TW575667B - Methods of producing conductor layers on dielectric surfaces and articles of manufacture thereof - Google Patents

Methods of producing conductor layers on dielectric surfaces and articles of manufacture thereof Download PDF

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Publication number
TW575667B
TW575667B TW90117772A TW90117772A TW575667B TW 575667 B TW575667 B TW 575667B TW 90117772 A TW90117772 A TW 90117772A TW 90117772 A TW90117772 A TW 90117772A TW 575667 B TW575667 B TW 575667B
Authority
TW
Taiwan
Prior art keywords
methods
articles
manufacture
conductor layers
dielectric surfaces
Prior art date
Application number
TW90117772A
Other languages
English (en)
Inventor
Mykolas Baranauskas
Original Assignee
Shipley Co Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co Llc filed Critical Shipley Co Llc
Application granted granted Critical
Publication of TW575667B publication Critical patent/TW575667B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9335—Product by special process
    • Y10S428/934—Electrical process
    • Y10S428/935—Electroplating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y10T428/12569—Synthetic resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12625—Free carbon containing component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12674—Ge- or Si-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
  • Laminated Bodies (AREA)
  • Paints Or Removers (AREA)

Description

575667 1 〇·如申請專利範圍第1或2項之方 鉍材料處理後而於使用硫化料声其中該基板於使用 理。 物材枓處理前係使用水處 11·一種製造物件，包括一片基板且
、、τ藉铷P P /、金屬沉積物，該金JI /儿積物如經由如申請專利範 方法提供。 I至】〇項中任-項之 1 2.—種製造物件，包含一 ,、#基板具有電解金屬沉積於其 ，以及鉍材料於金屬沉積物 ^Λ ,, 々以及硫進一步位方 料下方’該硫係選自硫化納、硫化_、有㈣ 物U合物，該金屬沈積物係經由如申請專利讀 1至1 〇項中任一項之方法提供。 13.如申請專利範圍第12項之物件，其中該金屬係沉積於 介電質層上方。 ' 1 4·如申 '專利範圍第丨2項之物件，其中該金屬係沈積於 介電質層上方。 15. 如申請專利範圍第12至14項中任—項之物件，其中釤 基板為電子封裝基板。 經濟部中央標準局員工福利委員會印製 16. 如申請專利範圍第12至14項中任—項之物件，其中誃 金屬沈積物提供裝飾或保護功能。 1 7.如申請專利範圍第12至14項中任—項之物件，其中該 基板為電磁屏障材料。 本紙張尺度適财11¾家標準（CNS) Α4規格⑺⑽撕公愛） 2 9187〗（更正本)
TW90117772A 2000-07-20 2001-07-20 Methods of producing conductor layers on dielectric surfaces and articles of manufacture thereof TW575667B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
LT2000074A LT2000074A (lt) 2000-07-20 2000-07-20 Elektrai laidžių dangų ant dielektriko paviršiaus gavimo būdas

Publications (1)

Publication Number Publication Date
TW575667B true TW575667B (en) 2004-02-11

Family

ID=19721484

Family Applications (1)

Application Number Title Priority Date Filing Date
TW90117772A TW575667B (en) 2000-07-20 2001-07-20 Methods of producing conductor layers on dielectric surfaces and articles of manufacture thereof

Country Status (8)

Country Link
US (2) US6610365B2 (zh)
EP (1) EP1174530B1 (zh)
JP (1) JP4789361B2 (zh)
KR (1) KR100816667B1 (zh)
DE (1) DE60133795T2 (zh)
ES (1) ES2305035T3 (zh)
LT (1) LT2000074A (zh)
TW (1) TW575667B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004026489B3 (de) * 2004-05-27 2005-09-29 Enthone Inc., West Haven Verfahren zur Metallisierung von Kunststoffoberflächen
JP2007239003A (ja) * 2006-03-07 2007-09-20 Univ Nagoya Ａｕメッキ方法及びＡｕメッキによるＡｕ回路の製造方法
WO2007116493A1 (ja) 2006-03-31 2007-10-18 Ebara-Udylite Co., Ltd. プラスチック用の表面改質液およびそれを利用したプラスチック表面の金属化方法
DE102014216974A1 (de) 2014-08-26 2016-03-03 Mahle International Gmbh Thermoelektrisches Modul
CN106048564A (zh) * 2016-07-27 2016-10-26 华南理工大学 一种在abs塑料表面无钯活化的金属化方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3620834A (en) * 1968-07-18 1971-11-16 Hooker Chemical Corp Metal plating of substrates
CA1120420A (en) * 1976-10-26 1982-03-23 Daniel Luch Process for providing a polymer-electroplate bond of improved strength and stability
SU980858A1 (ru) 1981-07-23 1982-12-15 Вильнюсский государственный университет им.В.Капсукаса Способ получени электропроводных покрытий
GB8511905D0 (en) * 1985-05-10 1985-06-19 Akzo Nv Metallizing polymeric materials
JPH0661891B2 (ja) * 1989-05-29 1994-08-17 大阪市 導電性ポリイミド成形物の製造法
US4919768A (en) * 1989-09-22 1990-04-24 Shipley Company Inc. Electroplating process
SU1762425A1 (ru) 1991-01-22 1992-09-15 Институт Химии И Химической Технологии Литовской Ан Способ получени электропровод щего покрыти сульфида меди на диэлектрической подложке
US5376248A (en) * 1991-10-15 1994-12-27 Enthone-Omi, Inc. Direct metallization process
US5698087A (en) * 1992-03-11 1997-12-16 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead
JPH06275758A (ja) * 1993-03-19 1994-09-30 Chichibu Fuji:Kk 半導体装置の製造方法
JP3274232B2 (ja) * 1993-06-01 2002-04-15 ディップソール株式会社 錫−ビスマス合金めっき浴及びそれを使用するめっき方法
US5484518A (en) * 1994-03-04 1996-01-16 Shipley Company Inc. Electroplating process
JPH07258861A (ja) * 1994-03-22 1995-10-09 Murata Mfg Co Ltd 無電解ビスマスめっき浴
JP3475260B2 (ja) * 1994-12-07 2003-12-08 日本リーロナール株式会社 樹脂製品への機能性皮膜の形成方法
JPH1013022A (ja) * 1996-06-21 1998-01-16 Sumitomo Metal Mining Co Ltd 多層プリント配線板の製造方法
AU1243300A (en) * 1998-11-13 2000-06-05 Enthone-Omi Inc Process for metallizing a plastic surface
US6712948B1 (en) 1998-11-13 2004-03-30 Enthone Inc. Process for metallizing a plastic surface

Also Published As

Publication number Publication date
ES2305035T3 (es) 2008-11-01
US20020139679A1 (en) 2002-10-03
US6887561B2 (en) 2005-05-03
EP1174530A3 (en) 2004-02-04
EP1174530A2 (en) 2002-01-23
KR100816667B1 (ko) 2008-03-27
JP4789361B2 (ja) 2011-10-12
EP1174530B1 (en) 2008-04-30
KR20020009439A (ko) 2002-02-01
DE60133795D1 (de) 2008-06-12
US20030183531A1 (en) 2003-10-02
US6610365B2 (en) 2003-08-26
DE60133795T2 (de) 2009-06-25
JP2002146589A (ja) 2002-05-22
LT2000074A (lt) 2002-01-25

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