KR970707581A - 열적 및 전기적 강화 플라스틱 핀 그리드 어레이(ppga) 패키지(thermally and electrically enhanced plastic pin grid array (ppga) package) - Google Patents
열적 및 전기적 강화 플라스틱 핀 그리드 어레이(ppga) 패키지(thermally and electrically enhanced plastic pin grid array (ppga) package)Info
- Publication number
- KR970707581A KR970707581A KR1019970702747A KR19970702747A KR970707581A KR 970707581 A KR970707581 A KR 970707581A KR 1019970702747 A KR1019970702747 A KR 1019970702747A KR 19970702747 A KR19970702747 A KR 19970702747A KR 970707581 A KR970707581 A KR 970707581A
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- Prior art keywords
- integrated circuit
- circuit board
- printed circuit
- coupled
- package
- Prior art date
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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Abstract
본 발명은 복수의 외부 장착핀(14)에 커플링 연결된 다층인쇄회로보드(16)와 집적회로(12)를 포함하고 있는 집적회로 패키지(10)이다. 다층회로보드(16)는 집적회로(12)에 커플링 연결되어 있고 어떠한 바이어스의 사용 없이도 핀(14)에 직접 루트설정되어 있는 복수의 내부본딩패드(46)를 가지고 있다. 인쇄회로보드(16)는 여러개의 전압/접지층(20, 22, 24, 26 및 28)을 가지고 있으므로 서로 다른 파우어 레벨이 집적회로보드(12)로 공급될 수 있다. 집적회로보드(12)는 인쇄회로보드(16)에 역시 커플링 연결된 열슬러그(52)에 장착되어 전기적으로 접지되어 있다. 열슬러그(52)는 패키지(10)를 위하여 접지평면과 써멀싱크의 이중기능을 제공한다. 핀(14)과 패키지(10)는 일반적으로 종래의 PPGA 패키지 배열상태로 형상화되어 있다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제4도는 제2도의 패키지의 확대단면도이다.
Claims (16)
- 복수의 전도구멍에 직접루트설정된 복수의 내부본딩패드를 가지고 있는 인쇄회로보드;및 상기 전도구멍에 커플링 연결된 복수의 핀으로 이루어진 것을 특징으로 하는 집적회로용 집적회로 패키지.
- 제1항에 있어서, 상기 인쇄회로보드는 복수의 전도층을 가지고 있는 것을 특징으로 하는 집적회로용 집적회로 패키지.
- 제1항에 있어서, 상기 인쇄회로보드에 커플링 연결된 열슬러그를 더 포함하고 있는 것을 특징으로 하는 집적회로용 집적회로 패키지.
- 제3항에 있어서, 상기 열슬러그는 상기 핀에 전기적으로 커플링 연결되어 있는 것을 특징으로 하는 집적회로용 집적회로 패키지.
- 제2항에 있어서, 상기 인쇄회로보드는 복수의 파우어층을 가지고 있는 것을 특징으로 하는 집적회로용 집적회로 패키지.
- 복수의 전도구멍에 집적루트설정된 복수의 내부본딩패드를 가지고 있는 인쇄 회로보드, 상기 전도구멍에 커플링 연결된 복수이 핀;및 상기 내부본딩패드에 커플링 연결된 집적회로로 이루어진 것을 특징으로 하는 집적회로 패키지 조립체.
- 제6항에 있어서, 상기 인쇄회로보드는 복수의 전도층을 가지고 있는 것을 특징으로 하는 집적회로 패키지 조립체.
- 제6항에 있어서, 상기 집적회로를 지지하고 상기 인쇄회로보드에 커플링 연결된 열슬러그를 더 포함하고 있는 것을 특징으로 하는 집적회로 패키지 조립체.
- 제8항에 있어서, 상기 열슬러그는 상기 집적회로와 상기 핀에 전기적으로 커플링 연결되어 있는 것을 특징으로 하는 집적회로 패키지 조립체.
- 제7항에 있어서, 상기 인쇄호로보드는 복수의 파우어층을 가지고 있는 것을 특징으로 하는 집적회로 패키지 조립체.
- 복수의 전도구멍에 직접 루트설정된 복수의 내부본딩패드를 가지고 있는 복수의 전도층을 포함하는 다층 인쇄회로보드;상기 전도구멍에 커플링 연결된 복수의 핀;상기 내부 본딩패드에 커플링 연결된 집적회로;및 상기 다층인쇄회로보드에 부착되고 상기 집적회로 및 상기 핀에 전기적으로 커플링 연결된 열슬러그로 이루어진 것을 특징으로 하는 집적회로 패키지 조립체.
- 제11항에 있어서, 상기 다층 인쇄회로보드는 복수의 파우어츠을 가지고 있는 것을 특징으로 하는 집적회로 패키지 조립체.
- (a) 다층인쇄회로보드에서 복수의 도금한 구멍에 복수의 핀을 부착하는 단계;(b) 상기 다층인쇄회로보드에 열슬러그를 장착하는 단계;(c) 상기 열슬러그에 집적회로를 장착하는 단계;및 (d) 상기 다층인쇄회로보드에 상기 집적회로를 커플링 연결하는 단계로 이루어진 것을 특징으로 하는 집적회로 패키지 조립체를 조립하는 방법.
- 제13항에 있어서, 상기 집적회로를 둘러싸는 단계를 더 포함하고 있는 것을 특징으로 하는 집적회로 패키지 조립체를 조립하는 방법.
- 제14항에 있어서, 상기 다층인쇄회로보드에 상기 직접회로를 커플링 연결하는 상기 단계가 와이어 본딩에 의해서 수행되는 것을 특징으로 하는 집적회로 패키지 조립체를 조립하는 방법.
- 제13항에 있어서, 상기 열슬러그는 상기 집적회로와 상기 다층인쇄회로보드에 전기적으로 커플링 연결되어 있는 것을 특징으로 하는 집적회로 패키지 조립체를 조립하는 방법.※ 참고사항:최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US08/333,144 | 1994-11-01 | ||
US08/333,144 US5625166A (en) | 1994-11-01 | 1994-11-01 | Structure of a thermally and electrically enhanced plastic pin grid array (PPGA) package for high performance devices with wire bond interconnect |
PCT/US1995/014169 WO1996013854A1 (en) | 1994-11-01 | 1995-11-01 | Thermally and electrically enhanced plastic pin grid array (ppga) package |
Publications (1)
Publication Number | Publication Date |
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KR970707581A true KR970707581A (ko) | 1997-12-01 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1019970702747A KR970707581A (ko) | 1994-11-01 | 1995-11-01 | 열적 및 전기적 강화 플라스틱 핀 그리드 어레이(ppga) 패키지(thermally and electrically enhanced plastic pin grid array (ppga) package) |
Country Status (9)
Country | Link |
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US (1) | US5625166A (ko) |
JP (1) | JPH10512097A (ko) |
KR (1) | KR970707581A (ko) |
CN (1) | CN1113410C (ko) |
AU (1) | AU4019695A (ko) |
HK (1) | HK1008267A1 (ko) |
MX (1) | MX9702830A (ko) |
MY (1) | MY137608A (ko) |
WO (1) | WO1996013854A1 (ko) |
Families Citing this family (25)
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US6043559A (en) | 1996-09-09 | 2000-03-28 | Intel Corporation | Integrated circuit package which contains two in plane voltage busses and a wrap around conductive strip that connects a bond finger to one of the busses |
US5804771A (en) | 1996-09-26 | 1998-09-08 | Intel Corporation | Organic substrate (PCB) slip plane "stress deflector" for flip chip deivces |
US6054758A (en) * | 1996-12-18 | 2000-04-25 | Texas Instruments Incorporated | Differential pair geometry for integrated circuit chip packages |
SG76530A1 (en) * | 1997-03-03 | 2000-11-21 | Hitachi Chemical Co Ltd | Circuit boards using heat resistant resin for adhesive layers |
US7336468B2 (en) | 1997-04-08 | 2008-02-26 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
US7321485B2 (en) | 1997-04-08 | 2008-01-22 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
US9054094B2 (en) | 1997-04-08 | 2015-06-09 | X2Y Attenuators, Llc | Energy conditioning circuit arrangement for integrated circuit |
WO2000005748A2 (en) * | 1998-07-22 | 2000-02-03 | Digirad Corporation | Blind pin placement on circuit boards |
US7020958B1 (en) * | 1998-09-15 | 2006-04-04 | Intel Corporation | Methods forming an integrated circuit package with a split cavity wall |
JP3160583B2 (ja) * | 1999-01-27 | 2001-04-25 | 日本特殊陶業株式会社 | 樹脂製基板 |
JP3368870B2 (ja) * | 1999-06-25 | 2003-01-20 | 日本電気株式会社 | パッケージ基板及びこれを備えた半導体装置 |
WO2001047013A1 (en) * | 1999-12-21 | 2001-06-28 | Advanced Micro Devices, Inc. | Organic packages with solders for reliable flip chip connections |
US6229207B1 (en) | 2000-01-13 | 2001-05-08 | Advanced Micro Devices, Inc. | Organic pin grid array flip chip carrier package |
US6487083B1 (en) * | 2000-08-10 | 2002-11-26 | Nortel Networks Ltd. | Multilayer circuit board |
US6992496B2 (en) * | 2002-03-05 | 2006-01-31 | Rika Electronics International, Inc. | Apparatus for interfacing electronic packages and test equipment |
US7177142B2 (en) * | 2004-09-29 | 2007-02-13 | Intel Corporation | Hybrid compression socket connector for integrated circuits |
US7630188B2 (en) | 2005-03-01 | 2009-12-08 | X2Y Attenuators, Llc | Conditioner with coplanar conductors |
KR100737098B1 (ko) * | 2006-03-16 | 2007-07-06 | 엘지이노텍 주식회사 | 전자파 차폐장치 및 그 제조 공정 |
US9713258B2 (en) * | 2006-04-27 | 2017-07-18 | International Business Machines Corporation | Integrated circuit chip packaging |
KR100834684B1 (ko) * | 2007-02-12 | 2008-06-02 | 삼성전자주식회사 | 전자 회로 패키지 |
US20090008139A1 (en) * | 2007-07-03 | 2009-01-08 | Sony Ericsson Mobile Communications Ab | Multilayer pwb and a method for producing the multilayer pwb |
TW201327775A (zh) * | 2011-12-21 | 2013-07-01 | Ind Tech Res Inst | 半導體結構及其製造方法 |
US9532465B2 (en) * | 2012-03-28 | 2016-12-27 | Ttm Technologies, Inc. | Method of fabricating a printed circuit board interconnect assembly |
CN105304604A (zh) * | 2015-10-09 | 2016-02-03 | 株洲宏达天成微波有限公司 | 一种用于多焊盘芯片键合的多层键合方法 |
US10804188B2 (en) | 2018-09-07 | 2020-10-13 | Intel Corporation | Electronic device including a lateral trace |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US5130889A (en) * | 1991-06-28 | 1992-07-14 | Digital Equipment Corporation | Integrated circuit protection by liquid encapsulation |
US5102829A (en) * | 1991-07-22 | 1992-04-07 | At&T Bell Laboratories | Plastic pin grid array package |
US5357672A (en) * | 1993-08-13 | 1994-10-25 | Lsi Logic Corporation | Method and system for fabricating IC packages from laminated boards and heat spreader |
-
1994
- 1994-11-01 US US08/333,144 patent/US5625166A/en not_active Expired - Lifetime
-
1995
- 1995-11-01 KR KR1019970702747A patent/KR970707581A/ko not_active Application Discontinuation
- 1995-11-01 WO PCT/US1995/014169 patent/WO1996013854A1/en not_active Application Discontinuation
- 1995-11-01 JP JP8514842A patent/JPH10512097A/ja not_active Ceased
- 1995-11-01 CN CN95196958A patent/CN1113410C/zh not_active Expired - Fee Related
- 1995-11-01 MX MX9702830A patent/MX9702830A/es unknown
- 1995-11-01 AU AU40196/95A patent/AU4019695A/en not_active Abandoned
- 1995-12-12 MY MYPI95003836A patent/MY137608A/en unknown
-
1998
- 1998-07-21 HK HK98109331A patent/HK1008267A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
HK1008267A1 (en) | 1999-05-07 |
CN1113410C (zh) | 2003-07-02 |
AU4019695A (en) | 1996-05-23 |
WO1996013854A1 (en) | 1996-05-09 |
MY137608A (en) | 2009-02-27 |
MX9702830A (es) | 1997-07-31 |
US5625166A (en) | 1997-04-29 |
JPH10512097A (ja) | 1998-11-17 |
CN1171165A (zh) | 1998-01-21 |
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