MX9206174A - Soldadura eutectica mejorada resistente a la fatiga. - Google Patents

Soldadura eutectica mejorada resistente a la fatiga.

Info

Publication number
MX9206174A
MX9206174A MX9206174A MX9206174A MX9206174A MX 9206174 A MX9206174 A MX 9206174A MX 9206174 A MX9206174 A MX 9206174A MX 9206174 A MX9206174 A MX 9206174A MX 9206174 A MX9206174 A MX 9206174A
Authority
MX
Mexico
Prior art keywords
fatigue
fatigue resistance
cadmium
indium
weight percent
Prior art date
Application number
MX9206174A
Other languages
English (en)
Spanish (es)
Inventor
Boon Wong
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of MX9206174A publication Critical patent/MX9206174A/es

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
MX9206174A 1991-10-28 1992-10-27 Soldadura eutectica mejorada resistente a la fatiga. MX9206174A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US78330091A 1991-10-28 1991-10-28

Publications (1)

Publication Number Publication Date
MX9206174A true MX9206174A (es) 1993-07-01

Family

ID=25128799

Family Applications (1)

Application Number Title Priority Date Filing Date
MX9206174A MX9206174A (es) 1991-10-28 1992-10-27 Soldadura eutectica mejorada resistente a la fatiga.

Country Status (10)

Country Link
US (1) US5308578A (OSRAM)
EP (1) EP0539725B1 (OSRAM)
JP (1) JP2558045B2 (OSRAM)
KR (1) KR960007000B1 (OSRAM)
CA (1) CA2078538C (OSRAM)
DE (1) DE69217532T2 (OSRAM)
DK (1) DK0539725T3 (OSRAM)
MX (1) MX9206174A (OSRAM)
MY (1) MY108000A (OSRAM)
TW (1) TW205014B (OSRAM)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5340411A (en) * 1993-10-12 1994-08-23 Hughes Aircraft Company Surface treatment method for fatigue-resistant solder
JPH07246493A (ja) * 1994-03-09 1995-09-26 Nippon Superia Shiya:Kk はんだ合金
US6184475B1 (en) * 1994-09-29 2001-02-06 Fujitsu Limited Lead-free solder composition with Bi, In and Sn
JPH0997791A (ja) * 1995-09-27 1997-04-08 Internatl Business Mach Corp <Ibm> バンプ構造、バンプの形成方法、実装接続体
CN1069566C (zh) * 1997-04-29 2001-08-15 北京有色金属研究总院 低温铝焊料及其制造方法
US6025649A (en) * 1997-07-22 2000-02-15 International Business Machines Corporation Pb-In-Sn tall C-4 for fatigue enhancement
US6285083B1 (en) * 1999-03-24 2001-09-04 Shinko Electric Industries Co., Ltd. Semiconductor device and mounting structure of a semiconductor device
US6319617B1 (en) 1999-12-17 2001-11-20 Agere Systems Gaurdian Corp. Oxide-bondable solder
US6642078B2 (en) * 2000-08-28 2003-11-04 Transpo Electronics, Inc. Method for manufacturing diode subassemblies used in rectifier assemblies of engine driven generators
JP2002153990A (ja) * 2000-11-21 2002-05-28 Senju Metal Ind Co Ltd はんだボール用合金
US6869007B2 (en) * 2001-01-26 2005-03-22 Lucent Technologies Inc. Oxidation-resistant reactive solders and brazes
US20040129764A1 (en) * 2003-01-07 2004-07-08 Dong Chun Christine Reducing surface tension and oxidation potential of tin-based solders
US7111771B2 (en) * 2003-03-31 2006-09-26 Intel Corporation Solders with surfactant-refined grain sizes, solder bumps made thereof, and methods of making same
US8653356B2 (en) * 2007-03-26 2014-02-18 The Boeing Company Thermoelectric devices and methods of manufacture

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1087561A (en) * 1911-07-01 1914-02-17 Lewis B Tebbetts Printing-plate.
US1568224A (en) * 1924-02-01 1926-01-05 Karafiat Josef Bearing metal
US1669580A (en) * 1924-10-11 1928-05-15 Speichert Max Process for extracting tin mixture from lead and tin alloys
US3607252A (en) * 1969-06-02 1971-09-21 Sperry Rand Corp Solder alloy composition
JPS5221980B2 (OSRAM) * 1972-02-19 1977-06-14
US3945556A (en) * 1975-02-25 1976-03-23 Alpha Metals, Inc. Functional alloy for use in automated soldering processes
JPS60203394A (ja) * 1984-03-29 1985-10-14 Taruchin Kk 耐食性はんだ合金
DE3425290A1 (de) * 1984-07-10 1986-01-16 Atlas Fahrzeugtechnik GmbH, 5980 Werdohl Piezokeramische ventilplatte und verfahren zu deren herstellung
JPS61165293A (ja) * 1985-01-18 1986-07-25 Toshiba Corp はんだ材
GB8628916D0 (en) * 1986-12-03 1987-01-07 Multicore Solders Ltd Solder composition
DE3730764C1 (de) * 1987-09-12 1988-07-14 Demetron Verwendung von Legierungen aus Zinn und/oder Blei als Weichlote zum Aufbringen von Halbleitern auf metallische Traeger
JP2543941B2 (ja) * 1988-03-17 1996-10-16 大豊工業株式会社 はんだ材
JP2543985B2 (ja) * 1989-06-28 1996-10-16 トヨタ自動車株式会社 はんだ材
JP2812367B2 (ja) * 1989-09-14 1998-10-22 トヨタ自動車株式会社 はんだ付部品にて接合部を構成するはんだ
US4937045A (en) * 1990-01-25 1990-06-26 M. C. Canfield Sons High-speed solder compositions

Also Published As

Publication number Publication date
CA2078538A1 (en) 1993-04-29
JP2558045B2 (ja) 1996-11-27
TW205014B (OSRAM) 1993-05-01
KR930007563A (ko) 1993-05-20
DK0539725T3 (OSRAM) 1997-03-17
KR960007000B1 (ko) 1996-05-27
DE69217532T2 (de) 1997-10-02
JPH05237687A (ja) 1993-09-17
US5308578A (en) 1994-05-03
MY108000A (en) 1996-07-15
CA2078538C (en) 1998-10-06
EP0539725A1 (en) 1993-05-05
EP0539725B1 (en) 1997-02-19
DE69217532D1 (de) 1997-03-27

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Legal Events

Date Code Title Description
FG Grant or registration
MM Annulment or lapse due to non-payment of fees