MX2018006138A - Adhesivo estructural con modo de fallo mejorado. - Google Patents

Adhesivo estructural con modo de fallo mejorado.

Info

Publication number
MX2018006138A
MX2018006138A MX2018006138A MX2018006138A MX2018006138A MX 2018006138 A MX2018006138 A MX 2018006138A MX 2018006138 A MX2018006138 A MX 2018006138A MX 2018006138 A MX2018006138 A MX 2018006138A MX 2018006138 A MX2018006138 A MX 2018006138A
Authority
MX
Mexico
Prior art keywords
structural adhesive
failure mode
applications
composition
improved failure
Prior art date
Application number
MX2018006138A
Other languages
English (en)
Spanish (es)
Inventor
Elgimiabi Sohaib
Cura Elisabeth
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=54754439&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=MX2018006138(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of MX2018006138A publication Critical patent/MX2018006138A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
    • C08G2650/56—Polyhydroxyethers, e.g. phenoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Epoxy Resins (AREA)
MX2018006138A 2015-11-19 2016-11-17 Adhesivo estructural con modo de fallo mejorado. MX2018006138A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP15195469.0A EP3170877B1 (en) 2015-11-19 2015-11-19 Structural adhesive with improved failure mode
PCT/US2016/062498 WO2017087651A1 (en) 2015-11-19 2016-11-17 Structural adhesive with improved failure mode

Publications (1)

Publication Number Publication Date
MX2018006138A true MX2018006138A (es) 2018-08-15

Family

ID=54754439

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2018006138A MX2018006138A (es) 2015-11-19 2016-11-17 Adhesivo estructural con modo de fallo mejorado.

Country Status (9)

Country Link
US (1) US20180273811A1 (enExample)
EP (2) EP3170877B1 (enExample)
JP (3) JP2019503406A (enExample)
KR (1) KR20180083413A (enExample)
CN (1) CN108291130B (enExample)
BR (1) BR112018010315A2 (enExample)
CA (1) CA3005870A1 (enExample)
MX (1) MX2018006138A (enExample)
WO (1) WO2017087651A1 (enExample)

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EP3170860B1 (en) 2015-11-19 2020-07-29 3M Innovative Properties Company Structural adhesive with improved corrosion resistance
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EP3587527A1 (en) 2018-06-30 2020-01-01 3M Innovative Properties Company Full (per)fluoro polymer liner for adhesive tapes
JP2021534266A (ja) 2018-08-06 2021-12-09 ゼフィロス インコーポレイテッド 改善された破壊ひずみを有する高弾性率構造発泡体材料
EP3670626A1 (en) * 2018-12-17 2020-06-24 3M Innovative Properties Company Thermosettable precursor of a structural adhesive composition with corrosion resistance
JP7045768B2 (ja) 2019-04-03 2022-04-01 信越化学工業株式会社 生体電極組成物、生体電極、及び生体電極の製造方法
JP7082082B2 (ja) 2019-04-03 2022-06-07 信越化学工業株式会社 生体電極組成物、生体電極、及び生体電極の製造方法
JP7411537B2 (ja) 2020-01-22 2024-01-11 信越化学工業株式会社 生体電極組成物、生体電極、及び生体電極の製造方法
JP7410065B2 (ja) 2020-03-19 2024-01-09 信越化学工業株式会社 生体電極、生体電極の製造方法及び生体信号の測定方法
JP7406516B2 (ja) 2020-04-01 2023-12-27 信越化学工業株式会社 生体電極組成物、生体電極及び生体電極の製造方法
JP7524148B2 (ja) 2020-10-13 2024-07-29 信越化学工業株式会社 生体電極組成物、生体電極、生体電極の製造方法、高分子化合物及び複合体
JP7569298B2 (ja) 2020-11-05 2024-10-17 信越化学工業株式会社 生体電極組成物、生体電極、生体電極の製造方法及び反応複合体
JP7507136B2 (ja) 2020-11-05 2024-06-27 信越化学工業株式会社 生体電極組成物、生体電極、及び生体電極の製造方法
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JP7611807B2 (ja) 2021-01-06 2025-01-10 信越化学工業株式会社 生体電極組成物、生体電極、及び生体電極の製造方法
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JP7627671B2 (ja) 2021-04-16 2025-02-06 信越化学工業株式会社 生体電極組成物、生体電極、及び生体電極の製造方法
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JP2024014732A (ja) 2022-07-21 2024-02-01 信越化学工業株式会社 生体電極組成物、生体電極、及びその製造方法
CN115678475A (zh) * 2022-11-17 2023-02-03 上海希奈新材料科技有限公司 一种阻燃耐水煮耐高低温冲击的双组份环氧灌封胶及制备方法和应用
JP2024137755A (ja) 2023-03-23 2024-10-07 信越化学工業株式会社 生体電極組成物、生体電極、及び生体電極の製造方法
JP2025011039A (ja) 2023-07-10 2025-01-23 信越化学工業株式会社 生体電極組成物、生体電極、及び生体電極の製造方法
JP2025174080A (ja) 2024-05-16 2025-11-28 信越化学工業株式会社 生体電極組成物、生体電極、及び生体電極の製造方法

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Also Published As

Publication number Publication date
JP2019503406A (ja) 2019-02-07
WO2017087651A1 (en) 2017-05-26
EP3170877A1 (en) 2017-05-24
US20180273811A1 (en) 2018-09-27
JP2024056831A (ja) 2024-04-23
JP2022065120A (ja) 2022-04-26
CN108291130A (zh) 2018-07-17
KR20180083413A (ko) 2018-07-20
EP3377588B1 (en) 2023-05-03
BR112018010315A2 (pt) 2018-12-04
CN108291130B (zh) 2021-02-05
EP3377588A1 (en) 2018-09-26
CA3005870A1 (en) 2017-05-26
EP3170877B1 (en) 2020-11-18

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