KR970053193A - 본딩 와이어의 단선 불량을 감지할 수 있는 회로 기판 및 와이어 본딩 장치 - Google Patents

본딩 와이어의 단선 불량을 감지할 수 있는 회로 기판 및 와이어 본딩 장치 Download PDF

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Publication number
KR970053193A
KR970053193A KR1019950068156A KR19950068156A KR970053193A KR 970053193 A KR970053193 A KR 970053193A KR 1019950068156 A KR1019950068156 A KR 1019950068156A KR 19950068156 A KR19950068156 A KR 19950068156A KR 970053193 A KR970053193 A KR 970053193A
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South Korea
Prior art keywords
wire
bonding
circuit board
semiconductor chip
substrate body
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KR1019950068156A
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English (en)
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KR100193903B1 (ko
Inventor
오세혁
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김광호
삼성전자 주식회사
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Priority to KR1019950068156A priority Critical patent/KR100193903B1/ko
Priority to JP34097096A priority patent/JP2771154B2/ja
Priority to US08/774,608 priority patent/US5893508A/en
Publication of KR970053193A publication Critical patent/KR970053193A/ko
Application granted granted Critical
Publication of KR100193903B1 publication Critical patent/KR100193903B1/ko

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Abstract

본 발명은 반도체 칩과 회로기판을 본딩 와이어에 의해 전기적으로 연결할 때 볼 본딩이 이루어지는 반도체 칩의 본딩 패드에서 와이어가 제대로 본딩되었는지를 와이어 본딩 공정이 진행되는 동안에 감지함으로써 와이어 단선 불량에 의한 와이어 본딩 공정 및 반도체 칩 패키지의 신뢰성 저하를 방지하기 위한 것으로 와이어 본딩 공정에서 회로기판을 고정시키는 클램프의 접지핀과 연결되는 접지 단자를 상기 반도체 칩이 실장되는 다이 패드와 연결되도록 형성하고, 와이어를 본딩하는 캐필러리, 와이어스풀과 연결되며 상기 접지 단자와 연결되는 저항 게이지르 ㄹ와이어 본딩 장치의 내부 시스템과도 전기적으로 연결하여 본딩 패드와 본딩되는 와이어간의 저항값을 측정하여 이 값이 소정의 값을 초과하는 경우에는 본딩 장치의 동작을 정지시키고 단선 불량을 해결할 수 있는 구조를 갖는 회로 기판 및 와이어 본딩 장치를 개시한다.

Description

본딩 와이어의 단선 불량을 감지할 수 있는 회로 기판 및 와이어 본딩 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제3도는 본 발명에 따른 접지 단자를 갖는 회로 기판의 평면도.

Claims (9)

  1. 기판 몸체와, 상기 기판 몸체의 상부면에 형성되며 반도체 칩이 실장되는 다이 패드 영역과 상기 기판 몸체의 상부면과 하부면에 형성되며 상기 반도체 칩의 전기적인 연결을 위한 전도성 배선 패턴과를 갖는 패턴층과, 상기 기판 몸체의 상부면과 하부면에 형성되어 있는 배선 패턴을 연결하기 위해 상기 기판 몸체를 관통하는 비아 구멍을 구비하는 회로 기판에 있어서, 상기 전도성 배선 패턴은 한쪽 끝에는 상기 반도체 칩과 회로기판을 전기적으로 연결하는 본딩 와이어가 본딩되는 본딩 리드가 형성되어 있으며, 상기 패턴층은 상기 다이 패드 영역에서 바깥쪽으로 연장되어 있으며, 상기 반도체 칩과 상기 회로기판을 와이어 본딩에 의해 전기적으로 연결할 때 회로기판을 고정하는 수단과 연결되는 접지 단자를 더 구비하는 것을 특징으로 하는 회로기판.
  2. 제1항에 있어서, 상기 기판 몸체는 BT 수지(Bismaleimide Triazine resin)이며, 상기 패턴 층은 구리층인 것을 특징으로 하는 회로 기판.
  3. 제2항에 있어서, 상기 패턴층은 상기 BT 수지의 양면에 구리층을 압착한 다음 감광막을 도포하고 상기 다이 패드, 배선 패턴 및 접지 단자와 동일한 형성을 갖는 마스크를 사용하여 노광/현상하여 선택적으로 에칭함으로써 형성되는 것을 특징으로 하는 회로기판.
  4. 제1항 또는 제2항에 있어서, 상기 접지 단자는 원형이며 그 지름이 1.5㎜ 이상의 크기를 갖는 것을 특징으로 하는 회로기판.
  5. 복수의 본딩 패드를 갖는 반도체 칩과, 상기 반도체 칩이 실장되는 다이 패드 영역과 소정의 전도성 배선 패턴을 갖는 회로기판을 전기적으로 연결하기 위한 와이어 본딩 장치로서, 상기 회로기판을 공정 진행동안 움직이지 않고 고정시키는 고정 수단과, 와이어가 감겨 있는 와이어 스풀 및 상기 와이어 스풀과 연결되며 상기 반도체 칩의 본딩 패드와 상기 전도성 배선 패턴에 와이어를 본딩하는 캐필러리를 갖는 본딩 헤드를 구비하는 와이어 본딩 장치에 있어서, 상기 회로기판의 전도성 배선 패턴은 상기 고정 수단과 연결되며 접지 전원이 공급되는 접지 단자를 가지며, 상기 본딩 헤드는 상기 반도체 칩 본딩 패드에 와이어가 본딩되는 순간 전기 저항값을 측정하여 와이어의 단선 불량을 감지하는 와이어 단선 감지 수단을 더 구비하는 것을 특징으로 하는 와이어 본딩 장치.
  6. 제5항에 있어서, 상기 와이어 단선 감지 수단은 상기 와이어 스풀과 연결되며 상기 회로기판의 접지 단자와 연결됨과 동시에 상기 와이어 본딩 장치의 내부 시스템과 연결되는 저항 게이지를 구비하는 것을 특징으로 하는 와이어 본딩 장치.
  7. 제5항 또는 제6항에 있어서, 상기 본딩 헤드는 상기 반도체 칩의 본딩 패드와 상기 회로 기판의 배선 패턴을 볼-웨지 본딩하는 것을 특징으로 하는 와이어 본딩 장치.
  8. 제6항에 있어서, 상기 와이어 단선 감지 수단은 상기 반도체 칩의 본딩 패드에 와이어가 본딩되는 순간 와이어와 본딩 패드간의 전기 저항을 측정하는 것을 특징으로 하는 와이어 본딩 장치.
  9. 제6항 또는 제8항에 있어서, 상기 와이어 단선 감지 수단은 저항값이 소정의 값보다 더 큰 경우에는 와이어 본딩 장치의 내부 시스템의 동작에 의해 상기 본딩 헤드의 동작을 정지시키는 것을 특징으로 하는 와이어 본딩 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950068156A 1995-12-30 1995-12-30 본딩 와이어의 단선 불량을 감지할 수 있는 회로 기판 및 와이어 본딩 장치 KR100193903B1 (ko)

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KR1019950068156A KR100193903B1 (ko) 1995-12-30 1995-12-30 본딩 와이어의 단선 불량을 감지할 수 있는 회로 기판 및 와이어 본딩 장치
JP34097096A JP2771154B2 (ja) 1995-12-30 1996-12-20 ボンディングワイヤの断線を感知する接地端子を有する回路基板を用いたワイヤボンディング装置
US08/774,608 US5893508A (en) 1995-12-30 1996-12-30 Circuit board having a terminal for detecting disconnection of a bonding wire and a wire bonding apparatus using such a board

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KR1019950068156A KR100193903B1 (ko) 1995-12-30 1995-12-30 본딩 와이어의 단선 불량을 감지할 수 있는 회로 기판 및 와이어 본딩 장치

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KR100308397B1 (ko) * 1998-12-30 2001-12-17 마이클 디. 오브라이언 반도체패키지의회로기판구조및회로기판을이용한접지방법
KR100388292B1 (ko) * 2000-10-19 2003-06-19 앰코 테크놀로지 코리아 주식회사 반도체패키지 제조용 클램프 및 이를 이용한 와이어본딩 모니터링 방법

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JP3627565B2 (ja) * 1999-03-30 2005-03-09 セイコーエプソン株式会社 半導体装置およびその製造方法
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TW522532B (en) * 2000-11-07 2003-03-01 Siliconware Precision Industries Co Ltd Schemes for detecting bonding status of bonding wire of semiconductor package
KR100694417B1 (ko) * 2000-12-30 2007-03-12 앰코 테크놀로지 코리아 주식회사 볼 그리드 어레이 반도체 패키지의 와이어 본딩용 클램프및 이를 이용한 와이어 본딩 검사 방법
US6667625B1 (en) * 2001-12-31 2003-12-23 Charles F. Miller Method and apparatus for detecting wire in an ultrasonic bonding tool
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JP4397326B2 (ja) * 2004-12-27 2010-01-13 株式会社新川 ボンディング装置
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JP6395045B2 (ja) * 2014-11-18 2018-09-26 日亜化学工業株式会社 複合基板並びに発光装置及びその製造方法

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100308397B1 (ko) * 1998-12-30 2001-12-17 마이클 디. 오브라이언 반도체패키지의회로기판구조및회로기판을이용한접지방법
KR100388292B1 (ko) * 2000-10-19 2003-06-19 앰코 테크놀로지 코리아 주식회사 반도체패키지 제조용 클램프 및 이를 이용한 와이어본딩 모니터링 방법

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