MY127378A - Plastic molded type semiconductor device and fabrication process thereof - Google Patents

Abstract

A PROCESS IS PROVIDED FOR THE FABRICATION OF A PLASTIC MOLDED TYPE SEMICONDUCTOR DEVICE IN WHICH A DIE PAD (3A) IS FORMED TO HAVE A SMALLER AREA THAN A SEMICONDUCTOR CHIP (2) TO BE MOUNTED ON A PRINCIPAL SURFACE OF THE DIE PAD (3A) AND THE SEMICONDUCTOR CHIP (2) AND DIE PAD (3A) ARE SEALED WITH A PLASTIC MOLD (1). THE SEMICONDUCTOR CHIP (2) AND THE DIE PAD (3A) ARE DISPOSED WITHIN A CAVITY (11) OF A MOLD (10) SO THAT THE CLEARANCE (CL2) FROM THE REVERSE SURFACE OF THE DIE PAD (3A) TO THE INSIDE WALL SURFACE OF THE CAVITY OPPOSITE TO THE REVERSE SURFACE OF THE DIE PAD (3A) BECOMES NARROWER, BY A LENGTH CORRESPONDING TO THE THICKNESS OF THE DIE PAD (3A), THAN THE CLEARANCE (CL1) FROM THE PRINCIPAL SURFACE OF THE SEMICONDUCTOR CHIP (2) TO THE INSIDE WALL SURFACE OF THE CAVITY (11) OPPOSITE TO THE PRINCIPAL SURFACE OF THE SEMICONDUCTOR CHIP (2); AND A RESIN (1A) IS POURED FROM A CENTER GATE (12) INTO SAID CAVITY (11) TO FORM A PLASTIC MOLD (1), WHICH MAKES IT POSSIBLE TO PREVENT SAID SEMICONDUCTOR CHIP (2) FROM BEING LIFTED UPWARDLY BY THE RESIN (1A) FLOWING IN A FILLING REGION (11A) ON THE REVERSE SURFACE SIDE OF THE SEMICONDUCTOR CHIP (2). AS A RESULT, INCONVENIENT SHIFTING OF THE SEMICONDUCTOR CHIP (2), BONDING WIRES (5) AND THE LIKE IN THE PLASTIC MOLD (1) CAN BE PREVENTED, LEADING TO AN INCREASE IN THE YIELD OF THE PLASTIC MOLDED TYPE SEMICONDUCTOR DEVICE. (FIG. 8)