MY146391A - Tin and tin alloy electroplating solution - Google Patents

Tin and tin alloy electroplating solution

Info

Publication number
MY146391A
MY146391A MYPI20056198A MYPI20056198A MY146391A MY 146391 A MY146391 A MY 146391A MY PI20056198 A MYPI20056198 A MY PI20056198A MY PI20056198 A MYPI20056198 A MY PI20056198A MY 146391 A MY146391 A MY 146391A
Authority
MY
Malaysia
Prior art keywords
tin
carbon atoms
hydrogen atom
alkyl group
integer
Prior art date
Application number
MYPI20056198A
Inventor
Toru Imori
Yoshiaki Tsutitani
Original Assignee
Nippon Mining Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co filed Critical Nippon Mining Co
Publication of MY146391A publication Critical patent/MY146391A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

IT IS AN OBJECT OF THE INVENTION TO PROVIDE A TIN ELECTROPLATING AND TIN ALLOY ELECTROPLATING HAVING AN IMPROVED SOLDER WETTABILITY AS WELL AS A HIGH RELIABILITY AFTER SOLDERING. ALSO, ANOTHER OBJECT IS TO IMPROVE THE PLATING RATE AND THE APPEARANCE AFTER PLATING. THE TIN AND TIN ALLOY ELECTROPLATING SOLUTIONS COMPRISE ONE OR MORE IMIDAZOLE ALCOHOL COMPOUNDS WHEREIN THE COMPOUNDS ARE PREFERABLY THOSE REPRESENTED BY GENERAL FORMULA (1) BELOW, [CHEMICAL FORMULA 1] WHEREIN IN THE GENERAL FORMULA (1), R1, R2, R3 EACH INDEPENDENTLY REPRESENT A HYDROGEN ATOM, A VINYL GROUP OR AN ALKYL GROUP HAVING 1 TO 20 CARBON ATOMS, AND R2 AND R3 MAY BE JOINED TOGETHER TO FORM AN AROMATIC RING; R4 REPRESENTS A HYDROGEN ATOM, A VINYL GROUP, AN ALKYL GROUP HAVING 1 TO 20 CARBON ATOMS, A PHENYL GROUP, OR - (CH2CH(R5 )O)KH, WITH R5 REPRESENTING A HYDROGEN ATOM OR AN ALKYL GROUP HAVING 1 TO 20 CARBON ATOMS AND K REPRESENTING AN INTEGER OF FROM 1 TO 20; X REPRESENTS A HYDROGEN ATOM, AN ALKYL GROUP HAVING 1 TO 6 CARBON ATOMS, OR A SUBSTITUENT THAT MAY CONTAIN N, O; M REPRESENTS AN INTEGER OF FROM 0 TO 20; AND N AND 1 REPRESENT AN INTEGER OF FROM 1 TO 3.
MYPI20056198A 2004-12-24 2005-12-23 Tin and tin alloy electroplating solution MY146391A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004373379 2004-12-24

Publications (1)

Publication Number Publication Date
MY146391A true MY146391A (en) 2012-08-15

Family

ID=36601646

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20056198A MY146391A (en) 2004-12-24 2005-12-23 Tin and tin alloy electroplating solution

Country Status (7)

Country Link
JP (1) JP4404909B2 (en)
KR (1) KR20070055612A (en)
CN (1) CN101035929B (en)
HK (1) HK1107125A1 (en)
MY (1) MY146391A (en)
TW (1) TWI307729B (en)
WO (1) WO2006068046A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4632186B2 (en) * 2007-08-01 2011-02-16 太陽化学工業株式会社 Tin electrolytic plating solution for electronic parts, tin electrolytic plating method for electronic parts and tin electrolytic plated electronic parts
JP5622678B2 (en) * 2011-07-14 2014-11-12 石原ケミカル株式会社 Plating bath containing imidazole ring-bonded oxyalkylene compound
CN109570825B (en) * 2018-11-22 2021-07-13 东莞市绿志岛金属有限公司 Low-temperature halogen-free lead-free soldering paste and preparation method thereof
CN112410831B (en) * 2020-11-17 2021-11-26 广州三孚新材料科技股份有限公司 Electrotinning solution for heterojunction solar cell and preparation method thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4617097A (en) * 1983-12-22 1986-10-14 Learonal, Inc. Process and electrolyte for electroplating tin, lead or tin-lead alloys
JP3858241B2 (en) * 2002-04-09 2006-12-13 石原薬品株式会社 Barrel plating method using neutral tin plating bath
JP2004323971A (en) * 2003-04-25 2004-11-18 Rohm & Haas Electronic Materials Llc Improved bath analysis method

Also Published As

Publication number Publication date
KR20070055612A (en) 2007-05-30
CN101035929B (en) 2010-08-25
TWI307729B (en) 2009-03-21
TW200628639A (en) 2006-08-16
JP4404909B2 (en) 2010-01-27
JPWO2006068046A1 (en) 2008-08-07
CN101035929A (en) 2007-09-12
WO2006068046A1 (en) 2006-06-29
HK1107125A1 (en) 2008-03-28

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