MY158023A - Curable resin composition and semiconductor device using same - Google Patents

Curable resin composition and semiconductor device using same

Info

Publication number
MY158023A
MY158023A MYPI2015700026A MYPI2015700026A MY158023A MY 158023 A MY158023 A MY 158023A MY PI2015700026 A MYPI2015700026 A MY PI2015700026A MY PI2015700026 A MYPI2015700026 A MY PI2015700026A MY 158023 A MY158023 A MY 158023A
Authority
MY
Malaysia
Prior art keywords
same
semiconductor device
resin composition
curable resin
curable
Prior art date
Application number
MYPI2015700026A
Other languages
English (en)
Inventor
Takenaka Hiroto
Itaya Ryo
Kamuro Shigeaki
Original Assignee
Daicel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Corp filed Critical Daicel Corp
Publication of MY158023A publication Critical patent/MY158023A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/098—Metal salts of carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C08K5/34924—Triazines containing cyanurate groups; Tautomers thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Graft Or Block Polymers (AREA)
MYPI2015700026A 2013-08-02 2014-07-04 Curable resin composition and semiconductor device using same MY158023A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013161865 2013-08-02

Publications (1)

Publication Number Publication Date
MY158023A true MY158023A (en) 2016-08-30

Family

ID=52431541

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2015700026A MY158023A (en) 2013-08-02 2014-07-04 Curable resin composition and semiconductor device using same

Country Status (6)

Country Link
JP (1) JP5736525B1 (ko)
KR (1) KR101563472B1 (ko)
CN (1) CN104583325B (ko)
MY (1) MY158023A (ko)
TW (1) TWI547525B (ko)
WO (1) WO2015016001A1 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9481791B2 (en) 2013-02-14 2016-11-01 Daicel Corporation Curable resin composition and cured product thereof, encapsulant, and semiconductor device
JP6474801B2 (ja) * 2014-06-06 2019-02-27 株式会社ダイセル 硬化性樹脂組成物、硬化物、封止材、及び半導体装置
KR20180113602A (ko) 2016-02-22 2018-10-16 주식회사 다이셀 경화성 수지 조성물, 그의 경화물 및 반도체 장치
WO2018016372A1 (ja) * 2016-07-19 2018-01-25 株式会社ダイセル 硬化性樹脂組成物、その硬化物、及び半導体装置
KR102412508B1 (ko) * 2016-09-07 2022-06-24 니치아 카가쿠 고교 가부시키가이샤 경화성 수지 조성물, 그의 경화물 및 반도체 장치
KR101864505B1 (ko) * 2016-11-21 2018-06-29 주식회사 케이씨씨 방열성이 우수한 실리콘 조성물
CN114672025B (zh) * 2022-04-20 2022-12-02 波米科技有限公司 一种含杂环的poss基硅氧烷化合物及其制备方法和应用

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2757869B1 (fr) * 1996-12-31 1999-05-21 Rhodia Chimie Sa Utilisation de melanges a base de pt et de composes de metaux de transition autres que le pt pour ameliorer les proprietes de resistance a l'arc des elastomeres silicones
TWI428396B (zh) * 2006-06-14 2014-03-01 Shinetsu Chemical Co 填充磷光體之可固化聚矽氧樹脂組成物及其固化產物
JP5444631B2 (ja) * 2007-04-06 2014-03-19 横浜ゴム株式会社 光半導体素子封止用組成物、その硬化物および光半導体素子封止体
JP4877381B2 (ja) * 2008-12-16 2012-02-15 横浜ゴム株式会社 シラノール縮合触媒、加熱硬化性光半導体封止用シリコーン樹脂組成物およびこれを用いる光半導体封止体
WO2011065044A1 (ja) * 2009-11-30 2011-06-03 日本化薬株式会社 硬化性樹脂組成物およびその硬化物
JP5300148B2 (ja) * 2009-11-30 2013-09-25 日本化薬株式会社 エポキシ樹脂組成物、硬化性樹脂組成物
JP4788837B2 (ja) * 2010-01-26 2011-10-05 横浜ゴム株式会社 シリコーン樹脂組成物およびその使用方法、シリコーン樹脂、シリコーン樹脂含有構造体、ならびに光半導体素子封止体
TWI504681B (zh) * 2010-03-08 2015-10-21 Lintec Corp A hardening composition, a hardened product, and a hardening composition
JP5784618B2 (ja) * 2010-09-22 2015-09-24 株式会社カネカ 多面体構造ポリシロキサン変性体、多面体構造ポリシロキサン系組成物、硬化物、及び、光半導体デバイス
WO2012063822A1 (ja) * 2010-11-10 2012-05-18 横浜ゴム株式会社 熱硬化型シリコーン樹脂組成物、ならびに、これを用いて得られるシリコーン樹脂含有構造体および光半導体素子封止体
JP5045862B2 (ja) * 2010-11-18 2012-10-10 横浜ゴム株式会社 熱硬化型シリコーン樹脂組成物、シリコーン樹脂含有構造体、光半導体素子封止体、および、シラノール縮合触媒
JP2012111875A (ja) * 2010-11-25 2012-06-14 Daicel Corp 硬化性樹脂組成物及び硬化物
JP2012162666A (ja) * 2011-02-08 2012-08-30 Kaneka Corp 多面体構造ポリシロキサン系組成物
JP2012201706A (ja) * 2011-03-23 2012-10-22 Kaneka Corp ポリシロキサン系組成物
WO2013005633A1 (ja) * 2011-07-04 2013-01-10 Jnc株式会社 イソシアヌル骨格、エポキシ基およびＳｉＨ基を有するオルガノポリシロキサンまたはシルセスキオキサン骨格を含む化合物および該化合物を密着付与材として含む熱硬化性樹脂組成物、硬化物、および光半導体用封止材
JP5655163B2 (ja) * 2011-12-22 2015-01-14 株式会社ダイセル 硬化性樹脂組成物及びその硬化物
MY154045A (en) * 2012-05-25 2015-04-27 Daicel Corp Curable resin composition and cured product thereof, encapsulating agent, and optical semiconductor device
MY155102A (en) * 2013-01-09 2015-09-07 Daicel Corp Curable resin composition, and cured product of same

Also Published As

Publication number Publication date
CN104583325A (zh) 2015-04-29
CN104583325B (zh) 2016-11-09
JP5736525B1 (ja) 2015-06-17
KR20150030279A (ko) 2015-03-19
JPWO2015016001A1 (ja) 2017-03-02
TW201512309A (zh) 2015-04-01
WO2015016001A9 (ja) 2015-03-12
WO2015016001A1 (ja) 2015-02-05
KR101563472B1 (ko) 2015-10-26
TWI547525B (zh) 2016-09-01

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