KR930007563A - 내피로성이 개선된 공정솔더 - Google Patents

내피로성이 개선된 공정솔더 Download PDF

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Publication number
KR930007563A
KR930007563A KR1019920019834A KR920019834A KR930007563A KR 930007563 A KR930007563 A KR 930007563A KR 1019920019834 A KR1019920019834 A KR 1019920019834A KR 920019834 A KR920019834 A KR 920019834A KR 930007563 A KR930007563 A KR 930007563A
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KR
South Korea
Prior art keywords
lead
solder
indium
cadmium
fatigue resistance
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KR1019920019834A
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English (en)
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KR960007000B1 (ko
Inventor
웡 분
Original Assignee
원다 케이, 덴슨-로우
휴즈 에어크라프트 캄파니
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Application filed by 원다 케이, 덴슨-로우, 휴즈 에어크라프트 캄파니 filed Critical 원다 케이, 덴슨-로우
Publication of KR930007563A publication Critical patent/KR930007563A/ko
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Publication of KR960007000B1 publication Critical patent/KR960007000B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)

Abstract

납-주석 공정솔더의 내피로성은 솔더를 약 1.0중량% 미만의 카드뮴, 인듐 및 안티모니중에서 선택된 도펀트로 도핑함으로써 증가시킬 수 있다. 이렇게 도핑된 솔더는 열적 또는 기계적으로 유발된 주기적 응력 및 변형에 대한 내성이 증가된다. 그 결과, 솔더 이음부의 내피로성이 증가된다. 인듐 및 카드륨과 같은 도펀트를 0.5중량%미만의 혼합량으로 배합하는 것이 납-주석 공정솔더의 내피로성을 증가시키는 데 특히 효율적이다.

Description

내피로성이 개선된 공정솔더
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (7)

  1. 금속표면들을 함께 솔더링하기 위한 납-주석 공정솔더에 있어서, 카드뮴, 인듐, 안티모니 및 그것들의 혼합물중에서 선택된 도펀트가 약 1.0중량% 미만으로 도핑되는 것을 포함함을특징으로 하는 납-주석 공정솔더.
  2. 제1항에 있어서, 약 0.1 내지 0.8중량%의 상기 도펀트를 구비하는 납-주석 공정솔더.
  3. 제1항에 있어서, 카드뮴과 인듐의 혼합물을 함유하는 납-주석 공정솔더.
  4. 제3항에 있어서, 약 0.2중량%의 카드뮴과 약 0.2중량%의 인듐을 함유하는 납-주석 공정솔더.
  5. 제1항에 있어서, 인듐과 안티모니의 혼합물을 함유하는 납-주석 공정솔더.
  6. 납-주석 공정솔더를 이용하여 2개의 금속표면을 함께 솔더링하기 위한 방법에 있어서, 사익 납-주석 공정 솔더를 약 1.0중량% 미만의 카드뮴, 인듐, 안티모니 및 그것들의 혼합물중에서 선택된 도펀트로 도핑되는 것을 포함함을 특징으로 하는, 2개의 금속표면을 함께 솔더링하기 위한 방법.
  7. 일 조성물로부터 납-주석 솔더이음부를 형성하는 것을 특징으로 하는 납-주석 솔더 이음부의 내피로성 개선 방법에 있어서, 상기 조성물은 : (a) 납-주성 공정솔더와 : (b) 약 1.0 중량% 미만의 카드뮴,인듐, 안티모니 및 그것들의 혼합물중에서 선택된 도펀트를 포함하는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920019834A 1991-10-28 1992-10-27 내피로성이 개선된 공융솔더 KR960007000B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US78330091A 1991-10-28 1991-10-28
US783,300 1991-10-28

Publications (2)

Publication Number Publication Date
KR930007563A true KR930007563A (ko) 1993-05-20
KR960007000B1 KR960007000B1 (ko) 1996-05-27

Family

ID=25128799

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920019834A KR960007000B1 (ko) 1991-10-28 1992-10-27 내피로성이 개선된 공융솔더

Country Status (10)

Country Link
US (1) US5308578A (ko)
EP (1) EP0539725B1 (ko)
JP (1) JP2558045B2 (ko)
KR (1) KR960007000B1 (ko)
CA (1) CA2078538C (ko)
DE (1) DE69217532T2 (ko)
DK (1) DK0539725T3 (ko)
MX (1) MX9206174A (ko)
MY (1) MY108000A (ko)
TW (1) TW205014B (ko)

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US5340411A (en) * 1993-10-12 1994-08-23 Hughes Aircraft Company Surface treatment method for fatigue-resistant solder
JPH07246493A (ja) * 1994-03-09 1995-09-26 Nippon Superia Shiya:Kk はんだ合金
US6184475B1 (en) 1994-09-29 2001-02-06 Fujitsu Limited Lead-free solder composition with Bi, In and Sn
JPH0997791A (ja) * 1995-09-27 1997-04-08 Internatl Business Mach Corp <Ibm> バンプ構造、バンプの形成方法、実装接続体
CN1069566C (zh) * 1997-04-29 2001-08-15 北京有色金属研究总院 低温铝焊料及其制造方法
US6025649A (en) 1997-07-22 2000-02-15 International Business Machines Corporation Pb-In-Sn tall C-4 for fatigue enhancement
EP1039527A3 (en) * 1999-03-24 2002-03-06 Shinko Electric Industries Co. Ltd. Semiconductor device mounting structure
US6319617B1 (en) 1999-12-17 2001-11-20 Agere Systems Gaurdian Corp. Oxide-bondable solder
US6642078B2 (en) 2000-08-28 2003-11-04 Transpo Electronics, Inc. Method for manufacturing diode subassemblies used in rectifier assemblies of engine driven generators
JP2002153990A (ja) * 2000-11-21 2002-05-28 Senju Metal Ind Co Ltd はんだボール用合金
US6869007B2 (en) * 2001-01-26 2005-03-22 Lucent Technologies Inc. Oxidation-resistant reactive solders and brazes
US20040129764A1 (en) * 2003-01-07 2004-07-08 Dong Chun Christine Reducing surface tension and oxidation potential of tin-based solders
US7111771B2 (en) * 2003-03-31 2006-09-26 Intel Corporation Solders with surfactant-refined grain sizes, solder bumps made thereof, and methods of making same
US8653356B2 (en) * 2007-03-26 2014-02-18 The Boeing Company Thermoelectric devices and methods of manufacture

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US1087561A (en) * 1911-07-01 1914-02-17 Lewis B Tebbetts Printing-plate.
US1568224A (en) * 1924-02-01 1926-01-05 Karafiat Josef Bearing metal
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DE3425290A1 (de) * 1984-07-10 1986-01-16 Atlas Fahrzeugtechnik GmbH, 5980 Werdohl Piezokeramische ventilplatte und verfahren zu deren herstellung
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JP2543941B2 (ja) * 1988-03-17 1996-10-16 大豊工業株式会社 はんだ材
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Also Published As

Publication number Publication date
CA2078538A1 (en) 1993-04-29
EP0539725A1 (en) 1993-05-05
DE69217532D1 (de) 1997-03-27
KR960007000B1 (ko) 1996-05-27
TW205014B (ko) 1993-05-01
JP2558045B2 (ja) 1996-11-27
MX9206174A (es) 1993-07-01
DE69217532T2 (de) 1997-10-02
CA2078538C (en) 1998-10-06
US5308578A (en) 1994-05-03
JPH05237687A (ja) 1993-09-17
MY108000A (en) 1996-07-15
DK0539725T3 (ko) 1997-03-17
EP0539725B1 (en) 1997-02-19

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