KR970076348A - 좌표입력장치 및 그 제조방법 - Google Patents

좌표입력장치 및 그 제조방법 Download PDF

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Publication number
KR970076348A
KR970076348A KR1019970017104A KR19970017104A KR970076348A KR 970076348 A KR970076348 A KR 970076348A KR 1019970017104 A KR1019970017104 A KR 1019970017104A KR 19970017104 A KR19970017104 A KR 19970017104A KR 970076348 A KR970076348 A KR 970076348A
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South Korea
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hole
electrodes
sensor substrate
circuit board
input device
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KR1019970017104A
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English (en)
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KR100249533B1 (ko
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히데또 마쓰후사
류우이찌 하기야
나오끼 야마다
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가따오까 마사따까
알프스덴끼 가부시끼가이샤
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Publication of KR970076348A publication Critical patent/KR970076348A/ko
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Publication of KR100249533B1 publication Critical patent/KR100249533B1/ko

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416Control or interface arrangements specially adapted for digitisers
    • G06F3/04164Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0286Programmable, customizable or modifiable circuits
    • H05K1/0287Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H05K1/0289Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04111Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/095Conductive through-holes or vias
    • H05K2201/096Vertically aligned vias, holes or stacked vias
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10151Sensor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04Soldering or other types of metallurgic bonding
    • H05K2203/0455PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Position Input By Displaying (AREA)

Abstract

본 발명은 센서 기판과 회로기판을 도통시키기 위해 사용되었던 커넥터 및 플렉시블 배선기판을 생략할 수 있는 정전용량방식의 좌표입력장치 및 그 제조방법을 제공한다. 본 발명은 필름체(4)의 표리 양면에 각각 서로 수직방향으로 연장하는 X 전극군과 Y 전극군을 설치하고, 이들 복수개의 전극의 각 일단부에 관통공(7)을 설치하여 이루어지는 센서기판(2)과, 상기 관통공(7)의 대향위치에 관통홀(through hole)부(14)를 설치하고, 또한, 이면에 배선패턴(16)이나 회로칩을 설치하고, 상기 센서기판(2)을 얹어놓은 회로기판(3)과, 상기 관통공(7) 및 이에 대응하는 상기 관통홀부(14)의 내벽면에 부착하여 상기 전극의 랜드(8 및 10)와 상기 배선패턴(16)을 도통시키는 도전재(18)를 구비하는 구성으로 하였다.

Description

좌표입력장치 및 그 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 일 실시예에 따른 좌표입력장치의 전체구성을 나타낸 분해사시도, 제2도는 본 발명의 일 실시예에 따른 좌표입력장치에 편성되는 센서기판의 평면도, 제3도는 본 발명의 일 실시예에 따른 센서기판의 저면도, 제4도는 본 발명의 일 실시예에 따른 상기 센서기판과 회로기판을 도통시키는 도전재의 인쇄방법을 나타낸 설명도, 제5도는 본 발명의 일 실시예에 따른 상기 도전재의 인쇄후의 도포상태를 나타낸 설명도.

Claims (4)

  1. 표면에 서로 평행한 복수개의 제1전극을 설치하고, 또한 이면에 상기 제1전극군에 대하여 수직방향으로 연장하는 서로 평행한 복수개의 제2전극을 설치함과 동시에, 이들 복수개의 제1 및 제2전극의 각 일단부에 관통공을 설치한 센서기판과, 상기 관통공의 대향위치에 관통홀부를 설치하고, 또한 이면에 상기 각 전극을 구동제어하기 위한 회로부를 설치하여, 상기 센서 기판을 얹어놓는 회로기판과, 상기 관통공 및 이에 대응하는 상기 관통홀부의 내벽면에 부착하여 상기 각 전극과 상기 회로부를 도통시키는 도전재를 구비하여 이루어지는 좌표입력장치.
  2. 제1항에 있어서, 상기 관통공의 내경은 이에 대응하는 상기 관통홀부의 내경보다도 큰 것을 특징으로 하는 좌표 입력장치.
  3. 제1항 또는 제2항에 있어서, 상기 각 전극의 일단부에 노출되는 상기 관통공을 서로 연통시켜 대략 L자형의 슬릿으로 한 것을 특징으로 하는 좌표입력장치.
  4. 필름체의 표면에 서로 평행하게 연장하는 복수개의 제1전극을 갖고, 또한 상기 필름체의 이면에 상기 제1전극군에 대하여 수직방향으로 연장하는 서로 평행한 복수개의 제2전극을 가짐과 동시에, 이들 복수개의 제1 및 제2전극의 각 일단부에 관통공을 갖는 센서기판과, 상기 관통공의 대향위치에 관통홀부를 갖고 또한 이면에 상기 각 전극을 구동제어하기 위한 회로부를 갖는 회로기판을, 상기 센서기판을 상방으로 하여 적충한 후, 상기 회로기판의 이면측에서 상기 관통홀부내를 흡인하면서, 상기 센서기판의 표면측에서 상기 관통공 및 그 테두리에 도전재를 인쇄함으로써, 상기 관통공 및 이에 대응하는 상기 관통홀부의 내벽면에 부착시킨 상기 도전재를 통하여, 상기 각 전극과 상기 회로부를 도통시키는 것을 특징으로 하는 좌표입력장치의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019970017104A 1996-05-14 1997-05-02 좌표입력장치 및 그 제조방법 KR100249533B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP118959/96 1996-05-14
JP11895996A JP3607412B2 (ja) 1996-05-14 1996-05-14 座標入力装置の製造方法
JP96-118959 1996-05-14

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KR970076348A true KR970076348A (ko) 1997-12-12
KR100249533B1 KR100249533B1 (ko) 2000-03-15

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US (2) US5896127A (ko)
JP (1) JP3607412B2 (ko)
KR (1) KR100249533B1 (ko)
TW (1) TW472205B (ko)

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KR101625611B1 (ko) * 2009-09-03 2016-06-14 삼성디스플레이 주식회사 터치 패널 및 이를 갖는 터치 입출력 장치
JP5295090B2 (ja) * 2009-12-18 2013-09-18 株式会社ワコム 指示体検出装置
JP6466737B2 (ja) * 2015-02-26 2019-02-06 京セラ株式会社 タッチパネル付液晶表示装置
JP6704724B2 (ja) * 2015-12-16 2020-06-03 株式会社ジャパンディスプレイ 表示装置
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Publication number Publication date
US5896127A (en) 1999-04-20
JP3607412B2 (ja) 2005-01-05
US6184872B1 (en) 2001-02-06
JPH09305288A (ja) 1997-11-28
TW472205B (en) 2002-01-11
KR100249533B1 (ko) 2000-03-15

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