MY183244A - Solder paste and solder joint - Google Patents

Solder paste and solder joint

Info

Publication number
MY183244A
MY183244A MYPI2017000704A MYPI2017000704A MY183244A MY 183244 A MY183244 A MY 183244A MY PI2017000704 A MYPI2017000704 A MY PI2017000704A MY PI2017000704 A MYPI2017000704 A MY PI2017000704A MY 183244 A MY183244 A MY 183244A
Authority
MY
Malaysia
Prior art keywords
compound
addition amount
solder
amine hydrohalide
indicated
Prior art date
Application number
MYPI2017000704A
Other languages
English (en)
Inventor
Kazuyori TAKAGI
Toru Hayashida
Yutaka Hashimoto
Tetsu TAKEMASA
Nanako MIYAGI
Ko Inaba
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Publication of MY183244A publication Critical patent/MY183244A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3616—Halogen compounds
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
    • F16B5/00—Joining sheets or plates, e.g. panels, to one another or to strips or bars parallel to them
    • F16B5/08—Joining sheets or plates, e.g. panels, to one another or to strips or bars parallel to them by means of welds or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
MYPI2017000704A 2014-11-12 2015-11-06 Solder paste and solder joint MY183244A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014229886A JP6405920B2 (ja) 2014-11-12 2014-11-12 ソルダペースト用フラックス、ソルダペースト及びはんだ接合体
PCT/JP2015/081308 WO2016076220A1 (ja) 2014-11-12 2015-11-06 ソルダペースト用フラックス、ソルダペースト及びはんだ接合体

Publications (1)

Publication Number Publication Date
MY183244A true MY183244A (en) 2021-02-18

Family

ID=55954307

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2017000704A MY183244A (en) 2014-11-12 2015-11-06 Solder paste and solder joint

Country Status (7)

Country Link
US (1) US20170304961A1 (cg-RX-API-DMAC7.html)
EP (1) EP3219433A4 (cg-RX-API-DMAC7.html)
JP (1) JP6405920B2 (cg-RX-API-DMAC7.html)
CN (1) CN107000133A (cg-RX-API-DMAC7.html)
MY (1) MY183244A (cg-RX-API-DMAC7.html)
PH (1) PH12017500879B1 (cg-RX-API-DMAC7.html)
WO (1) WO2016076220A1 (cg-RX-API-DMAC7.html)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10319527B2 (en) 2017-04-04 2019-06-11 Samsung Electro-Mechanics Co., Ltd. Multilayer capacitor
JP6528102B2 (ja) 2017-07-03 2019-06-12 株式会社弘輝 フラックス及びはんだ材料
JP6390989B1 (ja) * 2017-11-24 2018-09-19 千住金属工業株式会社 フラックス及びソルダペースト
JP6617793B2 (ja) 2018-06-01 2019-12-11 千住金属工業株式会社 ソルダペースト用フラックス及びソルダペースト
JP6536730B1 (ja) * 2018-08-10 2019-07-03 千住金属工業株式会社 フラックス及びはんだペースト
JP6643744B1 (ja) * 2019-05-27 2020-02-12 千住金属工業株式会社 はんだペースト及びはんだペースト用フラックス
JP7517669B2 (ja) * 2019-06-27 2024-07-17 株式会社弘輝 フラックス及びソルダペースト
CN111001965B (zh) * 2019-10-28 2022-03-11 东莞市吉田焊接材料有限公司 一种有铅锡膏助焊剂及其制备方法与锡膏
JP6795777B1 (ja) * 2020-03-27 2020-12-02 千住金属工業株式会社 洗浄用フラックス及び洗浄用ソルダペースト
JP7161510B2 (ja) * 2020-09-15 2022-10-26 株式会社タムラ製作所 はんだ組成物および電子基板
CN112951730B (zh) * 2021-01-26 2024-03-29 北京遥感设备研究所 一种基板三维堆叠工艺方法
JP7328311B2 (ja) * 2021-03-12 2023-08-16 千住金属工業株式会社 フラックスおよび電子デバイスの製造方法
KR102745469B1 (ko) * 2021-03-12 2024-12-20 센주긴조쿠고교 가부시키가이샤 플럭스 및 전자 디바이스의 제조 방법
WO2022191227A1 (ja) * 2021-03-12 2022-09-15 千住金属工業株式会社 フラックスおよび電子デバイスの製造方法
CN117042914B (zh) * 2021-03-12 2024-11-19 千住金属工业株式会社 助焊剂和电子设备的制造方法
CN116981541B (zh) * 2021-03-12 2024-11-19 千住金属工业株式会社 助焊剂和电子设备的制造方法
JP7054035B1 (ja) * 2021-06-09 2022-04-13 千住金属工業株式会社 フラックス及びソルダペースト

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05392A (ja) * 1991-06-18 1993-01-08 Metsuku Kk はんだ付け用フラツクス及びクリームはんだ
JP3398025B2 (ja) * 1997-10-01 2003-04-21 三洋電機株式会社 液晶表示装置
JP2002086292A (ja) * 2000-02-08 2002-03-26 Showa Denko Kk ハンダペースト
US20010042779A1 (en) * 2000-02-08 2001-11-22 Hitoshi Amita Solder paste
JP2003225795A (ja) * 2002-01-30 2003-08-12 Showa Denko Kk ハンダ付け用フラックスおよびハンダペースト
JP3797990B2 (ja) * 2003-08-08 2006-07-19 株式会社東芝 熱硬化性フラックス及びはんだペースト
US8961709B1 (en) * 2004-03-09 2015-02-24 Senju Metal Industry Co., Ltd. Solder paste
JP5766668B2 (ja) * 2012-08-16 2015-08-19 株式会社タムラ製作所 はんだ組成物およびそれを用いたプリント配線基板
JP6027426B2 (ja) * 2012-12-18 2016-11-16 ニホンハンダ株式会社 ソルダペースト及びはんだ付け実装方法
JP5731555B2 (ja) * 2013-01-29 2015-06-10 株式会社タムラ製作所 フラックスおよびソルダペースト

Also Published As

Publication number Publication date
EP3219433A4 (en) 2018-06-13
JP6405920B2 (ja) 2018-10-17
CN107000133A (zh) 2017-08-01
US20170304961A1 (en) 2017-10-26
PH12017500879A1 (en) 2017-11-06
WO2016076220A1 (ja) 2016-05-19
PH12017500879B1 (en) 2023-07-05
JP2016093816A (ja) 2016-05-26
EP3219433A1 (en) 2017-09-20

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