WO2008081637A1 - Reduction-type electroless tin plating solution and tin plating films made by using the same - Google Patents

Reduction-type electroless tin plating solution and tin plating films made by using the same Download PDF

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Publication number
WO2008081637A1
WO2008081637A1 PCT/JP2007/070564 JP2007070564W WO2008081637A1 WO 2008081637 A1 WO2008081637 A1 WO 2008081637A1 JP 2007070564 W JP2007070564 W JP 2007070564W WO 2008081637 A1 WO2008081637 A1 WO 2008081637A1
Authority
WO
WIPO (PCT)
Prior art keywords
tin plating
reduction
plating solution
type electroless
same
Prior art date
Application number
PCT/JP2007/070564
Other languages
French (fr)
Japanese (ja)
Inventor
Shigeki Shimizu
Ryuji Takasaki
Yoshizou Kiyohara
Yoshinori Kogure
Original Assignee
Japan Pure Chemical Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Pure Chemical Co., Ltd. filed Critical Japan Pure Chemical Co., Ltd.
Publication of WO2008081637A1 publication Critical patent/WO2008081637A1/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys

Abstract

The invention aims at providing a reduction-type electroless tin plating solution which is suppressed in the substitution reaction on a substrate copper or copper alloy and enables stable deposition and which is stable and good for practical use, and provides a reduction-type electroless tin plating solution characterized by comprising as the essential constituents a water-soluble tin compound, a water-soluble titanium compound, and an organic complexing agent containing trivalent phosphorus; a process for the production of tin plating films by using the tin plating solution; and tin plating films obtained by electroless plating with the solution.
PCT/JP2007/070564 2006-12-27 2007-10-22 Reduction-type electroless tin plating solution and tin plating films made by using the same WO2008081637A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006-352330 2006-12-27
JP2006352330 2006-12-27

Publications (1)

Publication Number Publication Date
WO2008081637A1 true WO2008081637A1 (en) 2008-07-10

Family

ID=39588322

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/070564 WO2008081637A1 (en) 2006-12-27 2007-10-22 Reduction-type electroless tin plating solution and tin plating films made by using the same

Country Status (2)

Country Link
TW (1) TW200839032A (en)
WO (1) WO2008081637A1 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012017514A (en) * 2010-07-07 2012-01-26 Samsung Electro-Mechanics Co Ltd Nonelectrolyte tin reduction plating liquid and nonelectrolyte tin reduction plating method using the same
JP2012041630A (en) * 2010-08-18 2012-03-01 Samsung Electro-Mechanics Co Ltd Plating solution for forming tin alloy and method of forming tin alloy film using the same
EP2481835A1 (en) 2011-01-28 2012-08-01 Atotech Deutschland GmbH Autocatalytic plating bath composition for deposition of tin and tin alloys
JP2013227641A (en) * 2012-03-30 2013-11-07 Ishihara Chem Co Ltd Method for replenishing to tin-based plating solution
CN107914009A (en) * 2017-12-15 2018-04-17 宁波广新纳米材料有限公司 A kind of production method of tin plating copper powder
CN108097949A (en) * 2017-12-15 2018-06-01 宁波广新纳米材料有限公司 A kind of production method of tin plating nickel powder
WO2018122058A1 (en) 2016-12-28 2018-07-05 Atotech Deutschland Gmbh Tin plating bath and a method for depositing tin or tin alloy onto a surface of a substrate
JP7169020B1 (en) * 2021-12-27 2022-11-10 石原ケミカル株式会社 Reduction type electroless indium plating bath

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5965700A (en) * 1982-10-08 1984-04-13 Chiyoda Chem Eng & Constr Co Ltd Control method of lpg gasification facility
JPH0361380A (en) * 1989-07-28 1991-03-18 Metsuku Kk Electroless tin plating bath
JPH0711448A (en) * 1993-06-29 1995-01-13 Ishihara Chem Co Ltd Catalytic solution for electroless plating selective to copper-based material
JPH0740767U (en) * 1993-12-28 1995-07-21 日立電線株式会社 Electroless tin plating equipment
JPH0860376A (en) * 1994-08-12 1996-03-05 Murata Mfg Co Ltd Electroless plating method
JPH09302476A (en) * 1996-05-10 1997-11-25 Daiwa Kasei Kenkyusho:Kk Electroless tin-silver alloy plating bath
JPH1161426A (en) * 1997-08-22 1999-03-05 Ishihara Chem Co Ltd Electroless tin and tin alloy plating bath, electroless plating and electronic part coated with tin or tin alloy film in the electroless plating bath
JPH11209585A (en) * 1998-01-28 1999-08-03 Asahi Denka Kogyo Kk Polyol resin composition
JP2005089712A (en) * 2003-09-19 2005-04-07 Ito Seiyu Kk Polyol composition and adhesive composition by using the same

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5965700A (en) * 1982-10-08 1984-04-13 Chiyoda Chem Eng & Constr Co Ltd Control method of lpg gasification facility
JPH0361380A (en) * 1989-07-28 1991-03-18 Metsuku Kk Electroless tin plating bath
JPH0711448A (en) * 1993-06-29 1995-01-13 Ishihara Chem Co Ltd Catalytic solution for electroless plating selective to copper-based material
JPH0740767U (en) * 1993-12-28 1995-07-21 日立電線株式会社 Electroless tin plating equipment
JPH0860376A (en) * 1994-08-12 1996-03-05 Murata Mfg Co Ltd Electroless plating method
JPH09302476A (en) * 1996-05-10 1997-11-25 Daiwa Kasei Kenkyusho:Kk Electroless tin-silver alloy plating bath
JPH1161426A (en) * 1997-08-22 1999-03-05 Ishihara Chem Co Ltd Electroless tin and tin alloy plating bath, electroless plating and electronic part coated with tin or tin alloy film in the electroless plating bath
JPH11209585A (en) * 1998-01-28 1999-08-03 Asahi Denka Kogyo Kk Polyol resin composition
JP2005089712A (en) * 2003-09-19 2005-04-07 Ito Seiyu Kk Polyol composition and adhesive composition by using the same

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012017514A (en) * 2010-07-07 2012-01-26 Samsung Electro-Mechanics Co Ltd Nonelectrolyte tin reduction plating liquid and nonelectrolyte tin reduction plating method using the same
JP2012041630A (en) * 2010-08-18 2012-03-01 Samsung Electro-Mechanics Co Ltd Plating solution for forming tin alloy and method of forming tin alloy film using the same
US20130309404A1 (en) * 2011-01-28 2013-11-21 Atotech Deutschland Gmbh Autocatalytic plating bath composition for deposition of tin and tin alloys
WO2012100982A1 (en) 2011-01-28 2012-08-02 Atotech Deutschland Gmbh Autocatalytic plating bath composition for deposition of tin and tin alloys
CN103339287A (en) * 2011-01-28 2013-10-02 埃托特克德国有限公司 Autocatalytic plating bath composition for deposition of tin and tin alloys
EP2481835A1 (en) 2011-01-28 2012-08-01 Atotech Deutschland GmbH Autocatalytic plating bath composition for deposition of tin and tin alloys
US8801844B2 (en) * 2011-01-28 2014-08-12 Atotech Deutschland Gmbh Autocatalytic plating bath composition for deposition of tin and tin alloys
JP2013227641A (en) * 2012-03-30 2013-11-07 Ishihara Chem Co Ltd Method for replenishing to tin-based plating solution
WO2018122058A1 (en) 2016-12-28 2018-07-05 Atotech Deutschland Gmbh Tin plating bath and a method for depositing tin or tin alloy onto a surface of a substrate
US11274375B2 (en) 2016-12-28 2022-03-15 Atotech Deutschland Gmbh Tin plating bath and a method for depositing tin or tin alloy onto a surface of a substrate
CN107914009A (en) * 2017-12-15 2018-04-17 宁波广新纳米材料有限公司 A kind of production method of tin plating copper powder
CN108097949A (en) * 2017-12-15 2018-06-01 宁波广新纳米材料有限公司 A kind of production method of tin plating nickel powder
JP7169020B1 (en) * 2021-12-27 2022-11-10 石原ケミカル株式会社 Reduction type electroless indium plating bath

Also Published As

Publication number Publication date
TW200839032A (en) 2008-10-01

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