MX2016008650A - Formulaciones de fundente termoestable libre de colofonia. - Google Patents
Formulaciones de fundente termoestable libre de colofonia.Info
- Publication number
- MX2016008650A MX2016008650A MX2016008650A MX2016008650A MX2016008650A MX 2016008650 A MX2016008650 A MX 2016008650A MX 2016008650 A MX2016008650 A MX 2016008650A MX 2016008650 A MX2016008650 A MX 2016008650A MX 2016008650 A MX2016008650 A MX 2016008650A
- Authority
- MX
- Mexico
- Prior art keywords
- rosin
- free thermosetting
- thermosetting flux
- thermal
- flux formulations
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3615—N-compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3618—Carboxylic acids or salts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Formulaciones de fundente termoestables libres de colofonia para mejorar la fiabilidad mecánica de las juntas de soldadura. De acuerdo con uno o más aspectos, una pasta de soldadura como se muestra y describe en el presente documento imparte propiedades de la junta de soldadura mejoradas o potenciadas relativas a al menos uno de drop shock, ciclo térmico, choque térmico, resistencia a la cizalladura, rendimiento de resistencia a la flexión, y/u otros atributos de rendimiento térmico-mecánico.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361922130P | 2013-12-31 | 2013-12-31 | |
PCT/US2014/072936 WO2015103362A1 (en) | 2013-12-31 | 2014-12-31 | Rosin-free thermosetting flux formulations |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2016008650A true MX2016008650A (es) | 2017-03-03 |
Family
ID=53494008
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2016008650A MX2016008650A (es) | 2013-12-31 | 2014-12-31 | Formulaciones de fundente termoestable libre de colofonia. |
Country Status (8)
Country | Link |
---|---|
US (1) | US9802275B2 (es) |
EP (1) | EP3089844B1 (es) |
JP (1) | JP2017508622A (es) |
CN (1) | CN106255569B (es) |
MX (1) | MX2016008650A (es) |
MY (1) | MY194842A (es) |
TW (1) | TWI701098B (es) |
WO (1) | WO2015103362A1 (es) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
PL2739432T3 (pl) * | 2011-08-02 | 2022-04-11 | Alpha Assembly Solutions Inc. | Stop lutowniczy o wysokiej udarności |
EP3172349A2 (en) * | 2014-07-21 | 2017-05-31 | Alpha Assembly Solutions Inc. | Low temperature high reliability tin alloy for soldering |
CN105845654A (zh) * | 2016-04-18 | 2016-08-10 | 南通富士通微电子股份有限公司 | 半导体封装装置 |
CN105914151B (zh) * | 2016-04-18 | 2019-06-25 | 通富微电子股份有限公司 | 半导体封装方法 |
DE102016112390B4 (de) | 2016-07-06 | 2021-08-12 | Infineon Technologies Ag | Lötpad und Verfahren zum Verbessern der Lötpadoberfläche |
CN106825982B (zh) * | 2017-02-07 | 2019-04-16 | 深圳市斯特纳新材料有限公司 | 一种低粘度防坍塌无铅焊锡膏及其制备方法 |
JP6998557B2 (ja) * | 2017-09-29 | 2022-01-18 | パナソニックIpマネジメント株式会社 | はんだ合金およびそれを用いた接合構造体 |
CN108637526B (zh) * | 2018-04-26 | 2020-08-11 | 天能集团(河南)能源科技有限公司 | 一种铅酸蓄电池用高性能助焊剂及其制备方法 |
US20210283727A1 (en) * | 2018-10-24 | 2021-09-16 | Alpha Assembly Solutions Inc. | Low temperature soldering solutions for polymer substrates, printed circuit boards and other joining applications |
JP6609073B1 (ja) | 2019-01-15 | 2019-11-20 | 株式会社日本マイクロニクス | プローブ基板及び電気的接続装置 |
JP2022533718A (ja) * | 2019-05-23 | 2022-07-25 | アルファ・アセンブリー・ソリューションズ・インコーポレイテッド | 太陽電池のモジュール製造のためのはんだペースト |
HUE061641T2 (hu) * | 2019-12-10 | 2023-07-28 | Heraeus Deutschland Gmbh & Co Kg | Forrasztópaszta |
CN112927837A (zh) * | 2021-03-04 | 2021-06-08 | 北京梦之墨科技有限公司 | 一种导电浆料及电子器件 |
Family Cites Families (26)
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US5853622A (en) * | 1990-02-09 | 1998-12-29 | Ormet Corporation | Transient liquid phase sintering conductive adhesives |
US5088189A (en) * | 1990-08-31 | 1992-02-18 | Federated Fry Metals | Electronic manufacturing process |
JP2606610B2 (ja) * | 1994-12-20 | 1997-05-07 | 日本電気株式会社 | ソルダーペースト、半導体装置の接続方法および接続構造 |
WO1996037336A1 (en) | 1995-05-24 | 1996-11-28 | Fry's Metals Inc. | Epoxy-based, voc-free soldering flux |
US6367150B1 (en) * | 1997-09-05 | 2002-04-09 | Northrop Grumman Corporation | Solder flux compatible with flip-chip underfill material |
JP3386009B2 (ja) * | 1998-07-01 | 2003-03-10 | 富士電機株式会社 | はんだ合金 |
JP2000216300A (ja) * | 1999-01-22 | 2000-08-04 | Fuji Electric Co Ltd | 樹脂封止形プリント回路板の製造方法 |
JP3791403B2 (ja) * | 2000-12-04 | 2006-06-28 | 富士電機ホールディングス株式会社 | 鉛フリーハンダ対応無洗浄用フラックスおよびこれを含有するハンダ組成物 |
JP2002178191A (ja) * | 2000-12-06 | 2002-06-25 | Hitachi Ltd | 低温系鉛フリーはんだ組成及びそれを用いた電子部品実装構造体 |
JP3888573B2 (ja) * | 2001-06-29 | 2007-03-07 | 富士電機ホールディングス株式会社 | ハンダ組成物 |
TWI228132B (en) * | 2001-09-26 | 2005-02-21 | Nof Corp | Soldering flux composition and solder paste |
US20030221748A1 (en) * | 2002-05-30 | 2003-12-04 | Fry's Metals, Inc. | Solder paste flux system |
JP3797990B2 (ja) * | 2003-08-08 | 2006-07-19 | 株式会社東芝 | 熱硬化性フラックス及びはんだペースト |
US8227536B2 (en) * | 2005-08-11 | 2012-07-24 | Senju Metal Industry Co., Ltd. | Lead-free solder paste and its use |
JP2008062253A (ja) * | 2006-09-05 | 2008-03-21 | Denso Corp | はんだ付け用フラックスおよびはんだペースト組成物 |
WO2010036953A2 (en) * | 2008-09-26 | 2010-04-01 | Fry's Metals, Inc. | Conductive compositions and methods of using them |
KR100977163B1 (ko) * | 2009-03-23 | 2010-08-20 | 덕산하이메탈(주) | 솔더 접착제와 그 제조 방법 및 이를 포함하는 전자 장치 |
JP4920058B2 (ja) * | 2009-06-03 | 2012-04-18 | 株式会社タムラ製作所 | はんだ接合剤組成物 |
JP5842084B2 (ja) | 2010-09-27 | 2016-01-13 | パナソニックIpマネジメント株式会社 | 半導体部品実装基板 |
TW201241144A (en) * | 2011-01-27 | 2012-10-16 | Hitachi Chemical Co Ltd | Conductive adhesive composition, connecting body and solar battery module and fabricating method thereof |
JP4897932B1 (ja) | 2011-05-25 | 2012-03-14 | ハリマ化成株式会社 | はんだペースト用フラックスおよびはんだペースト |
PL2739432T3 (pl) * | 2011-08-02 | 2022-04-11 | Alpha Assembly Solutions Inc. | Stop lutowniczy o wysokiej udarności |
JP5853146B2 (ja) | 2011-08-24 | 2016-02-09 | パナソニックIpマネジメント株式会社 | 熱硬化性樹脂組成物及び回路基板 |
JP5900602B2 (ja) * | 2012-02-24 | 2016-04-06 | 日立化成株式会社 | 半導体用接着剤、フラックス剤、半導体装置の製造方法及び半導体装置 |
WO2013191121A1 (ja) * | 2012-06-20 | 2013-12-27 | 富士電機株式会社 | はんだ付け用フラックス及びはんだ組成物 |
US9790367B2 (en) * | 2013-01-11 | 2017-10-17 | Sabic Global Technologies B.V. | Polycarbonate compositions for reduced splay in combination with sustained or improved impact resistance |
-
2014
- 2014-12-31 MX MX2016008650A patent/MX2016008650A/es unknown
- 2014-12-31 EP EP14877119.9A patent/EP3089844B1/en active Active
- 2014-12-31 MY MYPI2016001229A patent/MY194842A/en unknown
- 2014-12-31 JP JP2016544582A patent/JP2017508622A/ja active Pending
- 2014-12-31 CN CN201480071740.2A patent/CN106255569B/zh active Active
- 2014-12-31 US US15/109,352 patent/US9802275B2/en active Active
- 2014-12-31 WO PCT/US2014/072936 patent/WO2015103362A1/en active Application Filing
- 2014-12-31 TW TW103146694A patent/TWI701098B/zh active
Also Published As
Publication number | Publication date |
---|---|
US20160318134A1 (en) | 2016-11-03 |
US9802275B2 (en) | 2017-10-31 |
JP2017508622A (ja) | 2017-03-30 |
WO2015103362A1 (en) | 2015-07-09 |
EP3089844A4 (en) | 2017-10-04 |
CN106255569A (zh) | 2016-12-21 |
TW201538264A (zh) | 2015-10-16 |
EP3089844B1 (en) | 2020-02-05 |
EP3089844A1 (en) | 2016-11-09 |
MY194842A (en) | 2022-12-19 |
CN106255569B (zh) | 2019-11-05 |
TWI701098B (zh) | 2020-08-11 |
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