KR970076941A - 좌표 입력 장치 - Google Patents

좌표 입력 장치 Download PDF

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Publication number
KR970076941A
KR970076941A KR1019970017105A KR19970017105A KR970076941A KR 970076941 A KR970076941 A KR 970076941A KR 1019970017105 A KR1019970017105 A KR 1019970017105A KR 19970017105 A KR19970017105 A KR 19970017105A KR 970076941 A KR970076941 A KR 970076941A
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KR
South Korea
Prior art keywords
electrode group
sensor substrate
film body
protective sheet
electrodes
Prior art date
Application number
KR1019970017105A
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English (en)
Other versions
KR100256130B1 (ko
Inventor
히데또 마쓰후사
류우이찌 하기야
나오끼 야마다
Original Assignee
가따오까 마사따까
알프스덴끼 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by 가따오까 마사따까, 알프스덴끼 가부시끼가이샤 filed Critical 가따오까 마사따까
Publication of KR970076941A publication Critical patent/KR970076941A/ko
Application granted granted Critical
Publication of KR100256130B1 publication Critical patent/KR100256130B1/ko

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0455—PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Position Input By Displaying (AREA)

Abstract

정전용량 방식의 좌표 입력 장치에 있어서, 이 센서기판의 표면에 기포를 발생하지 않고 보호시이트를 펴붙일 수 있고, 펴붙인 보호시이트의 표면의 평탄성을 손상시키지 않도록 한다.
센서기판(1)의 필름체(4)의 표리 양면에는 각각, X방향을 따라서 서로 평행하게 신장하는 복수개의 X전극(5)과, Y방향을 따라서 서로 평행하게 신장하는 복수개의 Y전극(6)이 설치되어 있으며, 이 필름체(4)의 표면에서 X전극(5)군이 존재하지 않는 영역에, 각 X전극(5)과 동등한 두께를 갖는 레지스트층(7)을 설치하고, 이렇게하여 레지스트층(7)을 부설함으로써 표면의 요철을 평탄화시킨 센서기판(1)상에, 점착층(2)을 사이에 두고 보호시이트(3)를 펴붙이는 구성으로 하였다.

Description

좌표 입력 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 의한 좌표 입력 장치의 일실시예를 나타내는 요부 단면도이다.

Claims (4)

  1. 필름체의 표면에 서로 평행하게 신장하는 복수개의 제1의 전극을 설치하고, 또 상기 필름체의 이면(裏面)에 상기 제1의 전극군에 대하여 직교하는 방향으로 신장하는 서로 평행한 복수개의 제2의 전극을 설치하여, 이들 제1의 전극군과 제2의 전극군과의 사이의 정전용량에 따른 전류치를 출력하는 센서기판과, 상기 필름체의 표면에서 상기 제1의 전극군이 존재하지 않는 영역에 설치된 상기 제1의 전극군과 동등산 두께를 갖는 충전층과, 이 충전층 및 상기 제1의 전극군의 표면에 펴붙여져 조작시에 손가락 등의 위치지시체가 접촉하는 보호시이트를 구비하는 것을 특징으로 하는 좌표 입력 장치.
  2. 제1항에 있어서, 상기 충전층이 상기 센서기판상에 인쇄형성한 레지스트층으로 이루어지는 것을 특징으로 하는 좌표 입력 장치.
  3. 필름체의 표면에 서로 평행하게 신장하는 복수개의 제1의 전극을 설치하고, 또 상기 필름체의 이면에 상기 제1의 전극군에 대하여 직교하는 방향으로 신장하는 서로 평행한 복수개의 제2의 전극을 설치하여, 이들 제1의 전극군과 제2의 전극군과의 사이의 정전용량에 따른 전류치를 출력하는 센서기판과, 이 센서기판상에 놓여져서 조작시에 손가락 등의 위치지시체가 접촉하는 보호시이트와, 이 보호시이트와 상기 센서기판과의 사이에 삽입된 겔상 점착제를 경화시켜서 이루어지는 접착층을 구비하는 것을 특징으로 하는 좌표 입력 장치.
  4. 제3항에 있어서, 상기 센서기판상에 얹어놓기 전의 상기 보호시이트와 이면에 상기 겔상 점착제를 설치해두는 것을 특징으로 하는 좌표 입력장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019970017105A 1996-05-14 1997-05-02 좌표 입력 장치 KR100256130B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP11896096A JP3426847B2 (ja) 1996-05-14 1996-05-14 座標入力装置
JP96-118960 1996-05-14

Publications (2)

Publication Number Publication Date
KR970076941A true KR970076941A (ko) 1997-12-12
KR100256130B1 KR100256130B1 (ko) 2000-05-15

Family

ID=14749543

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970017105A KR100256130B1 (ko) 1996-05-14 1997-05-02 좌표 입력 장치

Country Status (5)

Country Link
US (1) US5926171A (ko)
JP (1) JP3426847B2 (ko)
KR (1) KR100256130B1 (ko)
CN (1) CN1082251C (ko)
TW (1) TW321754B (ko)

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JP3574308B2 (ja) * 1997-09-02 2004-10-06 アルプス電気株式会社 積層基板およびこれを用いたデータ入力装置
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ES2242761T3 (es) 2000-07-21 2005-11-16 Universitat Zurich Sonda y aparato para medir la hemodinamica y oxigenacion cerebrales.
US6897390B2 (en) * 2001-11-20 2005-05-24 Touchsensor Technologies, Llc Molded/integrated touch switch/control panel assembly and method for making same
WO2004114265A2 (en) * 2003-06-20 2004-12-29 Cirque Corporation Single-layer touchpad and methods of use
US20050030048A1 (en) 2003-08-05 2005-02-10 Bolender Robert J. Capacitive sensing device for use in a keypad assembly
EP1544178B1 (fr) * 2003-12-16 2009-08-12 Asulab S.A. Procédé de fabrication d'un élément transparent à électrodes invisibles
JP4336232B2 (ja) 2004-03-29 2009-09-30 富士通コンポーネント株式会社 タッチパネル
JP2005308341A (ja) * 2004-04-23 2005-11-04 Rinnai Corp コンロ
KR20070043993A (ko) * 2004-08-02 2007-04-26 코닌클리케 필립스 일렉트로닉스 엔.브이. 가상 객체를 모델링하는 것을 가능하게 하는 방법
KR101226502B1 (ko) * 2004-09-10 2013-02-07 군제 가부시키가이샤 터치 패널 및 터치 패널용 필름재료의 제조방법
US7394458B2 (en) * 2004-09-24 2008-07-01 Apple Inc. Low EMI capacitive trackpad
KR100693193B1 (ko) * 2005-11-03 2007-03-13 주식회사 나래나노텍 자외선을 이용한 패턴 전극의 본딩 구조 및 그 본딩 방법
KR100764569B1 (ko) * 2005-12-20 2007-10-10 한상열 휴대용 전자장치의 입력장치
US8373664B2 (en) * 2006-12-18 2013-02-12 Cypress Semiconductor Corporation Two circuit board touch-sensor device
CN101231930B (zh) * 2007-01-26 2010-06-16 纳瑞精密设备有限公司 使用紫外线接合图案电极的设备
JP5383991B2 (ja) * 2007-09-13 2014-01-08 日本写真印刷株式会社 静電容量センサとその製造方法
JP2010160670A (ja) * 2009-01-08 2010-07-22 Seiko Epson Corp タッチパネルの製造方法、タッチパネル、表示装置、及び電子機器
JP2010211647A (ja) * 2009-03-11 2010-09-24 Seiko Epson Corp タッチパネル装置、電気光学装置および電子機器
JP5182164B2 (ja) 2009-03-12 2013-04-10 セイコーエプソン株式会社 タッチパネルの製造方法及び表示装置製造方法並びに電子機器製造方法
KR100920253B1 (ko) 2009-04-28 2009-10-08 김태연 전기력선 변화를 이용한 정전용량식 입력장치
JP5466908B2 (ja) * 2009-09-21 2014-04-09 株式会社ワコム センサ基板および位置検出装置
US9128674B2 (en) * 2012-09-07 2015-09-08 Apple Inc. Thermal press and ultraviolet curing for display assemblies

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Also Published As

Publication number Publication date
KR100256130B1 (ko) 2000-05-15
JPH09305289A (ja) 1997-11-28
CN1082251C (zh) 2002-04-03
TW321754B (ko) 1997-12-01
JP3426847B2 (ja) 2003-07-14
US5926171A (en) 1999-07-20
CN1174413A (zh) 1998-02-25

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