LT2000074A - Elektrai laidžių dangų ant dielektriko paviršiaus gavimo būdas - Google Patents

Elektrai laidžių dangų ant dielektriko paviršiaus gavimo būdas Download PDF

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Publication number
LT2000074A
LT2000074A LT2000074A LT2000074A LT2000074A LT 2000074 A LT2000074 A LT 2000074A LT 2000074 A LT2000074 A LT 2000074A LT 2000074 A LT2000074 A LT 2000074A LT 2000074 A LT2000074 A LT 2000074A
Authority
LT
Lithuania
Prior art keywords
washed
water
solution
treated
solution containing
Prior art date
Application number
LT2000074A
Other languages
English (en)
Lithuanian (lt)
Inventor
Mykolas Baranauskas
Original Assignee
Mykolas Baranauskas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mykolas Baranauskas filed Critical Mykolas Baranauskas
Priority to LT2000074A priority Critical patent/LT2000074A/lt
Priority to EP20010306212 priority patent/EP1174530B1/fr
Priority to ES01306212T priority patent/ES2305035T3/es
Priority to DE2001633795 priority patent/DE60133795T2/de
Priority to JP2001220307A priority patent/JP4789361B2/ja
Priority to KR1020010043731A priority patent/KR100816667B1/ko
Priority to US09/910,448 priority patent/US6610365B2/en
Priority to TW90117772A priority patent/TW575667B/zh
Publication of LT2000074A publication Critical patent/LT2000074A/lt
Priority to US10/403,772 priority patent/US6887561B2/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9335—Product by special process
    • Y10S428/934—Electrical process
    • Y10S428/935—Electroplating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y10T428/12569—Synthetic resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12625—Free carbon containing component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12674—Ge- or Si-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
LT2000074A 2000-07-20 2000-07-20 Elektrai laidžių dangų ant dielektriko paviršiaus gavimo būdas LT2000074A (lt)

Priority Applications (9)

Application Number Priority Date Filing Date Title
LT2000074A LT2000074A (lt) 2000-07-20 2000-07-20 Elektrai laidžių dangų ant dielektriko paviršiaus gavimo būdas
EP20010306212 EP1174530B1 (fr) 2000-07-20 2001-07-19 Procédé de fabrication de couches conductrices sur des surfaces diélectriques
ES01306212T ES2305035T3 (es) 2000-07-20 2001-07-19 Procedimiento de produccion de capas conductoras sobre superficies dielectricas.
DE2001633795 DE60133795T2 (de) 2000-07-20 2001-07-19 Verfahren zum Herstellen von leitenden Schichten auf dielektrischen Oberflächen
JP2001220307A JP4789361B2 (ja) 2000-07-20 2001-07-19 誘電体表面上に導電層を製造する方法
KR1020010043731A KR100816667B1 (ko) 2000-07-20 2001-07-20 유전체 표면에 전도체 층을 형성시키는 방법
US09/910,448 US6610365B2 (en) 2000-07-20 2001-07-20 Methods of producing conductor layers on dielectric surfaces
TW90117772A TW575667B (en) 2000-07-20 2001-07-20 Methods of producing conductor layers on dielectric surfaces and articles of manufacture thereof
US10/403,772 US6887561B2 (en) 2000-07-20 2003-03-31 Methods and producing conductor layers on dielectric surfaces

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
LT2000074A LT2000074A (lt) 2000-07-20 2000-07-20 Elektrai laidžių dangų ant dielektriko paviršiaus gavimo būdas

Publications (1)

Publication Number Publication Date
LT2000074A true LT2000074A (lt) 2002-01-25

Family

ID=19721484

Family Applications (1)

Application Number Title Priority Date Filing Date
LT2000074A LT2000074A (lt) 2000-07-20 2000-07-20 Elektrai laidžių dangų ant dielektriko paviršiaus gavimo būdas

Country Status (8)

Country Link
US (2) US6610365B2 (fr)
EP (1) EP1174530B1 (fr)
JP (1) JP4789361B2 (fr)
KR (1) KR100816667B1 (fr)
DE (1) DE60133795T2 (fr)
ES (1) ES2305035T3 (fr)
LT (1) LT2000074A (fr)
TW (1) TW575667B (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004026489B3 (de) * 2004-05-27 2005-09-29 Enthone Inc., West Haven Verfahren zur Metallisierung von Kunststoffoberflächen
JP2007239003A (ja) * 2006-03-07 2007-09-20 Univ Nagoya Ａｕメッキ方法及びＡｕメッキによるＡｕ回路の製造方法
WO2007116493A1 (fr) 2006-03-31 2007-10-18 Ebara-Udylite Co., Ltd. Liquide de modification de surface pour plastique et procédé de métallisation de surface en plastique au moyen de ce liquide
DE102014216974A1 (de) 2014-08-26 2016-03-03 Mahle International Gmbh Thermoelektrisches Modul
CN106048564A (zh) * 2016-07-27 2016-10-26 华南理工大学 一种在abs塑料表面无钯活化的金属化方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3620834A (en) * 1968-07-18 1971-11-16 Hooker Chemical Corp Metal plating of substrates
CA1120420A (fr) * 1976-10-26 1982-03-23 Daniel Luch Procede ameliorant l'adherence et la stabilite d'un depot electrolytique sur un substrat en plastique conducteur
SU980858A1 (ru) 1981-07-23 1982-12-15 Вильнюсский государственный университет им.В.Капсукаса Способ получени электропроводных покрытий
GB8511905D0 (en) * 1985-05-10 1985-06-19 Akzo Nv Metallizing polymeric materials
JPH0661891B2 (ja) * 1989-05-29 1994-08-17 大阪市 導電性ポリイミド成形物の製造法
US4919768A (en) * 1989-09-22 1990-04-24 Shipley Company Inc. Electroplating process
SU1762425A1 (ru) 1991-01-22 1992-09-15 Институт Химии И Химической Технологии Литовской Ан Способ получени электропровод щего покрыти сульфида меди на диэлектрической подложке
US5376248A (en) * 1991-10-15 1994-12-27 Enthone-Omi, Inc. Direct metallization process
US5698087A (en) * 1992-03-11 1997-12-16 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead
JPH06275758A (ja) * 1993-03-19 1994-09-30 Chichibu Fuji:Kk 半導体装置の製造方法
JP3274232B2 (ja) * 1993-06-01 2002-04-15 ディップソール株式会社 錫−ビスマス合金めっき浴及びそれを使用するめっき方法
US5484518A (en) * 1994-03-04 1996-01-16 Shipley Company Inc. Electroplating process
JPH07258861A (ja) * 1994-03-22 1995-10-09 Murata Mfg Co Ltd 無電解ビスマスめっき浴
JP3475260B2 (ja) * 1994-12-07 2003-12-08 日本リーロナール株式会社 樹脂製品への機能性皮膜の形成方法
JPH1013022A (ja) * 1996-06-21 1998-01-16 Sumitomo Metal Mining Co Ltd 多層プリント配線板の製造方法
AU1243300A (en) * 1998-11-13 2000-06-05 Enthone-Omi Inc Process for metallizing a plastic surface
US6712948B1 (en) 1998-11-13 2004-03-30 Enthone Inc. Process for metallizing a plastic surface

Also Published As

Publication number Publication date
ES2305035T3 (es) 2008-11-01
US20020139679A1 (en) 2002-10-03
US6887561B2 (en) 2005-05-03
EP1174530A3 (fr) 2004-02-04
EP1174530A2 (fr) 2002-01-23
KR100816667B1 (ko) 2008-03-27
JP4789361B2 (ja) 2011-10-12
EP1174530B1 (fr) 2008-04-30
TW575667B (en) 2004-02-11
KR20020009439A (ko) 2002-02-01
DE60133795D1 (de) 2008-06-12
US20030183531A1 (en) 2003-10-02
US6610365B2 (en) 2003-08-26
DE60133795T2 (de) 2009-06-25
JP2002146589A (ja) 2002-05-22

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