is provided with a secondary closed baffle 66 capable of moving up and down, the epoxy resin conveying passage 35 can be closed when the secondary closed baffle 66 is at the lower limit, and a secondary closed spring 68 is fixedly arranged between the upper end face of the secondary closed baffle 66 and the upper wall face of the secondary closed cavity 65.
Beneficially, the fixed upper plate branch 60 that is equipped with bilateral symmetry and upwards extends of upper plate 58 up end, the fixed thickness inductor 59 that is equipped with of upper plate 58 lower terminal surface, the thickness inductor 59 can respond to semiconductor 51 upside epoxy covers thickness, the left and right sides upper plate branch 60 upper end with terminal surface fixed connection under the solidification piece 25 accelerates, with the solidification chamber 30 corresponds the position be equipped with during the terminal surface is fixed under the solidification piece 25 with higher speed can with solidification chamber 30 confined lamp shade 31, the fixed plate 32 that is equipped with of solidification chamber 30 internal face, the fixed ultraviolet lamp 33 that is equipped with of terminal surface under the fixed plate 32, ultraviolet lamp 33 can take place the solidification of purple light acceleration epoxy when circular telegram.
Advantageously, the lower wall surface of the upper pressure plate groove 57 is communicated with a trigger cavity 61 extending downwards, the inner wall surface of the trigger cavity 61 is provided with a trigger plate 62 capable of moving upwards and downwards, the upper end surface of the trigger plate 62 is fixedly provided with a trigger rod 63 extending upwards, the lower wall surface of the trigger cavity 61 is fixedly provided with a trigger block 69, a trigger spring 64 is fixedly arranged between the lower end surface of the trigger plate 62 and the lower wall surface of the trigger cavity 61 on the same side, a lead 34 is fixedly connected between the lower end surface of the trigger block 69 and the upper end surface of the fixing plate 32, the trigger plate 62 can turn on the power of the ultraviolet lamp 33 when contacting the trigger block 69, the lower wall surface of the pushing cavity 53 is fixedly provided with a pushing electromagnetic iron core 55, a pushing electromagnetic spring 56 is fixedly arranged between the lower end surface of the pushing head 54 and the lower wall surface of the pushing cavity 53, and the pushing head 54 can assist in disassembling cured epoxy resin.
In an initial state, the lifting rod 21 and the lifting plate 24 are at upper limit positions, the reset plate 45 and the control rod 46 are at one side close to the axis of the main rotating shaft 18, the replenishment plate 38 is at a left limit position, the sealing block 42 is at a left limit position, the pushing cavity 53 and the secondary sealing spring 68 are in a compressed state, the pushing head 54 is at a lower limit position, the pushing electromagnetic core 55 and the secondary sealing electromagnet 67 are in an energized state, the upper pressure plate 58 is at an upper limit position, the trigger plate 62 and the trigger block 69 are in a contact-free state, and the secondary sealing baffle 66 is at an upper limit position.
The semiconductor 51 is held to enable the pins 52 to correspond to the corresponding pin through holes 49 and to be placed downwards, the lifting motor 14 is driven to rotate forwards, the main rotating shaft 18 is driven to rotate, the driving belt wheel 27 is driven to rotate, the driven belt wheel 28 is driven to rotate through the driving belt 29, the auxiliary rotating shaft 19 is driven to rotate, the lifting rod 21 in threaded fit is driven to move downwards, the lifting plate 24 and the accelerated curing block 25 are driven to move downwards, the upper pressing plate 58 is pushed to move downwards along the upper pressing plate groove 57 under the action of the upper pressing plate supporting rod 60, when the lower end surface of the upper pressing plate 58 is in contact with the triggering rod 63 and pushes the triggering plate 62 to compress the triggering spring 64 to move downwards, the triggering plate 62 is abutted against the triggering block 69, the driving of the lifting motor 14 is disconnected, the fixing plate 32 is powered through the lead 34, the ultraviolet lamp 33 is enabled to emit ultraviolet light, and meanwhile, the left lifting rod, and the left lifting rod 21 is abutted against the control rod 46, so as to push the control rod 46 and the reset plate 45 to move towards the side far away from the axle center of the main rotating shaft 18, thereby pushing the supply plate 38 and the pushing block 39 to move to the right, further pushing the closing block 42 to move to the right through the pushing rod 41, and the epoxy resin in the epoxy resin storage chamber 16 flows into the packaging chamber 12 through the epoxy resin delivery passage 35 and covers the semiconductor 51, and the supply spring 40 and the return spring 47 are in a compressed state, when the epoxy resin coating of the upper side of the semiconductor 51 is completed, the secondary closing electromagnet 67 is controlled to be deenergized by the induction of the thickness sensor 59, then the secondary sealing baffle 66 is pushed to move downwards under the action of the elasticity of the secondary sealing spring 68, so as to seal the epoxy resin conveying channel 35, and then the supply of the epoxy resin to the interior of the package chamber 12 is stopped, and the curing of the epoxy resin is accelerated under the irradiation of the ultraviolet light.
After the epoxy resin is cured, the lifting motor 14 is driven to rotate reversely, so as to drive the main rotating shaft 18 to rotate reversely, so as to drive the driving pulley 27 to rotate, so as to drive the driven pulley 28 to rotate reversely through the transmission belt 29, so as to drive the auxiliary rotating shaft 19 to rotate reversely, so as to drive the lifting rod 21 to move upwards through screw-thread fit, so as to drive the lifting plate 24 and the accelerated curing block 25 to move upwards, so as to drive the upper pressing plate support rod 60 and the upper pressing plate 58 to move upwards, at this time, the thickness sensor 59 is separated from the epoxy resin in the packaging cavity 12, so as to supply power to the secondary sealing electromagnet 67, so as to generate magnetic force to attract the secondary sealing baffle 66 to compress the secondary sealing spring 68 to reset upwards, so as to open the epoxy resin conveying channel 35, and when the left lifting rod 21 is separated from the control rod 46, so as to further push the, at this time, the supply plate 38 is pushed to move leftwards and reset under the elastic force of the supply spring 40, so that the push block 39 and the sealing block 42 are driven to move rightwards, the epoxy resin conveying channel 35 is sealed again, when the lifting rod 21 moves to the upper limit, the power of the pushing electromagnetic core 55 is cut off, the pushing head 54 is pushed upwards under the elastic force of the pushing electromagnetic spring 56, the packaged semiconductor element is pushed upwards, the semiconductor element is packaged, the pushing head 54 is compressed by the pushing electromagnetic spring 56 to move downwards through the re-energization of the pushing electromagnetic core 55, and the whole device is restored to the initial state.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.
Claims (8)
1. The utility model provides a semiconductor epoxy encapsulation equipment, includes the encapsulation organism, its characterized in that: the upper end surface of the packaging machine body is communicated with a packaging cavity with an upward opening, a belt wheel cavity is arranged at the lower side of the packaging cavity, a transmission device is arranged in the belt wheel cavity, control cavities are symmetrically arranged at the left side and the right side of the packaging cavity at the upper side of the belt wheel cavity, a main rotating shaft penetrating through the upper wall surface and the lower wall surface at the left side of the belt wheel cavity is arranged on the lower wall surface of the control cavity at the left side in a rotating manner, an auxiliary rotating shaft extending to the right side of the belt wheel cavity is arranged on the lower wall surface of the control cavity at the right side in a rotating manner, a main rotating cavity with an upward opening is arranged on the upper end surface of the main rotating shaft in a communicating manner, an auxiliary rotating cavity with an upward opening is arranged on the upper end surface of the auxiliary rotating shaft in a communicating manner, an epoxy resin storage cavity is arranged between the control cavity at the left side and the packaging cavity, a sealing plate is fixedly arranged on the inner wall surface of the lower side of the packaging cavity, pin through holes which are bilaterally symmetrical are communicated between the upper end surface and the lower end surface of the sealing plate between the pin through holes on the left side and the right side, a dismounting through hole is communicated between the upper end surface and the lower end surface of the sealing plate between the pin through holes on the left side and the right side, a pushing cavity which extends downwards is communicated with the lower end surface of the packaging cavity at the position corresponding to the dismounting through hole, a pushing head which can move up and down is arranged in the pushing cavity, a semiconductor can be placed at the upper end of the sealing plate, a plurality of pins are fixedly arranged on the left end surface and the right end surface of the semiconductor, the pins can pass through the pin through holes at the corresponding positions, a lifting rod which can move up and down is in threaded fit with the inner part of the main rotating cavity, a lifting plate is, and an epoxy resin curing device is arranged in the curing cavity.
2. A semiconductor epoxy resin encapsulation apparatus according to claim 1, wherein: the packaging machine body is internally and fixedly provided with a lifting motor at a position corresponding to the lower end of the main rotating shaft, the lower end of the main rotating shaft is in power connection with the upper end face of the lifting motor, a driving belt wheel is fixedly arranged on the outer circular surface of the main rotating shaft and positioned in the belt wheel cavity, a driven belt wheel is fixedly arranged at the lower end of the auxiliary rotating shaft, and a transmission belt is wound between the driving belt wheel and the driven belt wheel.
3. A semiconductor epoxy resin encapsulation apparatus according to claim 1, wherein: the end face of one side of the lifting rod, which is far away from the shaft center of the pushing head, is provided with a lifting groove with an outward opening, the inner wall surface of the control cavity, which corresponds to the lifting groove, is fixedly provided with a lifting support rod, and one end of the lifting support rod, which is close to the shaft center of the pushing head, can extend into the lifting groove.
4. A semiconductor epoxy resin encapsulation apparatus according to claim 1, wherein: the left side control chamber downside internal face intercommunication is equipped with annular supply chamber, with supply the chamber and correspond the position main rotation intracavity face with the control hole that the intercommunication was equipped with four annular array between the outer disc of main axis of rotation, the control hole is inside to be equipped with can be along being close to or keeping away from the control lever that main axis of rotation axle center direction removed, with the control hole corresponds the position the inside annular array of main axis of rotation is equipped with four and resets the chamber, with the chamber that resets corresponds the position the outer disc of control lever is fixed and is equipped with the board that resets, it keeps away from to reset the board main axis of rotation axle center a side end face and same position the chamber that resets is kept away from fixedly between the main axis of rotation axle center a side wall face is.
5. A semiconductor epoxy resin encapsulation apparatus according to claim 1, wherein: epoxy deposits and communicates between chamber upper wall and the external world and be equipped with the intake pipe, the intake pipe can to epoxy deposits intracavity and supplies high-pressure gas always, epoxy deposit under the chamber wall with the closure plate upside the intercommunication is equipped with the epoxy transfer passage between the encapsulation chamber right wall, the epoxy transfer passage can with epoxy deposits the epoxy of intracavity portion and carries extremely the encapsulation intracavity, epoxy deposits the chamber downside the epoxy transfer passage with it is equipped with the switching passageway to supply to communicate between the chamber right wall, switching passageway inside be equipped with can with epoxy transfer passage confined device.
6. A semiconductor epoxy resin encapsulation apparatus according to claim 5, wherein: a supply plate capable of sliding left and right is arranged between the upper wall surface and the lower wall surface of one side, close to the axis of the main rotating shaft, of the supply cavity at a position corresponding to the opening and closing channel, the right end of the control rod at the right side is abutted against the left end surface of the supply plate, a push block extending into the opening and closing channel is fixedly arranged on the right end surface of the supply plate, a push rod extending right is fixedly arranged on the right end surface of the push block, a sealing block capable of sealing the epoxy resin conveying channel is fixedly arranged on the right end of the push rod, a supply spring is fixedly arranged between the right end surface of the supply plate and the wall surface of the supply cavity at the corresponding position, a secondary sealing cavity communicated with the epoxy resin conveying channel is arranged on the right side of the packaging cavity, a secondary sealing electromagnet is fixedly arranged on the upper wall surface of the secondary sealing, the epoxy resin conveying channel can be sealed when the secondary sealing baffle is at the lower limit, and a secondary sealing spring is fixedly arranged between the upper end face of the secondary sealing baffle and the upper wall face of the secondary sealing cavity.
7. A semiconductor epoxy resin encapsulation apparatus according to claim 1, wherein: the fixed top board branch that is equipped with bilateral symmetry and upwards extends of top board up end, the fixed thickness inductor that is equipped with of top board lower extreme end, the thickness inductor can respond to semiconductor upside epoxy covers thickness, the left and right sides top board branch upper end with terminal surface fixed connection under the solidification piece with higher speed, with the solidification chamber corresponds the position be equipped with higher speed under the solidification piece terminal surface fixed time can with solidification chamber confined lamp shade, the fixed plate that is equipped with of solidification intracavity wall surface, the fixed ultraviolet lamp that is equipped with of terminal surface under the fixed plate, the ultraviolet lamp can take place the epoxy solidification with higher speed of purple light when circular telegram.
8. A semiconductor epoxy resin encapsulation apparatus according to claim 1, wherein: wall intercommunication is equipped with downwardly extending's the chamber that triggers under the top board groove, it is equipped with the trigger plate that can reciprocate to trigger intracavity wall face, the fixed trigger bar that upwards extends that is equipped with of trigger plate up end, the fixed trigger block that is equipped with of trigger chamber lower wall face, terminal surface and homonymy under the trigger plate trigger fixedly between the chamber lower wall face and be equipped with trigger spring, under the trigger block terminal surface with fixedly connected with wire between the fixed plate up end, trigger plate with can the switch-on when triggering the block contact ultraviolet lamp's power, the fixed propelling movement electromagnetic core that is equipped with of propelling movement chamber lower wall face, propelling movement head lower extreme face with fixedly be equipped with propelling movement electromagnetic spring between the propelling movement chamber lower wall face, the epoxy after the propelling movement head can assist the solidification dismantles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011212482.9A CN112289728A (en) | 2020-11-03 | 2020-11-03 | Semiconductor epoxy resin encapsulation equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011212482.9A CN112289728A (en) | 2020-11-03 | 2020-11-03 | Semiconductor epoxy resin encapsulation equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112289728A true CN112289728A (en) | 2021-01-29 |
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| CN202011212482.9A Withdrawn CN112289728A (en) | 2020-11-03 | 2020-11-03 | Semiconductor epoxy resin encapsulation equipment |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113394201A (en) * | 2021-06-21 | 2021-09-14 | 李琴 | Multi-chip integrated circuit packaging structure |
| CN115602581A (en) * | 2022-11-01 | 2023-01-13 | 今上半导体（信阳）有限公司（Cn） | Power semiconductor packaging device |
| CN116598214A (en) * | 2023-05-13 | 2023-08-15 | 江苏爱矽半导体科技有限公司 | Packaging structure of power semiconductor device |
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| CN204461670U (en) * | 2015-03-04 | 2015-07-08 | 苏州敏芯微电子技术有限公司 | A kind of pressure sensor packaging structure |
| CN105097561A (en) * | 2014-05-09 | 2015-11-25 | 东部Hitek株式会社 | Method of Packaging Semiconductor Devices and Apparatus for Performing the Same |
| CN108290324A (en) * | 2015-11-30 | 2018-07-17 | 东和株式会社 | Resin molding apparatus, resin molding method, output mechanism and discharger |
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| CN1482657A (en) * | 2002-08-08 | 2004-03-17 | 爱立发株式会社 | Resin solidifying system |
| CN102810489A (en) * | 2012-08-17 | 2012-12-05 | 杭州士兰集成电路有限公司 | Chip packaging system, chip packaging method, injecting device, and stamping and injecting linkage device |
| CN105097561A (en) * | 2014-05-09 | 2015-11-25 | 东部Hitek株式会社 | Method of Packaging Semiconductor Devices and Apparatus for Performing the Same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113394201A (en) * | 2021-06-21 | 2021-09-14 | 李琴 | Multi-chip integrated circuit packaging structure |
| CN115602581A (en) * | 2022-11-01 | 2023-01-13 | 今上半导体（信阳）有限公司（Cn） | Power semiconductor packaging device |
| CN115602581B (en) * | 2022-11-01 | 2023-11-10 | 今上半导体(信阳)有限公司 | Power semiconductor packaging device |
| CN116598214A (en) * | 2023-05-13 | 2023-08-15 | 江苏爱矽半导体科技有限公司 | Packaging structure of power semiconductor device |
| CN116598214B (en) * | 2023-05-13 | 2024-03-19 | 江苏爱矽半导体科技有限公司 | Packaging structure of power semiconductor device |
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