MY153326A - Test chip used for testing integrated circuit - Google Patents

Test chip used for testing integrated circuit

Info

Publication number
MY153326A
MY153326A MYPI2010002669A MYPI2010002669A MY153326A MY 153326 A MY153326 A MY 153326A MY PI2010002669 A MYPI2010002669 A MY PI2010002669A MY PI2010002669 A MYPI2010002669 A MY PI2010002669A MY 153326 A MY153326 A MY 153326A
Authority
MY
Malaysia
Prior art keywords
signal
test
outside
basis
receipt
Prior art date
Application number
MYPI2010002669A
Other languages
English (en)
Inventor
Washio Kenichi
Original Assignee
Nihon Micronics Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Micronics Kk filed Critical Nihon Micronics Kk
Publication of MY153326A publication Critical patent/MY153326A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
    • G01R19/165—Indicating that current or voltage is either above or below a predetermined value or within or outside a predetermined range of values
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31917—Stimuli generation or application of test patterns to the device under test [DUT]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31917—Stimuli generation or application of test patterns to the device under test [DUT]
    • G01R31/31922—Timing generation or clock distribution
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/3193—Tester hardware, i.e. output processing circuits with comparison between actual response and known fault free response
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
MYPI2010002669A 2009-07-03 2010-06-09 Test chip used for testing integrated circuit MY153326A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009158871A JP5478133B2 (ja) 2009-07-03 2009-07-03 集積回路の試験に用いるテストチップ

Publications (1)

Publication Number Publication Date
MY153326A true MY153326A (en) 2015-01-29

Family

ID=43593379

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2010002669A MY153326A (en) 2009-07-03 2010-06-09 Test chip used for testing integrated circuit

Country Status (4)

Country Link
JP (1) JP5478133B2 (ko)
KR (1) KR101202779B1 (ko)
MY (1) MY153326A (ko)
TW (1) TWI399560B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5499303B2 (ja) * 2011-02-04 2014-05-21 株式会社日本マイクロニクス プローブカードの配線基板調整治具及び配線基板修正方法並びに配線基板調整治具を用いて調整されたプローブカードを用いた検査方法及び検査システム
JP2013130459A (ja) 2011-12-21 2013-07-04 Micronics Japan Co Ltd 板状部材の位置決め方法及び電気的接続装置の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4234244B2 (ja) * 1998-12-28 2009-03-04 富士通マイクロエレクトロニクス株式会社 ウエハーレベルパッケージ及びウエハーレベルパッケージを用いた半導体装置の製造方法
JP5050303B2 (ja) 2001-06-29 2012-10-17 富士通セミコンダクター株式会社 半導体試験装置
JP4846128B2 (ja) 2001-07-12 2011-12-28 ルネサスエレクトロニクス株式会社 半導体装置およびそのテスト方法
US7527987B2 (en) * 2002-12-11 2009-05-05 Pdf Solutions, Inc. Fast localization of electrical failures on an integrated circuit system and method
TWI235838B (en) * 2004-04-29 2005-07-11 Advanced Analog Technology Inc Semiconductor wafer with test circuit and manufacturing method
JP2008305450A (ja) 2007-06-05 2008-12-18 Renesas Technology Corp テストシステムとテスト方法

Also Published As

Publication number Publication date
TW201109691A (en) 2011-03-16
JP5478133B2 (ja) 2014-04-23
KR101202779B1 (ko) 2012-11-21
KR20110003264A (ko) 2011-01-11
TWI399560B (zh) 2013-06-21
JP2011014781A (ja) 2011-01-20

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