KR970063550A - 기판 절단 방법 및 기판 절단 장치 - Google Patents

기판 절단 방법 및 기판 절단 장치 Download PDF

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KR970063550A
KR970063550A KR1019970005299A KR19970005299A KR970063550A KR 970063550 A KR970063550 A KR 970063550A KR 1019970005299 A KR1019970005299 A KR 1019970005299A KR 19970005299 A KR19970005299 A KR 19970005299A KR 970063550 A KR970063550 A KR 970063550A
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cutting
substrate
line
unit
detecting
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KR1019970005299A
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KR100326568B1 (ko
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아끼라 후나꼬시
치오리 모찌즈끼
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미따라이 후지오
캐논 가부시끼가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D59/00—Accessories specially designed for sawing machines or sawing devices
    • B23D59/001—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade
    • B23D59/002—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade for the position of the saw blade
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14665—Imagers using a photoconductor layer
    • H01L27/14676—X-ray, gamma-ray or corpuscular radiation imagers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y10T83/0405—With preparatory or simultaneous ancillary treatment of work
    • Y10T83/0443—By fluid application
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y10T83/0605—Cut advances across work surface
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/141—With means to monitor and control operation [e.g., self-regulating means]
    • Y10T83/148—Including means to correct the sensed operation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/162—With control means responsive to replaceable or selectable information program
    • Y10T83/173—Arithmetically determined program
    • Y10T83/175—With condition sensor
    • Y10T83/178—Responsive to work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/364—By fluid blast and/or suction
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/525—Operation controlled by detector means responsive to work
    • Y10T83/533—With photo-electric work-sensing means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/525—Operation controlled by detector means responsive to work
    • Y10T83/538—Positioning of tool controlled
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/869—Means to drive or to guide tool
    • Y10T83/8878—Guide

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  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
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  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Measurement Of Radiation (AREA)
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  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

기판이 절단될 때 정확한 절단을 수행함으로써, 다수의 기판들이 배열되는 경우 기판들 사이의 틈새가 일정하게 되거나 혹은 감소되거나 제거되어, 기판들 사이의 틈새 부분의 전기적 특성을 개선할 수 있다. 이러한 목적으로 기판 상에는 절단선과 안내선이 제공되고, 기판은 절단선을 따라 절단되며, 안내선은 절단과 동시에 탐지되며, 이에 따라 오정렬을 탐지하여 오정렬이 수정되는 동안 기판을 절단하게 된다.

Description

기판 절단 방법 및 기판 절단 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제7도는 본 발명의 절단의 예를 설명하기 위한 순서도.

Claims (18)

  1. 절단선에 대응하여 제공된 안내선의 위치를 탐지하여 절단 위치를 수정하면서 상기 절단선을 따라 기판을 절단하는 기판 절단 방법.
  2. 제1항에 있어서, 상기 안내선은 상기 절단선의 안내선으로 사용된 후 절단을 위한 절단선으로 설정되는 기판 절단 방법.
  3. 제1항에 있어서, 상기 안내선은 상기 절단성과 동시에 형성되는 기판 절단 방법.
  4. 제1항에 있어서, 상기 안내선은 상기 기판 상에 제공된 전극선은 기판 절단 방법.
  5. 제1항에 있어서, 상기 위치 탐지는 광원 및 광전 변환 소자를 사용하여 수행되는 기판 절단 방법.
  6. 제1항에 있어서, 상기 절단은 회전 절삭날에의해 수행되는 기판 절단 방법.
  7. 제1항에 있어서, 상기 절단선 및 상기 안내선은 상기 기판 상에 제공된 전극층들에 의해 형성되는 기판 절단 방법.
  8. 제7항에 있어서, 상기 전극층은 상기 기판 상에 형성된 전극선과 동일한 물질로 형성되는 기판 절단 방법.
  9. 제7항에 있어서, 상기 전극층은 상기 기판 상에 형성된 전극선과 동시에 형성되는 기판 절단 방법.
  10. 제1항에 있어서, 상기 절단선 및 상기 안내선은 평행하게 배열되는 기판 절단 방법.
  11. 상부에 절단선 및 안내선이 형성된 기판이 상기 기판의 상기 절단선을 따라 절단될 때, 상기 절단과 동시에 상기 안내선을 탐지함으로써 오정렬이 탐지되고 상기 오정렬이 수정되면서 상기 기판이 절단되는 기판 절단 방법.
  12. 제11항에 있어서, 상기 절단선 및 상기 안내선은 상기 기판 상에 형성된 박막 반도체 소자를 구성하는 전극선들인 기판 절단 방법.
  13. 제11항에 있어서, 상기 안내선은 상기 절단선으로 공통적으로 사용되는 기판 절단 방법.
  14. 절단기; 상기 절단기의 절단 위치를 절단될 물체에 대해 상대적으로 이동시키기 위한 유닛; 상기 절단 위치와 다른 위치에서 위치를 탐지하기 위한 유닛; 및 상기 위치 탐지 유닛에 의한 위치 정보를 기초로 상기 절단 위치를 조정하기 위한 유닛을 포함하는 기판 절단 장치.
  15. 제14항에 있어서, 상기 절단기는 절단 유닛을 구비한 기판 절단 장치.
  16. 제15항에 있어서, 상기 절단 유닛은 회전 절삭날 혹은 물 분사 노즐을 구비한 기판 절단 장치.
  17. 제16항에 있어서, 상기 위치 탐지 유닛은 광전 변환 장치를 구비한 기판 절단 장치.
  18. 상부에 기판을 절단하기 위한 절단선 및 절단과 동시에 오정렬을 탐지하기 위한 안내선이 형성된 상기 기판을 절단하기 위한 기판 절단 장치에 있어서, 상기 절단선을 절단하기 위한 유닛; 상기 절단과 동시에 상기 안내선을 탐지함으로써 상기 오정렬을 탐지하기 위한 유닛; 및 상기 절단과 동시에 상기 오정렬이 발생할 때 오정렬량을 수정하기 위한 유닛을 포함하는 기판 절단 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019970005299A 1996-02-21 1997-02-21 기판절단방법및기판절단장치 KR100326568B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP96-033615 1996-02-21
JP3361596 1996-02-21
JP97-027837 1997-02-12
JP2783797A JP3618945B2 (ja) 1996-02-21 1997-02-12 基板の切断方法及び基板切断装置

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KR100326568B1 KR100326568B1 (ko) 2002-07-27

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JP3618945B2 (ja) 2005-02-09
KR100326568B1 (ko) 2002-07-27
JPH09289181A (ja) 1997-11-04
US20030079583A1 (en) 2003-05-01
US7077120B2 (en) 2006-07-18

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