KR970704168A - 광학소자 패키지(Packaged Optical Device) - Google Patents

광학소자 패키지(Packaged Optical Device) Download PDF

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Publication number
KR970704168A
KR970704168A KR1019960707456A KR19960707456A KR970704168A KR 970704168 A KR970704168 A KR 970704168A KR 1019960707456 A KR1019960707456 A KR 1019960707456A KR 19960707456 A KR19960707456 A KR 19960707456A KR 970704168 A KR970704168 A KR 970704168A
Authority
KR
South Korea
Prior art keywords
optical
support member
optical fiber
optical element
adjustment
Prior art date
Application number
KR1019960707456A
Other languages
English (en)
Korean (ko)
Inventor
빈센트 콜린스 존
앨린 페이니 로저
리차드 서로우 아드리안
프랜시스 릴맨 이안
존 피디멘트 필립
Original Assignee
사이몬 크리스토퍼 로버츠
브리티쉬 텔리커뮤니케이션즈 퍼블릭 리미티드 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26137171&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR970704168(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from GBGB9504056.4A external-priority patent/GB9504056D0/en
Application filed by 사이몬 크리스토퍼 로버츠, 브리티쉬 텔리커뮤니케이션즈 퍼블릭 리미티드 캄파니 filed Critical 사이몬 크리스토퍼 로버츠
Publication of KR970704168A publication Critical patent/KR970704168A/ko

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4225—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements by a direct measurement of the degree of coupling, e.g. the amount of light power coupled to the fibre or the opto-electronic element
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/0206—Substrates, e.g. growth, shape, material, removal or bonding
    • H01S5/0207—Substrates having a special shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/0231—Stems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
KR1019960707456A 1994-06-29 1995-06-29 광학소자 패키지(Packaged Optical Device) KR970704168A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
EP94304755.5 1994-06-29
EP94304755 1994-06-29
GB9504056.4 1995-03-01
GBGB9504056.4A GB9504056D0 (en) 1995-03-01 1995-03-01 Packageless laser
PCT/GB1995/001542 WO1996000918A1 (fr) 1994-06-29 1995-06-29 Dispositif optique en boitier

Publications (1)

Publication Number Publication Date
KR970704168A true KR970704168A (ko) 1997-08-09

Family

ID=26137171

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960707456A KR970704168A (ko) 1994-06-29 1995-06-29 광학소자 패키지(Packaged Optical Device)

Country Status (7)

Country Link
US (1) US5852696A (fr)
EP (1) EP0767923B1 (fr)
JP (1) JPH10505433A (fr)
KR (1) KR970704168A (fr)
CA (1) CA2193095C (fr)
DE (1) DE69514358T2 (fr)
WO (1) WO1996000918A1 (fr)

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GB2310052B (en) * 1996-02-08 2000-01-19 Northern Telecom Ltd Securing an optical fibre in a v-groove
JP3087676B2 (ja) * 1997-02-13 2000-09-11 日本電気株式会社 ゲル状樹脂を用いた光結合系及び実装構造
WO1998045741A1 (fr) * 1997-04-08 1998-10-15 Hitachi, Ltd. Module optique, procede de fabrication d'un module optique, et dispositif optique de transmission
JP3191729B2 (ja) * 1997-07-03 2001-07-23 日本電気株式会社 光半導体モジュールとその製造方法
US6525386B1 (en) * 1998-03-10 2003-02-25 Masimo Corporation Non-protruding optoelectronic lens
EP0989430A3 (fr) * 1998-09-24 2000-05-24 LG Cable & Machinery Ltd. Procédé de fabrication de diodes laser, de modules optiques émetteur/récepteur et leurs méthodes d'alignement
US6625357B2 (en) 1999-03-29 2003-09-23 Tyco Electronics Corporation Method for fabricating fiducials for passive alignment of opto-electronic devices
JP2001074987A (ja) * 1999-09-08 2001-03-23 Yazaki Corp レセプタクルの製造方法、レセプタクル、及び光コネクタ
KR100349598B1 (ko) * 2000-02-03 2002-08-23 삼성전자 주식회사 실리콘 광벤치를 이용한 스몰 폼 팩터 광송수신 집적 모듈
JP2001242357A (ja) * 2000-02-28 2001-09-07 Alps Electric Co Ltd 光半導体装置
KR100362570B1 (ko) * 2000-06-23 2002-11-29 삼성전자 주식회사 기밀처리된 광 파장 분할/결합기 팩키지
US6603791B2 (en) * 2000-12-12 2003-08-05 Keopsys, Inc. High power fiber amplifiers with passive pump module alignment
US20030068504A1 (en) * 2001-10-09 2003-04-10 Joseph Abner D. Flame retardant optical circuit
US6647039B2 (en) 2002-02-27 2003-11-11 Jds Uniphase Corporation Reconfigurable laser header
US6646777B2 (en) 2002-02-27 2003-11-11 Jds Uniphase Corporation Optical isolator with improved mounting characteristics
US6773532B2 (en) 2002-02-27 2004-08-10 Jds Uniphase Corporation Method for improving heat dissipation in optical transmitter
US6859470B2 (en) 2002-02-27 2005-02-22 Jds Uniphase Corporation Air trench that limits thermal coupling between laser and laser driver
KR100442615B1 (ko) * 2002-03-05 2004-08-02 삼성전자주식회사 정전용량 감소를 위한 적층구조 및 그 제조방법
JPWO2004042444A1 (ja) * 2002-11-08 2006-03-09 Tdk株式会社 光モジュール及びその製造方法
US6835582B1 (en) 2003-01-15 2004-12-28 The United States Of America As Represented By The Secretary Of The Navy Microchip-level optical interconnect
JP4062705B2 (ja) * 2004-05-26 2008-03-19 京セミ株式会社 半導体光学部品及びその製造方法
GB0512386D0 (en) 2005-06-17 2005-07-27 Ct For Integrated Photonics Th Folded cavity optoelectronic devices
JP4807987B2 (ja) * 2005-09-06 2011-11-02 日本電信電話株式会社 気密封止パッケージおよび光サブモジュール
US20080013896A1 (en) * 2006-06-28 2008-01-17 Salzberg Jose B Miniature optical transceiver
US20080056647A1 (en) * 2006-08-31 2008-03-06 Mark Margolin Active modular optoelectronic components
US9250399B2 (en) * 2006-08-31 2016-02-02 Optogig, Inc. High density active modular optoelectronic device for use with push-release mechanism and method for using same
US8791492B2 (en) 2009-10-01 2014-07-29 Excelitas Canada, Inc. Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same
US9018074B2 (en) 2009-10-01 2015-04-28 Excelitas Canada, Inc. Photonic semiconductor devices in LLC assembly with controlled molding boundary and method for forming same
EP2820726B1 (fr) * 2012-03-02 2018-05-02 Excelitas Canada Inc. Boîtier de puce laser à semi-conducteurs, avec renfoncement encapsulé, moulé sur substrat, et procédé de formation de celui-ci
US9787054B2 (en) * 2015-05-05 2017-10-10 Sifotonics Technologies Co., Ltd. Optical package providing efficient coupling between DFB-LD and silicon PIC edge couplers with low return loss
JP6667307B2 (ja) * 2016-02-04 2020-03-18 古河電気工業株式会社 光ファイバと半導体レーザとの光結合構造
CN114034294B (zh) * 2021-09-30 2022-10-11 苏州光环科技有限公司 一种光纤环封装装置

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Also Published As

Publication number Publication date
DE69514358T2 (de) 2000-08-24
JPH10505433A (ja) 1998-05-26
CA2193095C (fr) 2002-04-30
CA2193095A1 (fr) 1996-01-11
EP0767923B1 (fr) 2000-01-05
DE69514358D1 (de) 2000-02-10
EP0767923A1 (fr) 1997-04-16
US5852696A (en) 1998-12-22
WO1996000918A1 (fr) 1996-01-11

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A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
NORF Unpaid initial registration fee