MX167928B - Metodo no fotografico para fabricar diseños en peliculas polimericas - Google Patents

Metodo no fotografico para fabricar diseños en peliculas polimericas

Info

Publication number
MX167928B
MX167928B MX022928A MX2292890A MX167928B MX 167928 B MX167928 B MX 167928B MX 022928 A MX022928 A MX 022928A MX 2292890 A MX2292890 A MX 2292890A MX 167928 B MX167928 B MX 167928B
Authority
MX
Mexico
Prior art keywords
layer
polymeric films
design
diluent
organic polymer
Prior art date
Application number
MX022928A
Other languages
English (en)
Inventor
John James Felten
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of MX167928B publication Critical patent/MX167928B/es

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00Inking and printing with a printer's forme
    • B41M1/12Stencil printing; Silk-screen printing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00Printing processes to produce particular kinds of printed work, e.g. patterns
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00Manufacture or treatment of nanostructures
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00Glass compositions
    • C03C3/04Glass compositions containing silica
    • C03C3/062Glass compositions containing silica with less than 40% silica by weight
    • C03C3/064Glass compositions containing silica with less than 40% silica by weight containing boron
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00Glass compositions
    • C03C3/04Glass compositions containing silica
    • C03C3/076Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/102Glass compositions containing silica with 40% to 90% silica, by weight containing lead
    • C03C3/108Glass compositions containing silica with 40% to 90% silica, by weight containing lead containing boron
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02Frit compositions, i.e. in a powdered or comminuted form
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/10Frit compositions, i.e. in a powdered or comminuted form containing lead
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4803Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • H01L21/481Insulating layers on insulating parts, with or without metallisation
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0017Etching of the substrate by chemical or physical means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05Patterning and lithography; Masks; Details of resist
    • H05K2203/0502Patterning and lithography
    • H05K2203/0511Diffusion patterning
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4644Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

La presente invención se refiere a un método no grafico para preparar diseños o modelos en películas poliméticas orgánicas, caracterizado porque comprende en secuencia las etapas de: a. aplicar a un sustrato una primera capa sin diseño, que consiste de un polímero orgánico sólido el cual es dispersable en un diluyente predeterminado; b. aplicar a la primera capa sin el diseño una segunda capa con el diseño, que consiste de un agente el cual es capaz de cambiar la dispersabilidad del polímero orgánico sólido en el diluyente predeterminado; c. efectuar la difusión del diseño del agente que cambia la dispersabilidad en la capa de polímero orgánico sólido subyacente; y d. eliminar las áreas de la primera capa subyacente, las cuales son dispersables en el diluyente, lavándolas con el diluyente predeterminado.
MX022928A 1989-10-20 1990-10-19 Metodo no fotografico para fabricar diseños en peliculas polimericas MX167928B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US42538789A 1989-10-20 1989-10-20
US07/573,075 US5032216A (en) 1989-10-20 1990-08-29 Non-photographic method for patterning organic polymer films

Publications (1)

Publication Number Publication Date
MX167928B true MX167928B (es) 1993-04-22

Family

ID=27026664

Family Applications (1)

Application Number Title Priority Date Filing Date
MX022928A MX167928B (es) 1989-10-20 1990-10-19 Metodo no fotografico para fabricar diseños en peliculas polimericas

Country Status (10)

Country Link
US (1) US5032216A (es)
EP (1) EP0497896B1 (es)
JP (1) JP2592548B2 (es)
KR (1) KR960010009B1 (es)
CN (1) CN1024980C (es)
CA (1) CA2069306A1 (es)
DE (1) DE69030261T2 (es)
MX (1) MX167928B (es)
MY (1) MY106618A (es)
WO (1) WO1991006118A1 (es)

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US5153194A (en) * 1988-09-21 1992-10-06 Yoshitomi Pharmaceutical Industries, Ltd. Thienocycloheptapyridazine compounds and their pharmaceutical use
US5209814A (en) * 1991-09-30 1993-05-11 E. I. Du Pont De Nemours And Company Method for diffusion patterning
US5275689A (en) * 1991-11-14 1994-01-04 E. I. Du Pont De Nemours And Company Method and compositions for diffusion patterning
US5654354A (en) * 1991-11-14 1997-08-05 E. I. Du Pont De Nemours And Company Compositions for diffusion patterning
JPH05205989A (ja) * 1992-01-28 1993-08-13 Hitachi Ltd リソグラフィ法及び半導体装置の製造方法
US5260163A (en) * 1992-05-07 1993-11-09 E. I. Du Pont De Nemours And Company Photoenhanced diffusion patterning for organic polymer films
US5270078A (en) * 1992-08-14 1993-12-14 E. I. Du Pont De Nemours And Company Method for preparing high resolution wash-off images
US5635334A (en) * 1992-08-21 1997-06-03 E. I. Du Pont De Nemours And Company Process for making plasma display apparatus with pixel ridges made of diffusion patterned dielectrics
JPH06267439A (ja) * 1992-08-21 1994-09-22 Du Pont Kk プラズマディスプレイ装置およびその製造方法
US5292556A (en) * 1992-12-22 1994-03-08 E. I. Du Pont De Nemours And Company Method for preparing negative-working wash-off relief images
DE69328418T2 (de) * 1993-02-26 2001-01-04 Du Pont Verfahren zur Herstellung eines Plasma-Anzeigegeräts
EP0613166B1 (en) * 1993-02-26 2000-04-19 E.I. Du Pont De Nemours And Company Method of making plasma display apparatus
US5512131A (en) * 1993-10-04 1996-04-30 President And Fellows Of Harvard College Formation of microstamped patterns on surfaces and derivative articles
US5776748A (en) * 1993-10-04 1998-07-07 President And Fellows Of Harvard College Method of formation of microstamped patterns on plates for adhesion of cells and other biological materials, devices and uses therefor
US6776094B1 (en) * 1993-10-04 2004-08-17 President & Fellows Of Harvard College Kit For Microcontact Printing
US6180239B1 (en) 1993-10-04 2001-01-30 President And Fellows Of Harvard College Microcontact printing on surfaces and derivative articles
US5900160A (en) * 1993-10-04 1999-05-04 President And Fellows Of Harvard College Methods of etching articles via microcontact printing
US5411628A (en) * 1993-10-21 1995-05-02 E. I. Du Pont De Nemours And Company Diffusion patterning process and screen therefor
US5466653A (en) * 1994-06-29 1995-11-14 E. I. Du Pont De Nemours And Company Method for preparing negative-working wash-off relief images and non-photosensitive elements for use therein
US6472148B1 (en) 1994-09-26 2002-10-29 President And Fellows Of Harvard College Molecular recognition at surfaces derivatized with self-assembled monolayers
US5620850A (en) * 1994-09-26 1997-04-15 President And Fellows Of Harvard College Molecular recognition at surfaces derivatized with self-assembled monolayers
EP0742585A1 (en) * 1995-05-08 1996-11-13 E.I. Du Pont De Nemours And Company Method and compositions for diffusion patterning tape on substrate
US20040137734A1 (en) * 1995-11-15 2004-07-15 Princeton University Compositions and processes for nanoimprinting
US7758794B2 (en) * 2001-10-29 2010-07-20 Princeton University Method of making an article comprising nanoscale patterns with reduced edge roughness
US6020047A (en) * 1996-09-04 2000-02-01 Kimberly-Clark Worldwide, Inc. Polymer films having a printed self-assembling monolayer
US7014992B1 (en) 1996-11-05 2006-03-21 Clinical Micro Sensors, Inc. Conductive oligomers attached to electrodes and nucleoside analogs
US6048623A (en) * 1996-12-18 2000-04-11 Kimberly-Clark Worldwide, Inc. Method of contact printing on gold coated films
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Also Published As

Publication number Publication date
EP0497896A1 (en) 1992-08-12
CN1024980C (zh) 1994-06-08
MY106618A (en) 1995-06-30
DE69030261T2 (de) 1997-08-07
CA2069306A1 (en) 1991-04-21
EP0497896B1 (en) 1997-03-19
WO1991006118A1 (en) 1991-05-02
US5032216A (en) 1991-07-16
KR960010009B1 (ko) 1996-07-25
KR920702547A (ko) 1992-09-04
JPH05502140A (ja) 1993-04-15
JP2592548B2 (ja) 1997-03-19
DE69030261D1 (de) 1997-04-24
CN1053769A (zh) 1991-08-14

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