DE69203110D1 - Vorrichtung zum Verbinden der Kontaktstifte eines in einem dual-in-line (DIL) Gehäuse montierten integrierten Schaltkreises mit gedruckten Schaltungen auf einer Leiterplatte auf n verschiedene Weisen. - Google Patents

Vorrichtung zum Verbinden der Kontaktstifte eines in einem dual-in-line (DIL) Gehäuse montierten integrierten Schaltkreises mit gedruckten Schaltungen auf einer Leiterplatte auf n verschiedene Weisen.

Info

Publication number
DE69203110D1
DE69203110D1 DE69203110T DE69203110T DE69203110D1 DE 69203110 D1 DE69203110 D1 DE 69203110D1 DE 69203110 T DE69203110 T DE 69203110T DE 69203110 T DE69203110 T DE 69203110T DE 69203110 D1 DE69203110 D1 DE 69203110D1
Authority
DE
Germany
Prior art keywords
printed
dil
dual
housing
line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69203110T
Other languages
English (en)
Other versions
DE69203110T2 (de
Inventor
Veer Henricus Johannes Mari De
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tulip Computers International BV
Original Assignee
Tulip Computers International BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tulip Computers International BV filed Critical Tulip Computers International BV
Application granted granted Critical
Publication of DE69203110D1 publication Critical patent/DE69203110D1/de
Publication of DE69203110T2 publication Critical patent/DE69203110T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/029—Programmable, customizable or modifiable circuits having a programmable lay-out, i.e. adapted for choosing between a few possibilities
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0295—Programmable, customizable or modifiable circuits adapted for choosing between different types or different locations of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09954—More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
DE69203110T 1991-02-22 1992-02-21 Vorrichtung zum Verbinden der Kontaktstifte eines in einem dual-in-line (DIL) Gehäuse montierten integrierten Schaltkreises mit gedruckten Schaltungen auf einer Leiterplatte auf n verschiedene Weisen. Expired - Fee Related DE69203110T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL9100321A NL9100321A (nl) 1991-02-22 1991-02-22 Inrichting voor het op n verschillende manieren met bedradingssporen op een printplaat verbinden van de aansluitpennen van een in een dual-in-line (dil)-behuizing ondergebrachte geintegreerde schakeling.

Publications (2)

Publication Number Publication Date
DE69203110D1 true DE69203110D1 (de) 1995-08-03
DE69203110T2 DE69203110T2 (de) 1996-04-04

Family

ID=19858923

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69203110T Expired - Fee Related DE69203110T2 (de) 1991-02-22 1992-02-21 Vorrichtung zum Verbinden der Kontaktstifte eines in einem dual-in-line (DIL) Gehäuse montierten integrierten Schaltkreises mit gedruckten Schaltungen auf einer Leiterplatte auf n verschiedene Weisen.

Country Status (4)

Country Link
US (1) US5258890A (de)
EP (1) EP0500189B1 (de)
DE (1) DE69203110T2 (de)
NL (1) NL9100321A (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5777853A (en) * 1996-05-03 1998-07-07 Ast Research, Inc. Printed circuit board having a dual square pattern footprints for receiving one of two electronic components having equal printouts per size
US5764488A (en) * 1996-06-11 1998-06-09 Ast Research, Inc. Printed circuit board having a dual pattern footprint for receiving one of two component packages
US5751557A (en) * 1996-06-21 1998-05-12 Ast Research, Inc. Printed circuit board having a triple pattern footprint for receiving one of three component packages
US6246107B1 (en) 1999-07-07 2001-06-12 Philips Semiconductors, Inc. Semiconductor device arrangement having configuration via adjacent bond pad coding
CN102540004A (zh) * 2010-12-08 2012-07-04 鸿富锦精密工业（深圳）有限公司 测试装置
US9545004B2 (en) * 2013-01-29 2017-01-10 Fci Americas Technology Llc Printed circuit board having orthogonal signal routing
TWI843746B (zh) 2018-09-07 2024-06-01 美商Ｆｃｉ美國有限責任公司 低成本高速印刷電路板之連接器

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1590612B2 (de) * 1966-05-27 1971-01-28 Standard Elektrik Lorenz Ag, 7000 Stuttgart Verdrahtungsmatrix
US3564114A (en) * 1967-09-28 1971-02-16 Loral Corp Universal multilayer printed circuit board
US3646246A (en) * 1970-05-22 1972-02-29 Honeywell Inf Systems Circuit board and method of making
US3670208A (en) * 1970-07-13 1972-06-13 Logic Dynamics Inc Microelectronic package, buss strip and printed circuit base assembly
US3917984A (en) * 1974-10-01 1975-11-04 Microsystems Int Ltd Printed circuit board for mounting and connecting a plurality of semiconductor devices
US4674007A (en) * 1985-06-07 1987-06-16 Microscience Corporation Method and apparatus for facilitating production of electronic circuit boards

Also Published As

Publication number Publication date
EP0500189B1 (de) 1995-06-28
DE69203110T2 (de) 1996-04-04
EP0500189A1 (de) 1992-08-26
US5258890A (en) 1993-11-02
NL9100321A (nl) 1992-09-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee