LT2569802T - Fotogalvaninių elementų silicio plokštelių paviršiaus tekstūros keitimo reguliavimo būdas - Google Patents

Fotogalvaninių elementų silicio plokštelių paviršiaus tekstūros keitimo reguliavimo būdas

Info

Publication number
LT2569802T
LT2569802T LTEP11724988.8T LT11724988T LT2569802T LT 2569802 T LT2569802 T LT 2569802T LT 11724988 T LT11724988 T LT 11724988T LT 2569802 T LT2569802 T LT 2569802T
Authority
LT
Lithuania
Prior art keywords
photovoltaic cell
control surface
surface texture
silicon wafers
cell devices
Prior art date
Application number
LTEP11724988.8T
Other languages
English (en)
Inventor
Edward Duffy
Laurent Clochard
Original Assignee
Ultra High Vacuum Solutions Ltd. T/A Nines Engineering
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB201021693A external-priority patent/GB2486883A/en
Application filed by Ultra High Vacuum Solutions Ltd. T/A Nines Engineering filed Critical Ultra High Vacuum Solutions Ltd. T/A Nines Engineering
Publication of LT2569802T publication Critical patent/LT2569802T/lt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0236—Special surface textures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0236—Special surface textures
    • H01L31/02363—Special surface textures of the semiconductor body itself, e.g. textured active layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic System
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/547—Monocrystalline silicon PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
LTEP11724988.8T 2010-05-11 2011-05-11 Fotogalvaninių elementų silicio plokštelių paviršiaus tekstūros keitimo reguliavimo būdas LT2569802T (lt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
IES20100287 2010-05-11
GB201021693A GB2486883A (en) 2010-12-22 2010-12-22 Method and apparatus for surface texture modification of silicon wafers for photovoltaic cell devices
PCT/EP2011/057633 WO2011141516A2 (en) 2010-05-11 2011-05-11 Method and apparatus to control surface texture modification of silicon wafers for photovoltaic cell devices

Publications (1)

Publication Number Publication Date
LT2569802T true LT2569802T (lt) 2017-12-27

Family

ID=44626974

Family Applications (1)

Application Number Title Priority Date Filing Date
LTEP11724988.8T LT2569802T (lt) 2010-05-11 2011-05-11 Fotogalvaninių elementų silicio plokštelių paviršiaus tekstūros keitimo reguliavimo būdas

Country Status (7)

Country Link
US (1) US9548224B2 (lt)
EP (1) EP2569802B1 (lt)
JP (1) JP6012597B2 (lt)
ES (1) ES2643645T3 (lt)
LT (1) LT2569802T (lt)
PL (1) PL2569802T3 (lt)
WO (1) WO2011141516A2 (lt)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014053484A1 (en) 2012-10-01 2014-04-10 Ultra High Vacuum Solutions Ltd. T/A Nines Engineering Combined etch and passivation of silicon solar cells
TW201500306A (zh) * 2013-05-22 2015-01-01 Corning Inc 利用玻璃載體處理可撓性薄片玻璃基板之方法
WO2015029019A2 (en) 2013-08-27 2015-03-05 Technion Research & Development Foundation Limited. System and method for pad printing
US20160351733A1 (en) * 2015-06-01 2016-12-01 International Business Machines Corporation Dry etch method for texturing silicon and device
EP3104418B8 (de) 2015-06-08 2018-04-04 Meyer Burger (Germany) GmbH Verfahren und vorrichtung zum texturieren einer siliziumoberfläche
DE102017217713B4 (de) 2017-10-05 2022-12-01 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung elektrischer Kontakte auf einer Solarzelle und Solarzelle
DE102017219312A1 (de) * 2017-10-27 2019-05-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. 2-stufiger Trockenätzprozess zur Texturierung kristalliner Siliziumscheiben
MX2022005395A (es) * 2019-11-08 2022-05-24 Massachusetts Inst Technology Proceso de micro-mecanizado de expulsion y cambio de fase de material asistido por laser.
CN112928182B (zh) * 2021-01-22 2022-05-31 徐州中辉光伏科技有限公司 一种散热性能好的太阳能光伏刻蚀装置

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08327959A (ja) 1994-06-30 1996-12-13 Seiko Epson Corp ウエハ及び基板の処理装置及び処理方法、ウエハ及び基板の移載装置
US4803947A (en) 1986-01-15 1989-02-14 Canon Kabushiki Kaisha Apparatus for forming deposited film
US4834020A (en) * 1987-12-04 1989-05-30 Watkins-Johnson Company Atmospheric pressure chemical vapor deposition apparatus
US5122391A (en) * 1991-03-13 1992-06-16 Watkins-Johnson Company Method for producing highly conductive and transparent films of tin and fluorine doped indium oxide by APCVD
JPH06168922A (ja) * 1992-06-25 1994-06-14 Texas Instr Inc <Ti> シリコンの気相エッチング法
JP2833946B2 (ja) * 1992-12-08 1998-12-09 日本電気株式会社 エッチング方法および装置
JPH0845833A (ja) * 1994-08-02 1996-02-16 Japan Storage Battery Co Ltd アッシング装置
US6500356B2 (en) 2000-03-27 2002-12-31 Applied Materials, Inc. Selectively etching silicon using fluorine without plasma
JP2003100717A (ja) * 2001-09-21 2003-04-04 Tokyo Electron Ltd プラズマ処理装置
JP2003142298A (ja) 2001-11-07 2003-05-16 Sekisui Chem Co Ltd グロー放電プラズマ処理装置
AU2002366920A1 (en) * 2001-12-13 2003-07-09 Showa Denko K.K. Cleaning gas composition for semiconductor production equipment and cleaning method using the gas
JP4467218B2 (ja) * 2001-12-25 2010-05-26 京セラ株式会社 太陽電池用基板の粗面化法
JP2003209096A (ja) * 2002-01-16 2003-07-25 Sekisui Chem Co Ltd プラズマエッチング処理方法及びその装置
US6730600B2 (en) 2002-09-27 2004-05-04 Agere Systems, Inc. Method of dry etching a semiconductor device in the absence of a plasma
JP2004296729A (ja) * 2003-03-26 2004-10-21 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法
KR100529632B1 (ko) 2003-10-01 2005-11-17 동부아남반도체 주식회사 반도체 소자 및 그 제조 방법
JP5719493B2 (ja) * 2003-12-09 2015-05-20 ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア 表面粗化による高効率の（Ｂ，Ａｌ，Ｇａ，Ｉｎ）Ｎベースの発光ダイオード
JP4348176B2 (ja) * 2003-12-25 2009-10-21 積水化学工業株式会社 ドライエッチング処理装置および処理方法
DE102004062355A1 (de) * 2004-12-23 2006-07-06 Siltronic Ag Verfahren zum Behandeln einer Halbleiterscheibe mit einem gasförmigen Medium sowie damit behandelte Halbleiterscheibe
US7235492B2 (en) * 2005-01-31 2007-06-26 Applied Materials, Inc. Low temperature etchant for treatment of silicon-containing surfaces
DE102005040596B4 (de) 2005-06-17 2009-02-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Entfernung einer dotierten Oberflächenschicht an Rückseiten von kristallinen Silizium-Solarwafern
US20080000497A1 (en) 2006-06-30 2008-01-03 Applied Materials, Inc. Removal of organic-containing layers from large surface areas
DE102006042329B4 (de) 2006-09-01 2008-08-21 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum selektiven plasmachemischen Trockenätzen von auf Oberflächen von Silicium-Wafern ausgebildetem Phosphorsilikatglas
US20080142046A1 (en) 2006-12-13 2008-06-19 Andrew David Johnson Thermal F2 etch process for cleaning CVD chambers
WO2008100603A1 (en) * 2007-02-15 2008-08-21 Massachusetts Institute Of Technology Solar cells with textured surfaces
WO2008102807A1 (ja) 2007-02-23 2008-08-28 Sekisui Chemical Co., Ltd. エッチング方法及び装置並びに被処理物
JP2009099880A (ja) * 2007-10-19 2009-05-07 Sekisui Chem Co Ltd プラズマエッチング装置

Also Published As

Publication number Publication date
US20130069204A1 (en) 2013-03-21
US9548224B2 (en) 2017-01-17
EP2569802B1 (en) 2017-07-12
JP2013527611A (ja) 2013-06-27
ES2643645T3 (es) 2017-11-23
WO2011141516A2 (en) 2011-11-17
EP2569802A2 (en) 2013-03-20
WO2011141516A3 (en) 2012-01-26
PL2569802T3 (pl) 2018-01-31
JP6012597B2 (ja) 2016-10-25

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