MX2022005395A - Proceso de micro-mecanizado de expulsion y cambio de fase de material asistido por laser. - Google Patents
Proceso de micro-mecanizado de expulsion y cambio de fase de material asistido por laser.Info
- Publication number
- MX2022005395A MX2022005395A MX2022005395A MX2022005395A MX2022005395A MX 2022005395 A MX2022005395 A MX 2022005395A MX 2022005395 A MX2022005395 A MX 2022005395A MX 2022005395 A MX2022005395 A MX 2022005395A MX 2022005395 A MX2022005395 A MX 2022005395A
- Authority
- MX
- Mexico
- Prior art keywords
- micro
- laser
- mall
- machining process
- cutting surface
- Prior art date
Links
- 239000000463 material Substances 0.000 title abstract 5
- 238000000034 method Methods 0.000 title abstract 5
- 238000005459 micromachining Methods 0.000 title abstract 4
- 238000005520 cutting process Methods 0.000 abstract 4
- 238000004519 manufacturing process Methods 0.000 abstract 2
- 238000005498 polishing Methods 0.000 abstract 2
- 241000805973 Multilamina Species 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 1
- 239000002253 acid Substances 0.000 abstract 1
- 230000010354 integration Effects 0.000 abstract 1
- 239000011344 liquid material Substances 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 229910052814 silicon oxide Inorganic materials 0.000 abstract 1
- 230000008016 vaporization Effects 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/354—Working by laser beam, e.g. welding, cutting or boring for surface treatment by melting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
- B81C1/00523—Etching material
- B81C1/00547—Etching processes not provided for in groups B81C1/00531 - B81C1/00539
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
- B81C1/00555—Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity
- B81C1/00611—Processes for the planarisation of structures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00865—Multistep processes for the separation of wafers into individual elements
- B81C1/00904—Multistep processes for the separation of wafers into individual elements not provided for in groups B81C1/00873 - B81C1/00896
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
- B81C2201/0118—Processes for the planarization of structures
- B81C2201/0125—Blanket removal, e.g. polishing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
- B81C2201/0128—Processes for removing material
- B81C2201/0143—Focussed beam, i.e. laser, ion or e-beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/03—Bonding two components
- B81C2203/032—Gluing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/05—Aligning components to be assembled
- B81C2203/052—Passive alignment, i.e. using only structural arrangements or thermodynamic forces without an internal or external apparatus
- B81C2203/054—Passive alignment, i.e. using only structural arrangements or thermodynamic forces without an internal or external apparatus using structural alignment aids, e.g. spacers, interposers, male/female parts, rods or balls
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Geometry (AREA)
- Micromachines (AREA)
- Laser Beam Processing (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Abstract
Un proceso de micromecanizado con láser llamado micromecanizado de expulsión y cambio de fase de material asistido por láser (LAMPE, por sus siglas en inglés) que incluye características de corte en una superficie de corte de una pieza de material utilizando un láser impulsado con intensidad, ancho de impulso y tasa de impulso establecida para fundir y expulsar material líquido sin vaporizar el material, o, en el caso de silicio, crear un óxido de silicio eyectable. Las rebabas se remueven de la superficie de corte por electropulido de la superficie de corte con una solución de ácido diluido utilizando un potencial eléctrico más alto que un potencial eléctrico de electropulido normal. Un montaje de múltiples láminas de laminados micromecanizados con láser (MALL, por sus siglas en inglés) puede utilizar MEMS. En el proceso de MALL, en primer lugar, las capas individuales de un sistema microelectromecánico (MEMS, por sus siglas en inglés) se fabrican utilizando el proceso de micromecanizado de LAMPE. A continuación, los laminados de microestructura fabricados se ensamblan en pila y se unen para fabricar sistemas MEM. El proceso de fabricación de MEMS de MALL permite mayor integración y sección de materiales, mayor flexibilidad de diseño, fabricación de bajo costo, desarrollo rápido, y empaquetado integrado.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201962932914P | 2019-11-08 | 2019-11-08 | |
PCT/US2020/059587 WO2021092527A1 (en) | 2019-11-08 | 2020-11-08 | Laser-assisted material phase-change and expulsion micro-machining process |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2022005395A true MX2022005395A (es) | 2022-05-24 |
Family
ID=75847294
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2022005395A MX2022005395A (es) | 2019-11-08 | 2020-11-08 | Proceso de micro-mecanizado de expulsion y cambio de fase de material asistido por laser. |
Country Status (11)
Country | Link |
---|---|
US (1) | US20210139321A1 (es) |
EP (1) | EP4025375A4 (es) |
JP (1) | JP7279263B2 (es) |
KR (1) | KR20220090517A (es) |
CN (2) | CN114728370B (es) |
AU (1) | AU2020378152B2 (es) |
BR (1) | BR112022007843A2 (es) |
CA (1) | CA3158185A1 (es) |
MX (1) | MX2022005395A (es) |
NZ (1) | NZ786842A (es) |
WO (1) | WO2021092527A1 (es) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3118488B1 (fr) * | 2020-12-24 | 2024-04-12 | Commissariat Energie Atomique | Dispositif de détection photoacoustique comportant une membrane de protection |
CN115480598B (zh) * | 2022-08-15 | 2023-09-29 | 北京空间机电研究所 | 一种离子束加工过程中光学镜面温度控制方法及测控系统 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4642160A (en) * | 1985-08-12 | 1987-02-10 | Interconnect Technology Inc. | Multilayer circuit board manufacturing |
JPH0332486A (ja) * | 1989-06-29 | 1991-02-13 | Jujo Paper Co Ltd | 光加工方法 |
US5330441A (en) | 1993-04-30 | 1994-07-19 | American Cyanamid Company | Surgical suturing needle and method for making same |
JPH10261862A (ja) * | 1997-03-17 | 1998-09-29 | Matsushita Electric Works Ltd | 回路板の製造方法 |
JP2001020100A (ja) | 1999-07-08 | 2001-01-23 | Hitachi Electronics Eng Co Ltd | 磁気記録媒体用ディスクの電解加工装置及び加工方法 |
US20020074520A1 (en) * | 2000-12-15 | 2002-06-20 | Xerox Corporation | Substantially seamless electrostatographic member fabrication apparatus |
US6949449B2 (en) * | 2003-07-11 | 2005-09-27 | Electro Scientific Industries, Inc. | Method of forming a scribe line on a ceramic substrate |
US20080108122A1 (en) * | 2006-09-01 | 2008-05-08 | State of Oregon acting by and through the State Board of Higher Education on behalf of Oregon | Microchemical nanofactories |
EP2328712B1 (de) * | 2008-09-17 | 2017-02-22 | TRUMPF Laser GmbH | Verfahren zum schneidgaslosen laserschmelzschneiden |
US20100078418A1 (en) * | 2008-09-26 | 2010-04-01 | Electro Scientific Industries, Inc. | Method of laser micro-machining stainless steel with high cosmetic quality |
WO2011141516A2 (en) * | 2010-05-11 | 2011-11-17 | Ultra High Vaccum Solutions Ltd. T/A Nines Engineering | Method and apparatus to control surface texture modification of silicon wafers for photovoltaic cell devices |
EP2599576B1 (en) * | 2010-07-26 | 2019-12-11 | Hamamatsu Photonics K.K. | Laser processing method |
JP2014130962A (ja) * | 2012-12-28 | 2014-07-10 | Ibiden Co Ltd | キャビティの形成方法、キャビティの形成装置、プログラム、配線板の製造方法、及び配線板 |
US9517963B2 (en) * | 2013-12-17 | 2016-12-13 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
US9701563B2 (en) * | 2013-12-17 | 2017-07-11 | Corning Incorporated | Laser cut composite glass article and method of cutting |
CN106498484A (zh) * | 2016-10-25 | 2017-03-15 | 河北工业大学 | 一种复杂黄铜的电解抛光方法 |
-
2020
- 2020-11-08 AU AU2020378152A patent/AU2020378152B2/en active Active
- 2020-11-08 CA CA3158185A patent/CA3158185A1/en active Pending
- 2020-11-08 EP EP20884709.5A patent/EP4025375A4/en active Pending
- 2020-11-08 NZ NZ786842A patent/NZ786842A/en unknown
- 2020-11-08 US US17/092,284 patent/US20210139321A1/en active Pending
- 2020-11-08 MX MX2022005395A patent/MX2022005395A/es unknown
- 2020-11-08 WO PCT/US2020/059587 patent/WO2021092527A1/en unknown
- 2020-11-08 JP JP2022526693A patent/JP7279263B2/ja active Active
- 2020-11-08 BR BR112022007843A patent/BR112022007843A2/pt unknown
- 2020-11-08 CN CN202080077072.XA patent/CN114728370B/zh active Active
- 2020-11-08 KR KR1020227014448A patent/KR20220090517A/ko not_active Application Discontinuation
- 2020-11-08 CN CN202310294754.1A patent/CN116352252A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
JP2022547342A (ja) | 2022-11-11 |
CN116352252A (zh) | 2023-06-30 |
AU2020378152B2 (en) | 2022-07-21 |
CN114728370A (zh) | 2022-07-08 |
WO2021092527A1 (en) | 2021-05-14 |
CN114728370B (zh) | 2023-04-07 |
JP7279263B2 (ja) | 2023-05-22 |
EP4025375A4 (en) | 2024-02-28 |
EP4025375A1 (en) | 2022-07-13 |
CA3158185A1 (en) | 2021-05-14 |
NZ786842A (en) | 2023-07-28 |
KR20220090517A (ko) | 2022-06-29 |
BR112022007843A2 (pt) | 2022-07-05 |
AU2020378152A1 (en) | 2022-04-21 |
US20210139321A1 (en) | 2021-05-13 |
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