KR970053193A - 본딩 와이어의 단선 불량을 감지할 수 있는 회로 기판 및 와이어 본딩 장치 - Google Patents
본딩 와이어의 단선 불량을 감지할 수 있는 회로 기판 및 와이어 본딩 장치 Download PDFInfo
- Publication number
- KR970053193A KR970053193A KR1019950068156A KR19950068156A KR970053193A KR 970053193 A KR970053193 A KR 970053193A KR 1019950068156 A KR1019950068156 A KR 1019950068156A KR 19950068156 A KR19950068156 A KR 19950068156A KR 970053193 A KR970053193 A KR 970053193A
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- Prior art keywords
- wire
- bonding
- circuit board
- semiconductor chip
- substrate body
- Prior art date
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- 239000004065 semiconductor Substances 0.000 claims abstract 11
- 238000000034 method Methods 0.000 claims abstract 5
- 239000000758 substrate Substances 0.000 claims 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 claims 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000001514 detection method Methods 0.000 claims 1
- 238000005530 etching Methods 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 229920002120 photoresistant polymer Polymers 0.000 claims 1
- 229920003192 poly(bis maleimide) Polymers 0.000 claims 1
- 230000006866 deterioration Effects 0.000 abstract 1
- 239000000945 filler Substances 0.000 abstract 1
Classifications
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- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
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- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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Abstract
본 발명은 반도체 칩과 회로기판을 본딩 와이어에 의해 전기적으로 연결할 때 볼 본딩이 이루어지는 반도체 칩의 본딩 패드에서 와이어가 제대로 본딩되었는지를 와이어 본딩 공정이 진행되는 동안에 감지함으로써 와이어 단선 불량에 의한 와이어 본딩 공정 및 반도체 칩 패키지의 신뢰성 저하를 방지하기 위한 것으로 와이어 본딩 공정에서 회로기판을 고정시키는 클램프의 접지핀과 연결되는 접지 단자를 상기 반도체 칩이 실장되는 다이 패드와 연결되도록 형성하고, 와이어를 본딩하는 캐필러리, 와이어스풀과 연결되며 상기 접지 단자와 연결되는 저항 게이지르 ㄹ와이어 본딩 장치의 내부 시스템과도 전기적으로 연결하여 본딩 패드와 본딩되는 와이어간의 저항값을 측정하여 이 값이 소정의 값을 초과하는 경우에는 본딩 장치의 동작을 정지시키고 단선 불량을 해결할 수 있는 구조를 갖는 회로 기판 및 와이어 본딩 장치를 개시한다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제3도는 본 발명에 따른 접지 단자를 갖는 회로 기판의 평면도.
Claims (9)
- 기판 몸체와, 상기 기판 몸체의 상부면에 형성되며 반도체 칩이 실장되는 다이 패드 영역과 상기 기판 몸체의 상부면과 하부면에 형성되며 상기 반도체 칩의 전기적인 연결을 위한 전도성 배선 패턴과를 갖는 패턴층과, 상기 기판 몸체의 상부면과 하부면에 형성되어 있는 배선 패턴을 연결하기 위해 상기 기판 몸체를 관통하는 비아 구멍을 구비하는 회로 기판에 있어서, 상기 전도성 배선 패턴은 한쪽 끝에는 상기 반도체 칩과 회로기판을 전기적으로 연결하는 본딩 와이어가 본딩되는 본딩 리드가 형성되어 있으며, 상기 패턴층은 상기 다이 패드 영역에서 바깥쪽으로 연장되어 있으며, 상기 반도체 칩과 상기 회로기판을 와이어 본딩에 의해 전기적으로 연결할 때 회로기판을 고정하는 수단과 연결되는 접지 단자를 더 구비하는 것을 특징으로 하는 회로기판.
- 제1항에 있어서, 상기 기판 몸체는 BT 수지(Bismaleimide Triazine resin)이며, 상기 패턴 층은 구리층인 것을 특징으로 하는 회로 기판.
- 제2항에 있어서, 상기 패턴층은 상기 BT 수지의 양면에 구리층을 압착한 다음 감광막을 도포하고 상기 다이 패드, 배선 패턴 및 접지 단자와 동일한 형성을 갖는 마스크를 사용하여 노광/현상하여 선택적으로 에칭함으로써 형성되는 것을 특징으로 하는 회로기판.
- 제1항 또는 제2항에 있어서, 상기 접지 단자는 원형이며 그 지름이 1.5㎜ 이상의 크기를 갖는 것을 특징으로 하는 회로기판.
- 복수의 본딩 패드를 갖는 반도체 칩과, 상기 반도체 칩이 실장되는 다이 패드 영역과 소정의 전도성 배선 패턴을 갖는 회로기판을 전기적으로 연결하기 위한 와이어 본딩 장치로서, 상기 회로기판을 공정 진행동안 움직이지 않고 고정시키는 고정 수단과, 와이어가 감겨 있는 와이어 스풀 및 상기 와이어 스풀과 연결되며 상기 반도체 칩의 본딩 패드와 상기 전도성 배선 패턴에 와이어를 본딩하는 캐필러리를 갖는 본딩 헤드를 구비하는 와이어 본딩 장치에 있어서, 상기 회로기판의 전도성 배선 패턴은 상기 고정 수단과 연결되며 접지 전원이 공급되는 접지 단자를 가지며, 상기 본딩 헤드는 상기 반도체 칩 본딩 패드에 와이어가 본딩되는 순간 전기 저항값을 측정하여 와이어의 단선 불량을 감지하는 와이어 단선 감지 수단을 더 구비하는 것을 특징으로 하는 와이어 본딩 장치.
- 제5항에 있어서, 상기 와이어 단선 감지 수단은 상기 와이어 스풀과 연결되며 상기 회로기판의 접지 단자와 연결됨과 동시에 상기 와이어 본딩 장치의 내부 시스템과 연결되는 저항 게이지를 구비하는 것을 특징으로 하는 와이어 본딩 장치.
- 제5항 또는 제6항에 있어서, 상기 본딩 헤드는 상기 반도체 칩의 본딩 패드와 상기 회로 기판의 배선 패턴을 볼-웨지 본딩하는 것을 특징으로 하는 와이어 본딩 장치.
- 제6항에 있어서, 상기 와이어 단선 감지 수단은 상기 반도체 칩의 본딩 패드에 와이어가 본딩되는 순간 와이어와 본딩 패드간의 전기 저항을 측정하는 것을 특징으로 하는 와이어 본딩 장치.
- 제6항 또는 제8항에 있어서, 상기 와이어 단선 감지 수단은 저항값이 소정의 값보다 더 큰 경우에는 와이어 본딩 장치의 내부 시스템의 동작에 의해 상기 본딩 헤드의 동작을 정지시키는 것을 특징으로 하는 와이어 본딩 장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950068156A KR100193903B1 (ko) | 1995-12-30 | 1995-12-30 | 본딩 와이어의 단선 불량을 감지할 수 있는 회로 기판 및 와이어 본딩 장치 |
JP34097096A JP2771154B2 (ja) | 1995-12-30 | 1996-12-20 | ボンディングワイヤの断線を感知する接地端子を有する回路基板を用いたワイヤボンディング装置 |
US08/774,608 US5893508A (en) | 1995-12-30 | 1996-12-30 | Circuit board having a terminal for detecting disconnection of a bonding wire and a wire bonding apparatus using such a board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950068156A KR100193903B1 (ko) | 1995-12-30 | 1995-12-30 | 본딩 와이어의 단선 불량을 감지할 수 있는 회로 기판 및 와이어 본딩 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970053193A true KR970053193A (ko) | 1997-07-29 |
KR100193903B1 KR100193903B1 (ko) | 1999-06-15 |
Family
ID=19447946
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1019950068156A KR100193903B1 (ko) | 1995-12-30 | 1995-12-30 | 본딩 와이어의 단선 불량을 감지할 수 있는 회로 기판 및 와이어 본딩 장치 |
Country Status (3)
Country | Link |
---|---|
US (1) | US5893508A (ko) |
JP (1) | JP2771154B2 (ko) |
KR (1) | KR100193903B1 (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100308397B1 (ko) * | 1998-12-30 | 2001-12-17 | 마이클 디. 오브라이언 | 반도체패키지의회로기판구조및회로기판을이용한접지방법 |
KR100388292B1 (ko) * | 2000-10-19 | 2003-06-19 | 앰코 테크놀로지 코리아 주식회사 | 반도체패키지 제조용 클램프 및 이를 이용한 와이어본딩 모니터링 방법 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6079607A (en) * | 1997-04-29 | 2000-06-27 | Texas Instruments Incorporated | Method for high frequency bonding |
JP3638771B2 (ja) * | 1997-12-22 | 2005-04-13 | 沖電気工業株式会社 | 半導体装置 |
US6039234A (en) * | 1998-06-16 | 2000-03-21 | Kulicke & Soffa Investments, Inc. | Missing wire detector |
JP3627565B2 (ja) * | 1999-03-30 | 2005-03-09 | セイコーエプソン株式会社 | 半導体装置およびその製造方法 |
US6448507B1 (en) * | 2000-06-28 | 2002-09-10 | Advanced Micro Devices, Inc. | Solder mask for controlling resin bleed |
TW522532B (en) * | 2000-11-07 | 2003-03-01 | Siliconware Precision Industries Co Ltd | Schemes for detecting bonding status of bonding wire of semiconductor package |
KR100694417B1 (ko) * | 2000-12-30 | 2007-03-12 | 앰코 테크놀로지 코리아 주식회사 | 볼 그리드 어레이 반도체 패키지의 와이어 본딩용 클램프및 이를 이용한 와이어 본딩 검사 방법 |
US6667625B1 (en) * | 2001-12-31 | 2003-12-23 | Charles F. Miller | Method and apparatus for detecting wire in an ultrasonic bonding tool |
US6978214B2 (en) * | 2003-11-25 | 2005-12-20 | International Business Machines Corporation | Validation of electrical performance of an electronic package prior to fabrication |
US7481351B2 (en) * | 2003-12-23 | 2009-01-27 | Samsung Electronics Co., Ltd. | Wire bonding apparatus and method for clamping a wire |
JP4397326B2 (ja) * | 2004-12-27 | 2010-01-13 | 株式会社新川 | ボンディング装置 |
CN101925248B (zh) * | 2009-06-12 | 2012-04-18 | 海洋王照明科技股份有限公司 | 一种电路板以及导线固定在电路板上的固定方法 |
JP6395045B2 (ja) * | 2014-11-18 | 2018-09-26 | 日亜化学工業株式会社 | 複合基板並びに発光装置及びその製造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3734382A (en) * | 1972-04-03 | 1973-05-22 | Motorola Inc | Apparatus for control of welding apparatus |
US4555052A (en) * | 1983-02-28 | 1985-11-26 | Fairchild Camera & Instrument Corporation | Lead wire bond attempt detection |
US4684884A (en) * | 1985-07-02 | 1987-08-04 | Gte Communication Systems Corporation | Universal test circuit for integrated circuit packages |
JPS62291933A (ja) * | 1986-06-12 | 1987-12-18 | Toshiba Corp | ワイヤボンデイング装置 |
JP2996847B2 (ja) * | 1993-11-01 | 2000-01-11 | 株式会社カイジョー | ワイヤボンディング装置及び該装置を用いたボンディング状態検査方法 |
-
1995
- 1995-12-30 KR KR1019950068156A patent/KR100193903B1/ko not_active IP Right Cessation
-
1996
- 1996-12-20 JP JP34097096A patent/JP2771154B2/ja not_active Expired - Lifetime
- 1996-12-30 US US08/774,608 patent/US5893508A/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100308397B1 (ko) * | 1998-12-30 | 2001-12-17 | 마이클 디. 오브라이언 | 반도체패키지의회로기판구조및회로기판을이용한접지방법 |
KR100388292B1 (ko) * | 2000-10-19 | 2003-06-19 | 앰코 테크놀로지 코리아 주식회사 | 반도체패키지 제조용 클램프 및 이를 이용한 와이어본딩 모니터링 방법 |
Also Published As
Publication number | Publication date |
---|---|
US5893508A (en) | 1999-04-13 |
JPH09191024A (ja) | 1997-07-22 |
KR100193903B1 (ko) | 1999-06-15 |
JP2771154B2 (ja) | 1998-07-02 |
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