MX167928B - Metodo no fotografico para fabricar diseños en peliculas polimericas - Google Patents
Metodo no fotografico para fabricar diseños en peliculas polimericasInfo
- Publication number
- MX167928B MX167928B MX022928A MX2292890A MX167928B MX 167928 B MX167928 B MX 167928B MX 022928 A MX022928 A MX 022928A MX 2292890 A MX2292890 A MX 2292890A MX 167928 B MX167928 B MX 167928B
- Authority
- MX
- Mexico
- Prior art keywords
- layer
- polymeric films
- design
- diluent
- organic polymer
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000003085 diluting agent Substances 0.000 abstract 4
- 229920000620 organic polymer Polymers 0.000 abstract 3
- 239000007787 solid Substances 0.000 abstract 3
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 238000009792 diffusion process Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 238000005406 washing Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/12—Stencil printing; Silk-screen printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/062—Glass compositions containing silica with less than 40% silica by weight
- C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/102—Glass compositions containing silica with 40% to 90% silica, by weight containing lead
- C03C3/108—Glass compositions containing silica with 40% to 90% silica, by weight containing lead containing boron
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
- C03C8/10—Frit compositions, i.e. in a powdered or comminuted form containing lead
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
- H01L21/481—Insulating layers on insulating parts, with or without metallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0511—Diffusion patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Mathematical Physics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
La presente invención se refiere a un método no grafico para preparar diseños o modelos en películas poliméticas orgánicas, caracterizado porque comprende en secuencia las etapas de: a. aplicar a un sustrato una primera capa sin diseño, que consiste de un polímero orgánico sólido el cual es dispersable en un diluyente predeterminado; b. aplicar a la primera capa sin el diseño una segunda capa con el diseño, que consiste de un agente el cual es capaz de cambiar la dispersabilidad del polímero orgánico sólido en el diluyente predeterminado; c. efectuar la difusión del diseño del agente que cambia la dispersabilidad en la capa de polímero orgánico sólido subyacente; y d. eliminar las áreas de la primera capa subyacente, las cuales son dispersables en el diluyente, lavándolas con el diluyente predeterminado.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US42538789A | 1989-10-20 | 1989-10-20 | |
US07/573,075 US5032216A (en) | 1989-10-20 | 1990-08-29 | Non-photographic method for patterning organic polymer films |
Publications (1)
Publication Number | Publication Date |
---|---|
MX167928B true MX167928B (es) | 1993-04-22 |
Family
ID=27026664
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX022928A MX167928B (es) | 1989-10-20 | 1990-10-19 | Metodo no fotografico para fabricar diseños en peliculas polimericas |
Country Status (10)
Country | Link |
---|---|
US (1) | US5032216A (es) |
EP (1) | EP0497896B1 (es) |
JP (1) | JP2592548B2 (es) |
KR (1) | KR960010009B1 (es) |
CN (1) | CN1024980C (es) |
CA (1) | CA2069306A1 (es) |
DE (1) | DE69030261T2 (es) |
MX (1) | MX167928B (es) |
MY (1) | MY106618A (es) |
WO (1) | WO1991006118A1 (es) |
Families Citing this family (55)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5153194A (en) * | 1988-09-21 | 1992-10-06 | Yoshitomi Pharmaceutical Industries, Ltd. | Thienocycloheptapyridazine compounds and their pharmaceutical use |
US5209814A (en) * | 1991-09-30 | 1993-05-11 | E. I. Du Pont De Nemours And Company | Method for diffusion patterning |
US5275689A (en) * | 1991-11-14 | 1994-01-04 | E. I. Du Pont De Nemours And Company | Method and compositions for diffusion patterning |
US5654354A (en) * | 1991-11-14 | 1997-08-05 | E. I. Du Pont De Nemours And Company | Compositions for diffusion patterning |
JPH05205989A (ja) * | 1992-01-28 | 1993-08-13 | Hitachi Ltd | リソグラフィ法及び半導体装置の製造方法 |
US5260163A (en) * | 1992-05-07 | 1993-11-09 | E. I. Du Pont De Nemours And Company | Photoenhanced diffusion patterning for organic polymer films |
US5270078A (en) * | 1992-08-14 | 1993-12-14 | E. I. Du Pont De Nemours And Company | Method for preparing high resolution wash-off images |
US5635334A (en) * | 1992-08-21 | 1997-06-03 | E. I. Du Pont De Nemours And Company | Process for making plasma display apparatus with pixel ridges made of diffusion patterned dielectrics |
JPH06267439A (ja) * | 1992-08-21 | 1994-09-22 | Du Pont Kk | プラズマディスプレイ装置およびその製造方法 |
US5292556A (en) * | 1992-12-22 | 1994-03-08 | E. I. Du Pont De Nemours And Company | Method for preparing negative-working wash-off relief images |
DE69328418T2 (de) * | 1993-02-26 | 2001-01-04 | Du Pont | Verfahren zur Herstellung eines Plasma-Anzeigegeräts |
EP0613166B1 (en) * | 1993-02-26 | 2000-04-19 | E.I. Du Pont De Nemours And Company | Method of making plasma display apparatus |
US5512131A (en) * | 1993-10-04 | 1996-04-30 | President And Fellows Of Harvard College | Formation of microstamped patterns on surfaces and derivative articles |
US5776748A (en) * | 1993-10-04 | 1998-07-07 | President And Fellows Of Harvard College | Method of formation of microstamped patterns on plates for adhesion of cells and other biological materials, devices and uses therefor |
US6776094B1 (en) * | 1993-10-04 | 2004-08-17 | President & Fellows Of Harvard College | Kit For Microcontact Printing |
US6180239B1 (en) | 1993-10-04 | 2001-01-30 | President And Fellows Of Harvard College | Microcontact printing on surfaces and derivative articles |
US5900160A (en) * | 1993-10-04 | 1999-05-04 | President And Fellows Of Harvard College | Methods of etching articles via microcontact printing |
US5411628A (en) * | 1993-10-21 | 1995-05-02 | E. I. Du Pont De Nemours And Company | Diffusion patterning process and screen therefor |
US5466653A (en) * | 1994-06-29 | 1995-11-14 | E. I. Du Pont De Nemours And Company | Method for preparing negative-working wash-off relief images and non-photosensitive elements for use therein |
US6472148B1 (en) | 1994-09-26 | 2002-10-29 | President And Fellows Of Harvard College | Molecular recognition at surfaces derivatized with self-assembled monolayers |
US5620850A (en) * | 1994-09-26 | 1997-04-15 | President And Fellows Of Harvard College | Molecular recognition at surfaces derivatized with self-assembled monolayers |
EP0742585A1 (en) * | 1995-05-08 | 1996-11-13 | E.I. Du Pont De Nemours And Company | Method and compositions for diffusion patterning tape on substrate |
US20040137734A1 (en) * | 1995-11-15 | 2004-07-15 | Princeton University | Compositions and processes for nanoimprinting |
US7758794B2 (en) * | 2001-10-29 | 2010-07-20 | Princeton University | Method of making an article comprising nanoscale patterns with reduced edge roughness |
US6020047A (en) * | 1996-09-04 | 2000-02-01 | Kimberly-Clark Worldwide, Inc. | Polymer films having a printed self-assembling monolayer |
US7014992B1 (en) | 1996-11-05 | 2006-03-21 | Clinical Micro Sensors, Inc. | Conductive oligomers attached to electrodes and nucleoside analogs |
US6048623A (en) * | 1996-12-18 | 2000-04-11 | Kimberly-Clark Worldwide, Inc. | Method of contact printing on gold coated films |
KR100609365B1 (ko) * | 1997-03-25 | 2006-08-09 | 이 아이 듀폰 디 네모아 앤드 캄파니 | 디스플레이 패널용 필드 이미터 캐소드 배면판 구조물 |
US5888287A (en) * | 1997-04-10 | 1999-03-30 | Markem Corporation | Washable fabrics ink |
US7122615B1 (en) * | 1998-09-10 | 2006-10-17 | Rutgers, The State University Of New Jersey | Polyanhydrides with therapeutically useful degradation products |
US6022485A (en) | 1997-10-17 | 2000-02-08 | International Business Machines Corporation | Method for controlled removal of material from a solid surface |
US7087148B1 (en) | 1998-06-23 | 2006-08-08 | Clinical Micro Sensors, Inc. | Binding acceleration techniques for the detection of analytes |
US20020177135A1 (en) * | 1999-07-27 | 2002-11-28 | Doung Hau H. | Devices and methods for biochip multiplexing |
US20060208621A1 (en) * | 1999-09-21 | 2006-09-21 | Amey Daniel I Jr | Field emitter cathode backplate structures for display panels |
US20030104614A1 (en) * | 2000-02-11 | 2003-06-05 | Uhrich Kathryn E. | Micropatterning surfaces of polymeric substrates |
US6753143B2 (en) | 2000-05-01 | 2004-06-22 | Clinical Micro Sensors, Inc. | Target analyte detection using asymmetrical self-assembled monolayers |
US6315916B1 (en) | 2000-05-08 | 2001-11-13 | Pisces-Print Image Sciences, Inc. | Chemical imaging of a lithographic printing plate |
US20040154489A1 (en) * | 2000-05-08 | 2004-08-12 | Deutsch Albert S. | Chemical imaging of a lithographic printing plate |
US6691618B2 (en) | 2000-05-08 | 2004-02-17 | Pisces-Print Imaging Sciences, Inc. | Chemical imaging of a lithographic printing plate |
US6770721B1 (en) | 2000-11-02 | 2004-08-03 | Surface Logix, Inc. | Polymer gel contact masks and methods and molds for making same |
DE10100681B4 (de) * | 2001-01-09 | 2005-11-24 | Kuraray Specialities Europe Gmbh | Weichmacherhaltige Polyvinylbutyrale, Verfahren zu deren Herstellung sowie deren Verwendung, insbesondere zur Herstellung von Folien zum Einsatz in Verbundsicherheitsgläsern |
AU2003251992A1 (en) * | 2002-07-17 | 2004-02-02 | Rutgers, The State University | Therapeutic devices for patterned cell growth |
US20040025730A1 (en) * | 2002-08-06 | 2004-02-12 | Fromson Howard A. | Method for imaging a lithographic printing plate |
US20040202955A1 (en) * | 2003-02-13 | 2004-10-14 | Goodin Jonathan W. | Method for making printing plate by inkjet deposition of coalescing agent |
WO2008034019A2 (en) | 2006-09-13 | 2008-03-20 | Polymerix Corporation | Active agents and their oligomers and polymers |
US9615463B2 (en) * | 2006-09-22 | 2017-04-04 | Oscar Khaselev | Method for producing a high-aspect ratio conductive pattern on a substrate |
US8741317B2 (en) | 2010-08-19 | 2014-06-03 | Rutgers, The State University Of New Jersey | Slow-degrading polymers comprising salicylic acid for undelayed and sustained drug delivery |
US9144579B2 (en) | 2012-08-17 | 2015-09-29 | Rutgers, The State University Of New Jersey | Polyesters and methods of use thereof |
US20140120057A1 (en) | 2012-10-25 | 2014-05-01 | Rutgers, The State University Of New Jersey | Polymers and methods thereof for wound healing |
US9387250B2 (en) | 2013-03-15 | 2016-07-12 | Rutgers, The State University Of New Jersey | Therapeutic compositions for bone repair |
US9862672B2 (en) | 2013-05-29 | 2018-01-09 | Rutgers, The State University Of New Jersey | Antioxidant-based poly(anhydride-esters) |
WO2015191742A1 (en) | 2014-06-13 | 2015-12-17 | Rutgers, The State University Of New Jersey | Process and intermediates for preparing poly(anhydride-esters) |
US9396958B2 (en) | 2014-10-14 | 2016-07-19 | Tokyo Electron Limited | Self-aligned patterning using directed self-assembly of block copolymers |
JP6930918B6 (ja) | 2015-04-10 | 2021-12-15 | ラトガーズ, ザ ステイト ユニバーシティ オブ ニュー ジャージー | コウジ酸ポリマー |
CN113533598B (zh) * | 2021-07-30 | 2023-03-24 | 海南葫芦娃药业集团股份有限公司 | 一种小儿肺热咳喘颗粒中黄芩含量的高效液相色谱分析方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2253944C2 (de) * | 1972-11-03 | 1983-02-24 | Agfa-Gevaert Ag, 5090 Leverkusen | Verfahren zur Herstellung eines Reliefbildes |
JPS5915394B2 (ja) * | 1978-08-31 | 1984-04-09 | 富士通株式会社 | 厚膜微細パタ−ン生成方法 |
US4394211A (en) * | 1982-09-08 | 1983-07-19 | Fujitsu Limited | Method of manufacturing a semiconductor device having a layer of polymide resin |
GB8412606D0 (en) * | 1984-05-17 | 1984-06-20 | Murray J | Printed circuit boards |
IT1228144B (it) * | 1985-05-22 | 1991-05-28 | Face Standard Ind | Procedimento per la fabbricazione di circuiti a microonde in banda j con struttura a microstrisce in film spesso e relativo prodotto |
US4751170A (en) * | 1985-07-26 | 1988-06-14 | Nippon Telegraph And Telephone Corporation | Silylation method onto surface of polymer membrane and pattern formation process by the utilization of silylation method |
US4808511A (en) * | 1987-05-19 | 1989-02-28 | International Business Machines Corporation | Vapor phase photoresist silylation process |
US4968552A (en) * | 1989-10-13 | 1990-11-06 | International Business Machines Corp. | Versatile reactive ion etch barriers from polyamic acid salts |
-
1990
- 1990-08-29 US US07/573,075 patent/US5032216A/en not_active Expired - Lifetime
- 1990-10-11 JP JP2515844A patent/JP2592548B2/ja not_active Expired - Fee Related
- 1990-10-11 DE DE69030261T patent/DE69030261T2/de not_active Expired - Fee Related
- 1990-10-11 EP EP90917075A patent/EP0497896B1/en not_active Expired - Lifetime
- 1990-10-11 CA CA002069306A patent/CA2069306A1/en not_active Abandoned
- 1990-10-11 WO PCT/US1990/005664 patent/WO1991006118A1/en active IP Right Grant
- 1990-10-11 KR KR1019920700903A patent/KR960010009B1/ko not_active IP Right Cessation
- 1990-10-19 MX MX022928A patent/MX167928B/es unknown
- 1990-10-19 MY MYPI90001831A patent/MY106618A/en unknown
- 1990-10-20 CN CN90109505A patent/CN1024980C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0497896A1 (en) | 1992-08-12 |
CN1024980C (zh) | 1994-06-08 |
MY106618A (en) | 1995-06-30 |
DE69030261T2 (de) | 1997-08-07 |
CA2069306A1 (en) | 1991-04-21 |
EP0497896B1 (en) | 1997-03-19 |
WO1991006118A1 (en) | 1991-05-02 |
US5032216A (en) | 1991-07-16 |
KR960010009B1 (ko) | 1996-07-25 |
KR920702547A (ko) | 1992-09-04 |
JPH05502140A (ja) | 1993-04-15 |
JP2592548B2 (ja) | 1997-03-19 |
DE69030261D1 (de) | 1997-04-24 |
CN1053769A (zh) | 1991-08-14 |
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