MY153952A - An edge polishing machine and edge polishing method thereby - Google Patents

An edge polishing machine and edge polishing method thereby

Info

Publication number
MY153952A
MY153952A MYPI20002745A MYPI20002745A MY153952A MY 153952 A MY153952 A MY 153952A MY PI20002745 A MYPI20002745 A MY PI20002745A MY PI20002745 A MYPI20002745 A MY PI20002745A MY 153952 A MY153952 A MY 153952A
Authority
MY
Malaysia
Prior art keywords
wafer
edge polishing
polishing
polishing pad
rotary drum
Prior art date
Application number
MYPI20002745A
Other languages
English (en)
Inventor
Hiroaki Tanaka
Yoshihisa Ogawa
Yusuke Inoue
Akira Yoshida
Original Assignee
Speedfam Ipec Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speedfam Ipec Co Ltd filed Critical Speedfam Ipec Co Ltd
Publication of MY153952A publication Critical patent/MY153952A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
MYPI20002745A 1999-06-17 2000-06-16 An edge polishing machine and edge polishing method thereby MY153952A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17107599A JP4778130B2 (ja) 1999-06-17 1999-06-17 エッジポリッシング装置及びエッジポリッシング方法

Publications (1)

Publication Number Publication Date
MY153952A true MY153952A (en) 2015-04-15

Family

ID=15916563

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20002745A MY153952A (en) 1999-06-17 2000-06-16 An edge polishing machine and edge polishing method thereby

Country Status (3)

Country Link
JP (1) JP4778130B2 (ja)
KR (1) KR100528884B1 (ja)
MY (1) MY153952A (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003048164A (ja) * 2001-08-07 2003-02-18 Disco Abrasive Syst Ltd 研磨ホイール
JP4090247B2 (ja) * 2002-02-12 2008-05-28 株式会社荏原製作所 基板処理装置
KR100506814B1 (ko) * 2003-01-15 2005-08-09 삼성전자주식회사 웨이퍼 연마 장치
DE102005034120B4 (de) * 2005-07-21 2013-02-07 Siltronic Ag Verfahren zur Herstellung einer Halbleiterscheibe
JP5622077B2 (ja) * 2010-03-12 2014-11-12 日立金属株式会社 半導体基板の加工装置、及び半導体基板の製造方法
KR101135273B1 (ko) 2010-06-01 2012-04-12 주식회사 엘지실트론 웨이퍼 연마장치
JP5789634B2 (ja) * 2012-05-14 2015-10-07 株式会社荏原製作所 ワークピースを研磨するための研磨パッド並びに化学機械研磨装置、および該化学機械研磨装置を用いてワークピースを研磨する方法
KR102098993B1 (ko) * 2017-12-18 2020-04-08 에스케이실트론 주식회사 웨이퍼 에지 연마용 드럼 패드의 드레싱 장치
CN109940467B (zh) * 2019-03-12 2023-12-08 桂林创源金刚石有限公司 一种抛光装置及制造方法
JP2020124805A (ja) * 2020-05-15 2020-08-20 株式会社テクニカルフィット 研磨部材、及び、研磨方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0557623A (ja) * 1991-08-29 1993-03-09 Showa Alum Corp 研磨布
JP2900777B2 (ja) * 1993-12-14 1999-06-02 信越半導体株式会社 研磨部材およびウエーハ研磨装置
JPH07276229A (ja) * 1994-04-01 1995-10-24 Nippon Steel Corp 半導体ウエハエッジ部研磨装置
JPH07297195A (ja) * 1994-04-27 1995-11-10 Speedfam Co Ltd 半導体装置の平坦化方法及び平坦化装置
JPH08132342A (ja) * 1994-11-08 1996-05-28 Hitachi Ltd 半導体集積回路装置の製造装置
KR970018156A (ko) * 1995-09-11 1997-04-30 김광호 웨이퍼 연마용 패드
JP3042593B2 (ja) * 1995-10-25 2000-05-15 日本電気株式会社 研磨パッド
KR19980056129A (ko) * 1996-12-28 1998-09-25 김광호 기판 에지 폴리싱 장치
JP3389065B2 (ja) * 1997-06-25 2003-03-24 ニトマック・イーアール株式会社 半導体ウェハ外周面のミラー面取加工装置

Also Published As

Publication number Publication date
KR100528884B1 (ko) 2005-11-16
JP4778130B2 (ja) 2011-09-21
JP2001001251A (ja) 2001-01-09
KR20010049553A (ko) 2001-06-15

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