TW200628639A - Tin and tin alloy electroplating solution - Google Patents

Tin and tin alloy electroplating solution

Info

Publication number
TW200628639A
TW200628639A TW094145207A TW94145207A TW200628639A TW 200628639 A TW200628639 A TW 200628639A TW 094145207 A TW094145207 A TW 094145207A TW 94145207 A TW94145207 A TW 94145207A TW 200628639 A TW200628639 A TW 200628639A
Authority
TW
Taiwan
Prior art keywords
tin
group
hydrogen atom
carbon number
alkyl group
Prior art date
Application number
TW094145207A
Other languages
Chinese (zh)
Other versions
TWI307729B (en
Inventor
Toru Imori
Yoshiaki Tsutitani
Original Assignee
Nikko Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikko Materials Co Ltd filed Critical Nikko Materials Co Ltd
Publication of TW200628639A publication Critical patent/TW200628639A/en
Application granted granted Critical
Publication of TWI307729B publication Critical patent/TWI307729B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Abstract

An object of the present invention is to provide a tin and tin alloy electroplating solution, with which wettability of soldering is improved, and reliability after soldering is increased. Also, plating speed and appearance after plating are enhanced. The tin and tin alloy electroplating solution provided in the present invention contains one or more kinds of compound having imidazole group and hydroxyl group in one molecule. Said compound is preferably an imidazole alcohol represented by the following formula. , (In the formula 1, R1, R2, R3 represent hydrogen atom, vinyl group, or alkyl group with carbon number 1 to 20 respectively, wherein R3 and R3 can form an aromatic ring; R4 represents hydrogen atom, vinyl group, alkyl group with carbon number 1 to 20, phenyl group, or -(CH2CH(R5)O)KH); R5 represents hydrogen atom, alkyl group with carbon number 1 to 20; X represents hydrogen atom, alkyl group with carbon number 1 to 6, or substituent which may contain N, O; n, 1 represent integral number of 1 to 3; and k represents integral number of 1 to 20.)
TW94145207A 2004-12-24 2005-12-20 Tin and tin alloy electroplating solution TWI307729B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004373379 2004-12-24

Publications (2)

Publication Number Publication Date
TW200628639A true TW200628639A (en) 2006-08-16
TWI307729B TWI307729B (en) 2009-03-21

Family

ID=36601646

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94145207A TWI307729B (en) 2004-12-24 2005-12-20 Tin and tin alloy electroplating solution

Country Status (7)

Country Link
JP (1) JP4404909B2 (en)
KR (1) KR20070055612A (en)
CN (1) CN101035929B (en)
HK (1) HK1107125A1 (en)
MY (1) MY146391A (en)
TW (1) TWI307729B (en)
WO (1) WO2006068046A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4632186B2 (en) * 2007-08-01 2011-02-16 太陽化学工業株式会社 Tin electrolytic plating solution for electronic parts, tin electrolytic plating method for electronic parts and tin electrolytic plated electronic parts
JP5622678B2 (en) * 2011-07-14 2014-11-12 石原ケミカル株式会社 Plating bath containing imidazole ring-bonded oxyalkylene compound
CN109570825B (en) * 2018-11-22 2021-07-13 东莞市绿志岛金属有限公司 Low-temperature halogen-free lead-free soldering paste and preparation method thereof
CN112410831B (en) * 2020-11-17 2021-11-26 广州三孚新材料科技股份有限公司 Electrotinning solution for heterojunction solar cell and preparation method thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4617097A (en) * 1983-12-22 1986-10-14 Learonal, Inc. Process and electrolyte for electroplating tin, lead or tin-lead alloys
JP3858241B2 (en) * 2002-04-09 2006-12-13 石原薬品株式会社 Barrel plating method using neutral tin plating bath
JP2004323971A (en) * 2003-04-25 2004-11-18 Rohm & Haas Electronic Materials Llc Improved bath analysis method

Also Published As

Publication number Publication date
CN101035929A (en) 2007-09-12
MY146391A (en) 2012-08-15
JP4404909B2 (en) 2010-01-27
KR20070055612A (en) 2007-05-30
HK1107125A1 (en) 2008-03-28
TWI307729B (en) 2009-03-21
CN101035929B (en) 2010-08-25
JPWO2006068046A1 (en) 2008-08-07
WO2006068046A1 (en) 2006-06-29

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