MY146391A - Tin and tin alloy electroplating solution - Google Patents
Tin and tin alloy electroplating solutionInfo
- Publication number
- MY146391A MY146391A MYPI20056198A MYPI20056198A MY146391A MY 146391 A MY146391 A MY 146391A MY PI20056198 A MYPI20056198 A MY PI20056198A MY PI20056198 A MYPI20056198 A MY PI20056198A MY 146391 A MY146391 A MY 146391A
- Authority
- MY
- Malaysia
- Prior art keywords
- tin
- carbon atoms
- hydrogen atom
- alkyl group
- integer
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
- C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
IT IS AN OBJECT OF THE INVENTION TO PROVIDE A TIN ELECTROPLATING AND TIN ALLOY ELECTROPLATING HAVING AN IMPROVED SOLDER WETTABILITY AS WELL AS A HIGH RELIABILITY AFTER SOLDERING. ALSO, ANOTHER OBJECT IS TO IMPROVE THE PLATING RATE AND THE APPEARANCE AFTER PLATING. THE TIN AND TIN ALLOY ELECTROPLATING SOLUTIONS COMPRISE ONE OR MORE IMIDAZOLE ALCOHOL COMPOUNDS WHEREIN THE COMPOUNDS ARE PREFERABLY THOSE REPRESENTED BY GENERAL FORMULA (1) BELOW, [CHEMICAL FORMULA 1] WHEREIN IN THE GENERAL FORMULA (1), R1, R2, R3 EACH INDEPENDENTLY REPRESENT A HYDROGEN ATOM, A VINYL GROUP OR AN ALKYL GROUP HAVING 1 TO 20 CARBON ATOMS, AND R2 AND R3 MAY BE JOINED TOGETHER TO FORM AN AROMATIC RING; R4 REPRESENTS A HYDROGEN ATOM, A VINYL GROUP, AN ALKYL GROUP HAVING 1 TO 20 CARBON ATOMS, A PHENYL GROUP, OR - (CH2CH(R5 )O)KH, WITH R5 REPRESENTING A HYDROGEN ATOM OR AN ALKYL GROUP HAVING 1 TO 20 CARBON ATOMS AND K REPRESENTING AN INTEGER OF FROM 1 TO 20; X REPRESENTS A HYDROGEN ATOM, AN ALKYL GROUP HAVING 1 TO 6 CARBON ATOMS, OR A SUBSTITUENT THAT MAY CONTAIN N, O; M REPRESENTS AN INTEGER OF FROM 0 TO 20; AND N AND 1 REPRESENT AN INTEGER OF FROM 1 TO 3.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004373379 | 2004-12-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY146391A true MY146391A (en) | 2012-08-15 |
Family
ID=36601646
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI20056198A MY146391A (en) | 2004-12-24 | 2005-12-23 | Tin and tin alloy electroplating solution |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP4404909B2 (en) |
KR (1) | KR20070055612A (en) |
CN (1) | CN101035929B (en) |
HK (1) | HK1107125A1 (en) |
MY (1) | MY146391A (en) |
TW (1) | TWI307729B (en) |
WO (1) | WO2006068046A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4632186B2 (en) * | 2007-08-01 | 2011-02-16 | 太陽化学工業株式会社 | Tin electrolytic plating solution for electronic parts, tin electrolytic plating method for electronic parts and tin electrolytic plated electronic parts |
JP5622678B2 (en) * | 2011-07-14 | 2014-11-12 | 石原ケミカル株式会社 | Plating bath containing imidazole ring-bonded oxyalkylene compound |
CN109570825B (en) * | 2018-11-22 | 2021-07-13 | 东莞市绿志岛金属有限公司 | Low-temperature halogen-free lead-free soldering paste and preparation method thereof |
CN112410831B (en) * | 2020-11-17 | 2021-11-26 | 广州三孚新材料科技股份有限公司 | Electrotinning solution for heterojunction solar cell and preparation method thereof |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4617097A (en) * | 1983-12-22 | 1986-10-14 | Learonal, Inc. | Process and electrolyte for electroplating tin, lead or tin-lead alloys |
JP3858241B2 (en) * | 2002-04-09 | 2006-12-13 | 石原薬品株式会社 | Barrel plating method using neutral tin plating bath |
JP2004323971A (en) * | 2003-04-25 | 2004-11-18 | Rohm & Haas Electronic Materials Llc | Improved bath analysis method |
-
2005
- 2005-12-16 WO PCT/JP2005/023139 patent/WO2006068046A1/en not_active Application Discontinuation
- 2005-12-16 JP JP2006548928A patent/JP4404909B2/en active Active
- 2005-12-16 CN CN2005800337527A patent/CN101035929B/en active Active
- 2005-12-16 KR KR1020077009035A patent/KR20070055612A/en not_active Application Discontinuation
- 2005-12-20 TW TW94145207A patent/TWI307729B/en active
- 2005-12-23 MY MYPI20056198A patent/MY146391A/en unknown
-
2007
- 2007-11-15 HK HK07112479.8A patent/HK1107125A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
KR20070055612A (en) | 2007-05-30 |
CN101035929B (en) | 2010-08-25 |
TWI307729B (en) | 2009-03-21 |
TW200628639A (en) | 2006-08-16 |
JP4404909B2 (en) | 2010-01-27 |
JPWO2006068046A1 (en) | 2008-08-07 |
CN101035929A (en) | 2007-09-12 |
WO2006068046A1 (en) | 2006-06-29 |
HK1107125A1 (en) | 2008-03-28 |
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