MXPA05004222A - Composiciones de curacion dual de humedad-uv y de curacion de rapida humedad. - Google Patents
Composiciones de curacion dual de humedad-uv y de curacion de rapida humedad.Info
- Publication number
- MXPA05004222A MXPA05004222A MXPA05004222A MXPA05004222A MXPA05004222A MX PA05004222 A MXPA05004222 A MX PA05004222A MX PA05004222 A MXPA05004222 A MX PA05004222A MX PA05004222 A MXPA05004222 A MX PA05004222A MX PA05004222 A MXPA05004222 A MX PA05004222A
- Authority
- MX
- Mexico
- Prior art keywords
- moisture
- fast
- curing
- compositions
- silanol
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title abstract 4
- 238000013008 moisture curing Methods 0.000 title abstract 3
- 238000001723 curing Methods 0.000 title 1
- 230000009977 dual effect Effects 0.000 title 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 2
- 230000002349 favourable effect Effects 0.000 abstract 2
- 229910000077 silane Inorganic materials 0.000 abstract 2
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 abstract 2
- 229910052710 silicon Inorganic materials 0.000 abstract 2
- 230000007704 transition Effects 0.000 abstract 2
- 229910052799 carbon Inorganic materials 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 238000000016 photochemical curing Methods 0.000 abstract 1
- 229920001296 polysiloxane Polymers 0.000 abstract 1
- 238000002360 preparation method Methods 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/38—Polysiloxanes modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0091—Complexes with metal-heteroatom-bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/07—Aldehydes; Ketones
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
- C08K5/31—Guanidine; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/544—Silicon-containing compounds containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
- C08L101/10—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing hydrolysable silane groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
- C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- General Chemical & Material Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Silicon Polymers (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Electroluminescent Light Sources (AREA)
- Sealing Material Composition (AREA)
- Reinforced Plastic Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US42070502P | 2002-10-23 | 2002-10-23 | |
| PCT/US2003/032537 WO2004037868A1 (en) | 2002-10-23 | 2003-10-15 | Fast moisture curing and uv-moisture dual curing compositions |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MXPA05004222A true MXPA05004222A (es) | 2005-10-26 |
Family
ID=32176616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MXPA05004222A MXPA05004222A (es) | 2002-10-23 | 2003-10-15 | Composiciones de curacion dual de humedad-uv y de curacion de rapida humedad. |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US7368519B2 (enExample) |
| EP (1) | EP1578810B1 (enExample) |
| JP (1) | JP4754824B2 (enExample) |
| KR (1) | KR100967770B1 (enExample) |
| CN (1) | CN1705684B (enExample) |
| AT (1) | ATE358141T1 (enExample) |
| AU (1) | AU2003287087A1 (enExample) |
| CA (1) | CA2499186C (enExample) |
| DE (1) | DE60312891T2 (enExample) |
| MX (1) | MXPA05004222A (enExample) |
| PT (1) | PT1578810E (enExample) |
| WO (1) | WO2004037868A1 (enExample) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050234208A1 (en) * | 2004-04-14 | 2005-10-20 | Matthias Koch | Fast curing polydiorganosiloxanes |
| FR2878855B1 (fr) * | 2004-12-07 | 2007-02-09 | Rhodia Chimie Sa | Procede de preparation de polyorganosiloxane a groupements fonctionnels en presence de silanolate de lithium |
| WO2007061846A2 (en) * | 2005-11-22 | 2007-05-31 | Henkel Corporation | Moisture-curable silylated polymers for fast moisture curing compositions |
| US20080268161A1 (en) * | 2005-11-29 | 2008-10-30 | Henkel Corporation | Radiation Cure Silicone Compositions |
| US20070219285A1 (en) * | 2006-03-17 | 2007-09-20 | 3M Innovative Properties Company | Uv b-stageable, moisture curable composition useful for rapid electronic device assembly |
| JP4302721B2 (ja) * | 2006-07-10 | 2009-07-29 | 信越化学工業株式会社 | 硬化性オルガノポリシロキサン組成物、それを含むフラットパネルディスプレイ用シール剤、及びフラットパネルディスプレイ素子 |
| DE102007038661A1 (de) * | 2007-08-15 | 2009-02-19 | Henkel Ag & Co. Kgaa | Silanvernetzender Kleb- oder Dichtstoff mit N-Silylakylamiden und seine Verwendung |
| PL2388294T3 (pl) * | 2007-12-03 | 2013-10-31 | Borealis Tech Oy | Zastosowanie środka suszącego zawierającego krzem w kompozycji poliolefinowej zawierającej poliolefiny ulegające usieciowaniu z grupami silanowymi oraz katalizator kondensacji silanolu |
| WO2009085183A2 (en) * | 2007-12-20 | 2009-07-09 | Henkel Corporation | Method of polymer bodying to obtain instant sealing of form-in-place engine gasketing sealants |
| DE102009002231A1 (de) * | 2009-04-06 | 2010-10-07 | Wacker Chemie Ag | Bei Raumtemperatur selbsthaftende Pt-katalysierte additions-vernetzende Siliconzusammensetzungen |
| DE102009045866A1 (de) * | 2009-10-20 | 2011-04-21 | Wacker Chemie Ag | Stabilisierte feuchtevernetzbare Polymere mit 2-phasiger Vernetzungskinetik |
| DE102010010598A1 (de) * | 2010-03-08 | 2011-09-08 | Delo Industrie Klebstoffe Gmbh & Co. Kgaa | Dual härtende Masse und deren Verwendung |
| CN102408569B (zh) * | 2010-09-21 | 2013-07-24 | 北京化工大学 | 一种可双固化聚硅氧烷丙烯酸酯树脂及其制备方法 |
| US8901198B2 (en) | 2010-11-05 | 2014-12-02 | Ppg Industries Ohio, Inc. | UV-curable coating compositions, multi-component composite coatings, and related coated substrates |
| CN102604224B (zh) * | 2012-03-16 | 2014-01-22 | 武汉富蒂亚新型材料有限公司 | 一种高熔体强度聚丙烯材料及其制备方法 |
| CN102816551A (zh) * | 2012-05-23 | 2012-12-12 | 烟台信友电子有限公司 | 一种uv-湿气双固化液态光学透明胶及其制备方法 |
| US8729179B1 (en) * | 2012-08-20 | 2014-05-20 | Henkel US IP LLC | Moisture curable polyacrylates |
| GB201323041D0 (en) * | 2013-12-23 | 2014-02-12 | Dow Corning | Curable coating compositions containing an unsaturated alkoxysilane |
| US9732191B2 (en) | 2014-01-08 | 2017-08-15 | Dow Corning Corporation | Method for capping MQ-type silicone resins |
| CN103992650A (zh) * | 2014-04-11 | 2014-08-20 | 郝建强 | 紫外线/湿气双固化有机硅树脂组成物 |
| EP3371232B1 (en) | 2015-11-03 | 2021-01-06 | LORD Corporation | Two-parts adhesive system |
| US10035911B2 (en) * | 2016-05-19 | 2018-07-31 | Momentive Performance Materials Inc. | Curable, dual cure, one part silicone composition |
| CN108977163A (zh) * | 2017-06-05 | 2018-12-11 | 惠展电子材料（上海）有限公司 | 一种快干建筑密封胶组合物 |
| KR102238704B1 (ko) * | 2018-12-21 | 2021-04-08 | 주식회사 엘지화학 | 가교제 화합물, 이를 포함하는 감광성 조성물, 및 이를 이용한 감광 재료 |
| CN111303776B (zh) * | 2020-03-09 | 2022-03-18 | 杭州电子科技大学 | 一种光-湿气固化组合物及其制备方法 |
| CN113045697B (zh) * | 2021-02-04 | 2021-10-12 | 东莞市德聚胶接技术有限公司 | 一种改性丙烯酸酯低聚物及一种uv、湿气双重固化压敏胶 |
| TW202432716A (zh) * | 2022-12-23 | 2024-08-16 | 美商陶氏有機矽公司 | 具有儲存期限穩定性之雙重固化有機聚矽氧烷組成物 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4675346A (en) * | 1983-06-20 | 1987-06-23 | Loctite Corporation | UV curable silicone rubber compositions |
| US4528081A (en) * | 1983-10-03 | 1985-07-09 | Loctite Corporation | Dual curing silicone, method of preparing same and dielectric soft-gel compositions thereof |
| US4699802A (en) * | 1983-10-03 | 1987-10-13 | Loctite Corporation | Dual curing coating method for substrates with shadow areas |
| US5182315A (en) * | 1990-11-19 | 1993-01-26 | Loctite Corporation | Photocurable silicone gel composition, and method of making the same |
| EP0512730B1 (en) * | 1991-05-06 | 1996-02-21 | Dow Corning S.A. | Manufacture of moisture curable organosiloxane compositions |
| US5391677A (en) * | 1991-07-23 | 1995-02-21 | Shin-Etsu Chemical Co., Ltd. | Acrylic-functional organopolysiloxane and method for the preparation thereof |
| US5340847A (en) * | 1991-10-23 | 1994-08-23 | Three Bond Co., Ltd. | Curable silicon composition |
| JP3261592B2 (ja) * | 1992-04-20 | 2002-03-04 | 株式会社スリーボンド | 湿気硬化及び光硬化しうるシリコーン組成物 |
| JP2639286B2 (ja) * | 1992-07-14 | 1997-08-06 | 信越化学工業株式会社 | 硬化性オルガノポリシロキサン組成物 |
| EP0628605B1 (en) * | 1993-06-11 | 1999-08-04 | Three Bond Co., Ltd. | Moisture - or anaerobic-curable and photocurable silicone compositions |
| US5409963A (en) * | 1993-12-28 | 1995-04-25 | Three Bond Co., Ltd. | Curable silicone composition |
| US5405888A (en) * | 1993-12-28 | 1995-04-11 | Three Bond Co, Ltd. | Curable silicone composition |
| DE19725518A1 (de) * | 1997-06-17 | 1998-12-24 | Huels Silicone Gmbh | Polyorganosiloxane mit Dialkoxyorganosiloxy-Gruppen |
| DE10219734A1 (de) * | 2002-05-02 | 2003-06-05 | Consortium Elektrochem Ind | Herstellung von (meth)acrylfunktionellen Siloxanen |
-
2003
- 2003-10-15 WO PCT/US2003/032537 patent/WO2004037868A1/en not_active Ceased
- 2003-10-15 CN CN200380101926XA patent/CN1705684B/zh not_active Expired - Lifetime
- 2003-10-15 EP EP03777610A patent/EP1578810B1/en not_active Expired - Lifetime
- 2003-10-15 US US10/524,542 patent/US7368519B2/en not_active Expired - Lifetime
- 2003-10-15 KR KR1020057006939A patent/KR100967770B1/ko not_active Expired - Lifetime
- 2003-10-15 AU AU2003287087A patent/AU2003287087A1/en not_active Abandoned
- 2003-10-15 CA CA2499186A patent/CA2499186C/en not_active Expired - Fee Related
- 2003-10-15 JP JP2004546860A patent/JP4754824B2/ja not_active Expired - Lifetime
- 2003-10-15 AT AT03777610T patent/ATE358141T1/de not_active IP Right Cessation
- 2003-10-15 DE DE60312891T patent/DE60312891T2/de not_active Expired - Lifetime
- 2003-10-15 PT PT03777610T patent/PT1578810E/pt unknown
- 2003-10-15 MX MXPA05004222A patent/MXPA05004222A/es active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| US20050267276A1 (en) | 2005-12-01 |
| ATE358141T1 (de) | 2007-04-15 |
| AU2003287087A1 (en) | 2004-05-13 |
| EP1578810A1 (en) | 2005-09-28 |
| KR20050074968A (ko) | 2005-07-19 |
| PT1578810E (pt) | 2007-06-18 |
| JP2006503960A (ja) | 2006-02-02 |
| WO2004037868A1 (en) | 2004-05-06 |
| KR100967770B1 (ko) | 2010-07-05 |
| CA2499186A1 (en) | 2004-05-06 |
| CN1705684B (zh) | 2013-03-27 |
| US7368519B2 (en) | 2008-05-06 |
| CA2499186C (en) | 2012-06-26 |
| DE60312891D1 (de) | 2007-05-10 |
| EP1578810B1 (en) | 2007-03-28 |
| JP4754824B2 (ja) | 2011-08-24 |
| CN1705684A (zh) | 2005-12-07 |
| EP1578810A4 (en) | 2006-01-18 |
| DE60312891T2 (de) | 2007-12-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FG | Grant or registration | ||
| GD | Licence granted |