MX9206785A - Solucion de electrodeposicion acuosa y proceso para la electrodeposicion acuosa por desplazamiento de una superficie de metal de substrato con otro metal. - Google Patents

Solucion de electrodeposicion acuosa y proceso para la electrodeposicion acuosa por desplazamiento de una superficie de metal de substrato con otro metal.

Info

Publication number
MX9206785A
MX9206785A MX9206785A MX9206785A MX9206785A MX 9206785 A MX9206785 A MX 9206785A MX 9206785 A MX9206785 A MX 9206785A MX 9206785 A MX9206785 A MX 9206785A MX 9206785 A MX9206785 A MX 9206785A
Authority
MX
Mexico
Prior art keywords
displacement
solution
methyl
aqueous electro
electro deposit
Prior art date
Application number
MX9206785A
Other languages
English (en)
Inventor
Americus C Vitale
John R Dodd
Anthony Joseph Arduengo Iii
Randal Daniel King
Original Assignee
Rohco Inc Mcgean
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohco Inc Mcgean filed Critical Rohco Inc Mcgean
Publication of MX9206785A publication Critical patent/MX9206785A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/073—Displacement plating, substitution plating or immersion plating, e.g. for finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

Se describe un agente de reemplazo efectivo, ambientalmente inocuo, para la tiourea, para utilizarse como un agente complejo en los procesos de electrodeposición de desplazamiento, en los cuales la solución de electrodeposición se aplica a la superficie del substrato que va a ser electrodepositada por inmersión o por rocío, en cascada, vaciado y similares. El agente complejo de reemplazo es un compuesto dialquilimidazol-2-tiona no simétrico, que tiene la fórmula I: en donde A es metilo o etilo, y cuando A es metilo, B es un grupo alquilo o cicloalquilo de 3 a 6 átomos de carbono, y cuando A es etilo, B es un grupo alquilo o cicloalquilo de 4 a 6 átomos de carbono. De esta clase de compuestos, se prefiere el 1-metil-3-propil-2-tiocarbonil-2,3-dihidroimidazol para la electrodeposición de estaño por inmersión. Esta clase de agentes complejos es particularmente útil en la electrodeposición de estaño de desplazamiento por rocío, para la fabricación de tableros de circuitos impresos, en donde el metal de estaño libre se adiciona a la solución de electrodeposición.
MX9206785A 1991-11-27 1992-11-25 Solucion de electrodeposicion acuosa y proceso para la electrodeposicion acuosa por desplazamiento de una superficie de metal de substrato con otro metal. MX9206785A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/799,136 US5196053A (en) 1991-11-27 1991-11-27 Complexing agent for displacement tin plating

Publications (1)

Publication Number Publication Date
MX9206785A true MX9206785A (es) 1994-05-31

Family

ID=25175114

Family Applications (1)

Application Number Title Priority Date Filing Date
MX9206785A MX9206785A (es) 1991-11-27 1992-11-25 Solucion de electrodeposicion acuosa y proceso para la electrodeposicion acuosa por desplazamiento de una superficie de metal de substrato con otro metal.

Country Status (8)

Country Link
US (1) US5196053A (es)
EP (1) EP0545218B1 (es)
JP (1) JP3314966B2 (es)
KR (1) KR100292945B1 (es)
CA (1) CA2083197C (es)
DE (1) DE69218892T2 (es)
IL (1) IL103895A (es)
MX (1) MX9206785A (es)

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US5411595A (en) * 1993-07-13 1995-05-02 Mcgean-Rohco, Inc. Post-etch, printed circuit board cleaning process
GB9425030D0 (en) 1994-12-09 1995-02-08 Alpha Metals Ltd Silver plating
GB9425031D0 (en) * 1994-12-09 1995-02-08 Alpha Metals Ltd Printed circuit board manufacture
US5554211A (en) * 1995-11-15 1996-09-10 Mcgean-Rohco, Inc. Aqueous electroless plating solutions
US5733599A (en) * 1996-03-22 1998-03-31 Macdermid, Incorporated Method for enhancing the solderability of a surface
US6905587B2 (en) 1996-03-22 2005-06-14 Ronald Redline Method for enhancing the solderability of a surface
US6544397B2 (en) 1996-03-22 2003-04-08 Ronald Redline Method for enhancing the solderability of a surface
US5928790A (en) * 1996-04-23 1999-07-27 Mcgean-Rohco, Inc. Multilayer circuit boards and processes of making the same
DE19755185B4 (de) * 1997-12-11 2004-04-08 Ami Doduco Gmbh Austausch Zinnbad
US6284309B1 (en) 1997-12-19 2001-09-04 Atotech Deutschland Gmbh Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom
US6063172A (en) * 1998-10-13 2000-05-16 Mcgean-Rohco, Inc. Aqueous immersion plating bath and method for plating
USRE45842E1 (en) 1999-02-17 2016-01-12 Ronald Redline Method for enhancing the solderability of a surface
WO2004073890A1 (en) 1999-04-22 2004-09-02 Demaso Arthur J Process for providing bond enhancement and an etch resist in the fabrication of printed circuit boards
US6361823B1 (en) 1999-12-03 2002-03-26 Atotech Deutschland Gmbh Process for whisker-free aqueous electroless tin plating
US6551931B1 (en) * 2000-11-07 2003-04-22 International Business Machines Corporation Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped
SE519898C2 (sv) * 2001-09-10 2003-04-22 Obducat Ab Sätt att etsa koppar på kort samt anordning och elektrolyt för utförande av sättet
JP3851623B2 (ja) * 2003-02-07 2006-11-29 株式会社新潟グルメ 自動製パン器
JP4524773B2 (ja) * 2003-03-14 2010-08-18 石原薬品株式会社 無電解スズメッキ浴の分割保存方法
JP4572363B2 (ja) * 2003-04-30 2010-11-04 メック株式会社 銅と配線基板用樹脂との接着層形成液及びその液を用いた銅と配線基板用樹脂との接着層の製造方法
US7037559B2 (en) * 2003-05-01 2006-05-02 International Business Machines Corporation Immersion plating and plated structures
DE102004003784B4 (de) * 2004-01-23 2011-01-13 Ormecon Gmbh Dispersion intrinsisch leitfähigen Polyanilins und deren Verwendung
DE102004030930A1 (de) * 2004-06-25 2006-02-23 Ormecon Gmbh Zinnbeschichtete Leiterplatten mit geringer Neigung zur Whiskerbildung
US20060096867A1 (en) * 2004-11-10 2006-05-11 George Bokisa Tin alloy electroplating system
EP1696052B1 (en) * 2005-02-28 2010-10-06 Rohm and Haas Electronic Materials, L.L.C. Improved fluxing methods
US20090145764A1 (en) * 2007-12-11 2009-06-11 Enthone Inc. Composite coatings for whisker reduction
US8226807B2 (en) * 2007-12-11 2012-07-24 Enthone Inc. Composite coatings for whisker reduction
US7807572B2 (en) * 2008-01-04 2010-10-05 Freescale Semiconductor, Inc. Micropad formation for a semiconductor
US8278456B2 (en) * 2008-06-20 2012-10-02 University Of Georgia Research Foundation, Inc. Synthesis and stabilization of neutral compounds with homonuclear bonds
JP5317099B2 (ja) 2008-07-02 2013-10-16 メック株式会社 接着層形成液
JP5522617B2 (ja) * 2008-11-05 2014-06-18 メック株式会社 接着層形成液及び接着層形成方法
US8491713B2 (en) * 2009-01-14 2013-07-23 Atotech Deutschland Gmbh Solution and process for increasing the solderability and corrosion resistance of a metal or metal alloy surface
EP2476779B1 (en) * 2011-01-13 2013-03-20 Atotech Deutschland GmbH Immersion tin or tin alloy plating bath with improved removal of cupurous ions

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US3303029A (en) * 1964-01-23 1967-02-07 Shipley Co Tin coating of copper surfaces by replacement plating
BE793769A (fr) * 1972-01-17 1973-05-02 Parker Ste Continentale Solution et procede pour former un depot de cuivre et d'etain sans utilisation de courant electrique
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Also Published As

Publication number Publication date
CA2083197C (en) 1998-01-06
KR100292945B1 (ko) 2001-06-15
US5196053A (en) 1993-03-23
KR930010225A (ko) 1993-06-22
IL103895A (en) 1997-04-15
EP0545218B1 (en) 1997-04-09
EP0545218A2 (en) 1993-06-09
JP3314966B2 (ja) 2002-08-19
CA2083197A1 (en) 1993-05-28
IL103895A0 (en) 1993-04-04
DE69218892T2 (de) 1997-11-20
DE69218892D1 (de) 1997-05-15
JPH05263258A (ja) 1993-10-12
EP0545218A3 (en) 1994-10-12

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