HK1107125A1 - Tin and tin alloy electroplating solutions - Google Patents

Tin and tin alloy electroplating solutions

Info

Publication number
HK1107125A1
HK1107125A1 HK07112479.8A HK07112479A HK1107125A1 HK 1107125 A1 HK1107125 A1 HK 1107125A1 HK 07112479 A HK07112479 A HK 07112479A HK 1107125 A1 HK1107125 A1 HK 1107125A1
Authority
HK
Hong Kong
Prior art keywords
tin
alloy electroplating
electroplating solutions
tin alloy
solutions
Prior art date
Application number
HK07112479.8A
Inventor
Toru Imori
Yoshiaki Tsutitani
Original Assignee
Nippon Mining Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co filed Critical Nippon Mining Co
Publication of HK1107125A1 publication Critical patent/HK1107125A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
HK07112479.8A 2004-12-24 2007-11-15 Tin and tin alloy electroplating solutions HK1107125A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004373379 2004-12-24
PCT/JP2005/023139 WO2006068046A1 (en) 2004-12-24 2005-12-16 Tin and tin alloy electroplating solutions

Publications (1)

Publication Number Publication Date
HK1107125A1 true HK1107125A1 (en) 2008-03-28

Family

ID=36601646

Family Applications (1)

Application Number Title Priority Date Filing Date
HK07112479.8A HK1107125A1 (en) 2004-12-24 2007-11-15 Tin and tin alloy electroplating solutions

Country Status (7)

Country Link
JP (1) JP4404909B2 (en)
KR (1) KR20070055612A (en)
CN (1) CN101035929B (en)
HK (1) HK1107125A1 (en)
MY (1) MY146391A (en)
TW (1) TWI307729B (en)
WO (1) WO2006068046A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4632186B2 (en) * 2007-08-01 2011-02-16 太陽化学工業株式会社 Tin electrolytic plating solution for electronic parts, tin electrolytic plating method for electronic parts and tin electrolytic plated electronic parts
JP5622678B2 (en) * 2011-07-14 2014-11-12 石原ケミカル株式会社 Plating bath containing imidazole ring-bonded oxyalkylene compound
CN109570825B (en) * 2018-11-22 2021-07-13 东莞市绿志岛金属有限公司 Low-temperature halogen-free lead-free soldering paste and preparation method thereof
CN112410831B (en) * 2020-11-17 2021-11-26 广州三孚新材料科技股份有限公司 Electrotinning solution for heterojunction solar cell and preparation method thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4617097A (en) * 1983-12-22 1986-10-14 Learonal, Inc. Process and electrolyte for electroplating tin, lead or tin-lead alloys
JP3858241B2 (en) * 2002-04-09 2006-12-13 石原薬品株式会社 Barrel plating method using neutral tin plating bath
JP2004323971A (en) * 2003-04-25 2004-11-18 Rohm & Haas Electronic Materials Llc Improved bath analysis method

Also Published As

Publication number Publication date
WO2006068046A1 (en) 2006-06-29
CN101035929A (en) 2007-09-12
KR20070055612A (en) 2007-05-30
JPWO2006068046A1 (en) 2008-08-07
MY146391A (en) 2012-08-15
CN101035929B (en) 2010-08-25
TW200628639A (en) 2006-08-16
JP4404909B2 (en) 2010-01-27
TWI307729B (en) 2009-03-21

Similar Documents

Publication Publication Date Title
GB2421030B (en) Solder alloy
TWI371499B (en) Copper alloy
GB2433944B (en) Solder alloy
GB0508501D0 (en) Metal alloy and its use
IL179537A0 (en) Sugar coatings and methods therefor
EP1452612A3 (en) Lead-free copper alloy and use thereof
TWI316092B (en) Alloy and its use
EP1721997A4 (en) Ni-Pt ALLOY AND TARGET COMPRISING THE ALLOY
EP1780732A4 (en) Conductive metal paste
EP1825011A4 (en) Lead-free solder alloy
HK1081604A1 (en) Copper-tin-oxygen based alloy plating
GB0519254D0 (en) Silver alloy
EP1824638A4 (en) Pb free solder alloy
EP1772225A4 (en) Lead-free solder alloy
EP1737565A4 (en) Cos-claus configurations and methods
EP1966225A4 (en) Transition metal complexes and preparation methods thereof
HK1107125A1 (en) Tin and tin alloy electroplating solutions
SG10201500813WA (en) Slot designs in wide metal lines
EP1541701A4 (en) Titanium alloys excellent in hydrogen absorption-resistance
EP1786415A4 (en) Metabolism-modulating agents and uses therefor
GB2429115B (en) Metal complex
GB0513860D0 (en) Silver alloy
GB0408952D0 (en) Precious metal salts
EP1732092A4 (en) Hinge structure and hinge structure member
GB2410229B (en) Lubrication and de-greasing aid