MY169065A - Surface-treated copper foil - Google Patents

Surface-treated copper foil

Info

Publication number
MY169065A
MY169065A MYPI2014702857A MYPI2014702857A MY169065A MY 169065 A MY169065 A MY 169065A MY PI2014702857 A MYPI2014702857 A MY PI2014702857A MY PI2014702857 A MYPI2014702857 A MY PI2014702857A MY 169065 A MY169065 A MY 169065A
Authority
MY
Malaysia
Prior art keywords
copper foil
treated copper
concentration
treated
lcp
Prior art date
Application number
MYPI2014702857A
Other languages
English (en)
Inventor
Ryo Fukuchi
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of MY169065A publication Critical patent/MY169065A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/24—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing hexavalent chromium compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/82—After-treatment
    • C23C22/83—Chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2222/00—Aspects relating to chemical surface treatment of metallic material by reaction of the surface with a reactive medium
    • C23C2222/20—Use of solutions containing silanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrochemistry (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
MYPI2014702857A 2012-03-29 2013-03-29 Surface-treated copper foil MY169065A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012076711 2012-03-29

Publications (1)

Publication Number Publication Date
MY169065A true MY169065A (en) 2019-02-12

Family

ID=49260358

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2014702857A MY169065A (en) 2012-03-29 2013-03-29 Surface-treated copper foil

Country Status (6)

Country Link
JP (3) JP5886417B2 (fr)
KR (2) KR101658722B1 (fr)
CN (1) CN104246013B (fr)
MY (1) MY169065A (fr)
TW (1) TWI565833B (fr)
WO (1) WO2013147116A1 (fr)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5886417B2 (ja) * 2012-03-29 2016-03-16 Ｊｘ金属株式会社 表面処理銅箔
WO2013147115A1 (fr) 2012-03-29 2013-10-03 Jx日鉱日石金属株式会社 Feuille de cuivre traitée en surface
US10383222B2 (en) 2016-01-04 2019-08-13 Jx Nippon Mining & Metals Corporation Surface-treated copper foil
JP6854114B2 (ja) 2016-01-04 2021-04-07 Ｊｘ金属株式会社 表面処理銅箔
JP6697759B2 (ja) * 2016-02-05 2020-05-27 パナソニックＩｐマネジメント株式会社 金属張積層板、金属張積層板の製造方法、樹脂付き金属部材、樹脂付き金属部材の製造方法、配線板、及び配線板の製造方法
JP7193915B2 (ja) * 2017-02-03 2022-12-21 Ｊｘ金属株式会社 表面処理銅箔並びにこれを用いた集電体、電極及び電池
US10529992B2 (en) 2017-02-03 2020-01-07 Jx Nippon Mining & Metals Corporation Surface-treated copper foil, and current collector, electrode, and battery cell using the surface-treated copper foil
US10337115B1 (en) * 2018-01-05 2019-07-02 Chang Chun Petrochemical Co., Ltd. Surface treated copper foil for high speed printed circuit board products including the copper foil and methods of making
JP6413039B1 (ja) * 2018-03-29 2018-10-24 Ｊｘ金属株式会社 表面処理銅箔及び銅張積層板
CN111971421B (zh) * 2018-04-27 2023-06-09 Ｊｘ金属株式会社 表面处理铜箔、覆铜积层板及印刷配线板
CN109467722B (zh) * 2018-09-29 2022-04-08 苏州市新广益电子有限公司 一种用于fpc行业的lcp薄膜及其制备方法
JP7352939B2 (ja) * 2019-05-09 2023-09-29 ナミックス株式会社 複合銅部材
KR20220006035A (ko) 2019-05-09 2022-01-14 나믹스 가부시끼가이샤 복합 구리 부재
US10697082B1 (en) * 2019-08-12 2020-06-30 Chang Chun Petrochemical Co., Ltd. Surface-treated copper foil
JP7421208B2 (ja) 2019-12-24 2024-01-24 日本電解株式会社 表面処理銅箔及びその製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6015654B2 (ja) * 1980-11-18 1985-04-20 日本電解株式会社 銅箔のクロメ−ト処理層と樹脂基材との接着方法
JPS6154592A (ja) 1984-08-24 1986-03-18 株式会社日立製作所 現金自動取引装置
JPH0334679A (ja) 1989-06-30 1991-02-14 Canon Inc 画像処理装置
JPH0555746A (ja) 1991-08-29 1993-03-05 Hitachi Chem Co Ltd 高周波用銅張り積層板及びプリント配線板
JP3135098B2 (ja) 1993-06-21 2001-02-13 キヤノン株式会社 光学素子の成形装置
JP3300160B2 (ja) * 1994-06-06 2002-07-08 株式会社ジャパンエナジー 銅箔の処理方法
JP2003193211A (ja) * 2001-12-27 2003-07-09 Nippon Mining & Metals Co Ltd 銅張積層板用圧延銅箔
JP4295800B2 (ja) * 2002-05-13 2009-07-15 三井金属鉱業株式会社 電解銅箔
WO2003102277A1 (fr) * 2002-06-04 2003-12-11 Mitsui Mining & Smelting Co.,Ltd. Feuille de cuivre traitee en surface pour substrat dielectrique faible, stratifie cuivre comportant cette feuille et carte a cablage imprime
KR101203439B1 (ko) * 2007-12-21 2012-11-21 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 프린트 배선판용 동박
CN102150479B (zh) * 2009-06-30 2013-03-27 Jx日矿日石金属株式会社 印刷配线板用铜箔
JP5463117B2 (ja) * 2009-10-20 2014-04-09 株式会社日立製作所 低損失配線板，多層配線板、それに用いる銅箔及び積層板
JP5242710B2 (ja) * 2010-01-22 2013-07-24 古河電気工業株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
WO2011138876A1 (fr) * 2010-05-07 2011-11-10 Jx日鉱日石金属株式会社 Feuille de cuivre pour circuit imprimé
JP5886417B2 (ja) * 2012-03-29 2016-03-16 Ｊｘ金属株式会社 表面処理銅箔

Also Published As

Publication number Publication date
TW201404935A (zh) 2014-02-01
KR101658722B1 (ko) 2016-09-21
CN104246013B (zh) 2018-01-23
KR20140142341A (ko) 2014-12-11
KR101824827B1 (ko) 2018-02-01
TWI565833B (zh) 2017-01-11
WO2013147116A1 (fr) 2013-10-03
KR20160075865A (ko) 2016-06-29
JP2016033261A (ja) 2016-03-10
JPWO2013147116A1 (ja) 2015-12-14
CN104246013A (zh) 2014-12-24
JP5886417B2 (ja) 2016-03-16
JP6149066B2 (ja) 2017-06-14
JP2015206119A (ja) 2015-11-19

Similar Documents

Publication Publication Date Title
MY169065A (en) Surface-treated copper foil
MY172405A (en) Surface-treated copper foil
PH12015501174B1 (en) Surface-treated electrolytic copper foil, laminate, and printed circuit board
WO2011051952A3 (fr) Revêtements conducteurs transparents destinés à des dispositifs électroniques et optoélectroniques
EP2591645A4 (fr) Procédés de traitement des surfaces de cuivre pour améliorer l'adhérence à des substrats organiques utilisés dans les cartes de circuit imprimé
EP2211236A4 (fr) Liquide de traitement de surface pour couche élastique conductrice, procédé de traitement de surface de celle-ci et élément conducteur dont la surface a été traitée
IN2014DN07250A (fr)
EP3069265A4 (fr) Génération de synthèses électroniques de réunions en ligne
SG11201404196XA (en) Resin composition, layered product, multilayer printed wiring board, multilayer flexible wiring board and manufacturing method of the same
MX359649B (es) Etiquetas de sujecion y metodos para su fabricacion y uso.
EP2450911A4 (fr) Couche conductrice, ainsi que transducteur et carte imprimée souple utilisant celle-ci
GB2458454B (en) Electronic devices and methods of making the same using solution processing techniques
AU347470S (en) Component for an electronic device
EP2860219A4 (fr) Composition de résine, pré-imprégné, stratifié de feuille métallique-gaine et carte de circuit imprimé
WO2011122842A3 (fr) Film de polyimide
IN2014KN01179A (fr)
MY177723A (en) Surface-treated copper foil, laminate using same, printed wiring board, electronic device, and method for fabricating printed wiring board
GB201303602D0 (en) Interlayer for electronic devices
EP2910587A4 (fr) Composition de résine, pré-imprégné, plaque stratifiée, plaque stratifiée enrobée d'une feuille métallique, et carte imprimée
WO2010097517A3 (fr) Lamelles contenant du graphène et dispositifs électroniques, et procédé d'exfoliation de graphène
EP2530533A4 (fr) Feuille d'hologramme en volume à incorporer, papier de prévention de contrefaçon et carte
EP3239246A4 (fr) Composition de résine de silicium exempte de phosphore et d'halogène, et préimprégné, plaque stratifiée, plaque cuivrée l'utilisant et carte de circuit imprimé
EP3040451A3 (fr) Produits de réaction d'acides aminés et d'époxydes
HK1171901A1 (en) Flexible printed circuit board and method of manufacturing the same
EP2927278A4 (fr) Composition de résine, pré-imprégné, plaque stratifiée, plaque stratifiée avec feuille de métal, et plaque de câblage imprimé