MY151335A - Electroplating solution containing organic acid complexing agent - Google Patents

Electroplating solution containing organic acid complexing agent

Info

Publication number
MY151335A
MY151335A MYPI20030505A MY151335A MY 151335 A MY151335 A MY 151335A MY PI20030505 A MYPI20030505 A MY PI20030505A MY 151335 A MY151335 A MY 151335A
Authority
MY
Malaysia
Prior art keywords
solution
complexing agent
electroplatable
solution containing
organic acid
Prior art date
Application number
Other languages
English (en)
Inventor
Hradil George
Original Assignee
Technic
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technic filed Critical Technic
Publication of MY151335A publication Critical patent/MY151335A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
MYPI20030505 2002-02-15 2003-02-14 Electroplating solution containing organic acid complexing agent MY151335A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US35733002P 2002-02-15 2002-02-15
US10/277,234 US20030159938A1 (en) 2002-02-15 2002-10-22 Electroplating solution containing organic acid complexing agent

Publications (1)

Publication Number Publication Date
MY151335A true MY151335A (en) 2014-05-15

Family

ID=27757599

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20030505 MY151335A (en) 2002-02-15 2003-02-14 Electroplating solution containing organic acid complexing agent

Country Status (8)

Country Link
US (1) US20030159938A1 (zh)
JP (1) JP2005517814A (zh)
KR (1) KR20040085194A (zh)
CN (1) CN100469942C (zh)
AU (1) AU2003217344A1 (zh)
MY (1) MY151335A (zh)
TW (1) TWI296289B (zh)
WO (1) WO2003071001A1 (zh)

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US7275012B2 (en) * 2002-12-30 2007-09-25 Intel Corporation Automated method and apparatus for processor thermal validation
CN100457977C (zh) * 2004-08-03 2009-02-04 上海新阳半导体材料有限公司 一种无铅纯锡电镀添加剂及其制备方法
EP1904669A1 (en) * 2005-07-11 2008-04-02 Technic, Inc. Tin electrodeposits having properties or characteristics that minimize tin whisker growth
US20070034118A1 (en) * 2005-08-12 2007-02-15 Jardine Leslie A Dosage efficient, storage stable compositions for reducing chromium (VI) in cement
US7765661B2 (en) 2006-02-01 2010-08-03 Murata Manufacturing Co., Ltd. Method for manufacturing ceramic electronic component and planting bath
EP1918426A1 (de) * 2006-10-09 2008-05-07 Enthone, Inc. Cyanidfreie Elektrolytzusammensetzung und Verfahren zur Abscheidung von Silber- oder Silberlegierungsschichten auf Substraten
WO2010051341A1 (en) * 2008-10-31 2010-05-06 Sundew Technologies, Llc Coatings for suppressing metallic whiskers
KR101881596B1 (ko) 2008-12-02 2018-07-24 웨이브 라이프 사이언시스 재팬 인코포레이티드 인 원자 변형된 핵산의 합성 방법
SG173551A1 (en) 2009-02-06 2011-09-29 Kenji Dewaki Silver-containing alloy plating bath and electrolytic plating method using the same
WO2011013252A1 (ja) * 2009-07-31 2011-02-03 株式会社Ｍテック・ジャパン スズ含有合金メッキ浴、これを用いた電解メッキ方法および該電解メッキが堆積された基体
SG177564A1 (en) 2009-07-06 2012-02-28 Ontorii Inc Novel nucleic acid prodrugs and methods of use thereof
WO2012039448A1 (ja) 2010-09-24 2012-03-29 株式会社キラルジェン 不斉補助基
EP2734208B1 (en) 2011-07-19 2017-03-01 Wave Life Sciences Ltd. Methods for the synthesis of functionalized nucleic acids
EP2872485B1 (en) 2012-07-13 2020-12-16 Wave Life Sciences Ltd. Asymmetric auxiliary group
US10174433B2 (en) 2013-12-05 2019-01-08 Honeywell International Inc. Stannous methanesulfonate solution with adjusted pH
AU2015207773B2 (en) 2014-01-16 2021-06-17 Wave Life Sciences Ltd. Chiral design
JP6401310B2 (ja) 2014-07-07 2018-10-10 ハネウェル・インターナショナル・インコーポレーテッドＨｏｎｅｙｗｅｌｌ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｉｎｃ． イオンスカベンジャーを有する熱界面材料
SG11201704238YA (en) 2014-12-05 2017-06-29 Honeywell Int Inc High performance thermal interface materials with low thermal impedance
JP2016125130A (ja) * 2015-01-08 2016-07-11 株式会社デンソー 複合材料、複合材料の形成方法、複合材料によってめっきされた電極、および、接続構造
CN104593835B (zh) * 2015-02-04 2017-10-24 广东羚光新材料股份有限公司 用于片式元器件端电极电镀的中性镀锡液
US10312177B2 (en) 2015-11-17 2019-06-04 Honeywell International Inc. Thermal interface materials including a coloring agent
CN105401177A (zh) * 2015-12-14 2016-03-16 广东美的暖通设备有限公司 换热器的防腐处理方法、换热器和空调器
EP3426746B1 (en) 2016-03-08 2021-07-14 Honeywell International Inc. Phase change material
US10501671B2 (en) 2016-07-26 2019-12-10 Honeywell International Inc. Gel-type thermal interface material
KR20180024765A (ko) * 2016-08-31 2018-03-08 주식회사 호진플라텍 전기도금을 이용한 주석-비스무트-납 삼원합금 솔더 조성물
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US10428256B2 (en) 2017-10-23 2019-10-01 Honeywell International Inc. Releasable thermal gel
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
CN108866583B (zh) * 2018-08-28 2020-07-21 广州三孚新材料科技股份有限公司 一种应用于无引线电子元件的镀锡或锡铅合金的镀液及其制备方法和电镀方法
CN109576758B (zh) * 2018-11-28 2019-11-05 广州旭淼新材料科技有限公司 环保型单锡盐电解着色添加剂
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
CN113025825B (zh) * 2021-03-05 2022-03-01 华东理工大学 使用纳米气泡从电池中浸取有价金属的方法

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JP2709510B2 (ja) * 1989-05-17 1998-02-04 上村工業 株式会社 錫，鉛，錫―鉛合金電気めっき浴及び電気めっき方法
US5085744A (en) * 1990-11-06 1992-02-04 Learonal, Inc. Electroplated gold-copper-zinc alloys
US6773573B2 (en) * 2001-10-02 2004-08-10 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate

Also Published As

Publication number Publication date
AU2003217344A1 (en) 2003-09-09
CN100469942C (zh) 2009-03-18
WO2003071001A1 (en) 2003-08-28
KR20040085194A (ko) 2004-10-07
US20030159938A1 (en) 2003-08-28
TW200303938A (en) 2003-09-16
JP2005517814A (ja) 2005-06-16
CN1633519A (zh) 2005-06-29
TWI296289B (en) 2008-05-01

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