MX9702830A - Paquete de matriz de reticula de agujas, de plastico, mejorado termica y electricamente (ppga). - Google Patents

Paquete de matriz de reticula de agujas, de plastico, mejorado termica y electricamente (ppga).

Info

Publication number
MX9702830A
MX9702830A MX9702830A MX9702830A MX9702830A MX 9702830 A MX9702830 A MX 9702830A MX 9702830 A MX9702830 A MX 9702830A MX 9702830 A MX9702830 A MX 9702830A MX 9702830 A MX9702830 A MX 9702830A
Authority
MX
Mexico
Prior art keywords
circuit board
integrated circuit
package
thermal
ppga
Prior art date
Application number
MX9702830A
Other languages
English (en)
Inventor
Siva Natarajan
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of MX9702830A publication Critical patent/MX9702830A/es

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

La presente invencion se refiere a un paquete de circuito integrado que contiene un tablero de circuito impreso de multiples capas que se acopla a una pluralidad de agujas de montaje externas y un circuito integrado. El tablero de circuito de multiples capas tiene una pluralidad de cojines de union interiores que se acoplan al circuito integrado y se envían directamente a las agujas sin el uso de cualesquiera vías. El tablero de circuito impreso tiene multiples capas de voltaje/tierra, de manera tal que diferentes niveles de energía pueden suministrarse al tablero de circuito integrado. El circuito integrado se monta y pone a tierra eléctricamente a una barra térmica, que también se acopla al tablero de circuito impreso. La barra térmica proporciona la funcion dual de un plano de tierra y un colector térmico para el paquete. Las agujas y el paquete típicamente se configuran en un montaje de paquete PPGA convencional.
MX9702830A 1994-11-01 1995-11-01 Paquete de matriz de reticula de agujas, de plastico, mejorado termica y electricamente (ppga). MX9702830A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/333,144 US5625166A (en) 1994-11-01 1994-11-01 Structure of a thermally and electrically enhanced plastic pin grid array (PPGA) package for high performance devices with wire bond interconnect
PCT/US1995/014169 WO1996013854A1 (en) 1994-11-01 1995-11-01 Thermally and electrically enhanced plastic pin grid array (ppga) package

Publications (1)

Publication Number Publication Date
MX9702830A true MX9702830A (es) 1997-07-31

Family

ID=23301496

Family Applications (1)

Application Number Title Priority Date Filing Date
MX9702830A MX9702830A (es) 1994-11-01 1995-11-01 Paquete de matriz de reticula de agujas, de plastico, mejorado termica y electricamente (ppga).

Country Status (8)

Country Link
US (1) US5625166A (es)
JP (1) JPH10512097A (es)
KR (1) KR970707581A (es)
CN (1) CN1113410C (es)
AU (1) AU4019695A (es)
MX (1) MX9702830A (es)
MY (1) MY137608A (es)
WO (1) WO1996013854A1 (es)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6043559A (en) 1996-09-09 2000-03-28 Intel Corporation Integrated circuit package which contains two in plane voltage busses and a wrap around conductive strip that connects a bond finger to one of the busses
US5804771A (en) 1996-09-26 1998-09-08 Intel Corporation Organic substrate (PCB) slip plane "stress deflector" for flip chip deivces
US6054758A (en) * 1996-12-18 2000-04-25 Texas Instruments Incorporated Differential pair geometry for integrated circuit chip packages
TW398165B (en) * 1997-03-03 2000-07-11 Hitachi Chemical Co Ltd Circuit boards using heat resistant resin for adhesive layers
US7321485B2 (en) 1997-04-08 2008-01-22 X2Y Attenuators, Llc Arrangement for energy conditioning
US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
US7336468B2 (en) 1997-04-08 2008-02-26 X2Y Attenuators, Llc Arrangement for energy conditioning
WO2000005748A2 (en) * 1998-07-22 2000-02-03 Digirad Corporation Blind pin placement on circuit boards
US7020958B1 (en) * 1998-09-15 2006-04-04 Intel Corporation Methods forming an integrated circuit package with a split cavity wall
JP3160583B2 (ja) * 1999-01-27 2001-04-25 日本特殊陶業株式会社 樹脂製基板
JP3368870B2 (ja) * 1999-06-25 2003-01-20 日本電気株式会社 パッケージ基板及びこれを備えた半導体装置
WO2001047013A1 (en) * 1999-12-21 2001-06-28 Advanced Micro Devices, Inc. Organic packages with solders for reliable flip chip connections
US6229207B1 (en) 2000-01-13 2001-05-08 Advanced Micro Devices, Inc. Organic pin grid array flip chip carrier package
US6487083B1 (en) * 2000-08-10 2002-11-26 Nortel Networks Ltd. Multilayer circuit board
EP1488245B1 (en) * 2002-03-05 2007-08-22 Rika Denshi America, Inc. Apparatus for interfacing electronic packages and test equipment
US7177142B2 (en) * 2004-09-29 2007-02-13 Intel Corporation Hybrid compression socket connector for integrated circuits
GB2439861A (en) 2005-03-01 2008-01-09 X2Y Attenuators Llc Internally overlapped conditioners
KR100737098B1 (ko) * 2006-03-16 2007-07-06 엘지이노텍 주식회사 전자파 차폐장치 및 그 제조 공정
US9713258B2 (en) * 2006-04-27 2017-07-18 International Business Machines Corporation Integrated circuit chip packaging
KR100834684B1 (ko) * 2007-02-12 2008-06-02 삼성전자주식회사 전자 회로 패키지
US20090008139A1 (en) * 2007-07-03 2009-01-08 Sony Ericsson Mobile Communications Ab Multilayer pwb and a method for producing the multilayer pwb
TW201327775A (zh) * 2011-12-21 2013-07-01 財團法人工業技術研究院 半導體結構及其製造方法
US9532465B2 (en) * 2012-03-28 2016-12-27 Ttm Technologies, Inc. Method of fabricating a printed circuit board interconnect assembly
CN105304604A (zh) * 2015-10-09 2016-02-03 株洲宏达天成微波有限公司 一种用于多焊盘芯片键合的多层键合方法
US10804188B2 (en) 2018-09-07 2020-10-13 Intel Corporation Electronic device including a lateral trace

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5130889A (en) * 1991-06-28 1992-07-14 Digital Equipment Corporation Integrated circuit protection by liquid encapsulation
US5102829A (en) * 1991-07-22 1992-04-07 At&T Bell Laboratories Plastic pin grid array package
US5357672A (en) * 1993-08-13 1994-10-25 Lsi Logic Corporation Method and system for fabricating IC packages from laminated boards and heat spreader

Also Published As

Publication number Publication date
WO1996013854A1 (en) 1996-05-09
JPH10512097A (ja) 1998-11-17
CN1171165A (zh) 1998-01-21
MY137608A (en) 2009-02-27
HK1008267A1 (en) 1999-05-07
US5625166A (en) 1997-04-29
AU4019695A (en) 1996-05-23
KR970707581A (ko) 1997-12-01
CN1113410C (zh) 2003-07-02

Similar Documents

Publication Publication Date Title
MX9702830A (es) Paquete de matriz de reticula de agujas, de plastico, mejorado termica y electricamente (ppga).
JP4860530B2 (ja) Ｅｌ光源体
ES2107870T3 (es) Tarjeta de circuitos integrados con conexion a tierra.
DE3677884D1 (de) Kuehlungsanordnung fuer elektronische bauelemente.
MXPA03009003A (es) Ensamble de recinto de unidad de diagnostico remoto.
MX2010004922A (es) Arreglo de diodo emisor de luz para requerimientos de alta seguridad.
US5504660A (en) Lens retention structure
ES2051248A2 (es) Lampara de señalizacion para vehiculos de motor.
EP2226842A1 (en) Thermal conduction structure for heat generating components
EP0369180A3 (en) A circuit device, made up of a reduced number of components, for simultaneously turning on a plurality of power transistors
BR0117064A (pt) Estrutura de disposição de unidade elétrica em motocicleta
JPWO2011158277A1 (ja) Ｌｅｄランプ
JPH0214078Y2 (es)
CN209248976U (zh) 一种坚固的led户外广告牌
KR200415872Y1 (ko) 엘이디 드라이버 케이블
KR200385344Y1 (ko) 광고판
US9000467B2 (en) Non-chip LED illumination device
JPS6163856U (es)
JPS60169854U (ja) 可視発光ダイオ−ドランプ
JPH0328466Y2 (es)
JPH0436129Y2 (es)
JPS6041591Y2 (ja) 監視盤の表示装置
JPS639113Y2 (es)
KR20160001628U (ko) Ac 전원 직접 구동 cob 모듈을 이용한 가로등 유닛
KR20040003568A (ko) 차량용 디지탈 시계의 내구력 향상 구조