KR970046723U - 웨이퍼 백사이드 오염방지를 위한 클리닝 장치 - Google Patents

웨이퍼 백사이드 오염방지를 위한 클리닝 장치

Info

Publication number
KR970046723U
KR970046723U KR2019950046866U KR19950046866U KR970046723U KR 970046723 U KR970046723 U KR 970046723U KR 2019950046866 U KR2019950046866 U KR 2019950046866U KR 19950046866 U KR19950046866 U KR 19950046866U KR 970046723 U KR970046723 U KR 970046723U
Authority
KR
South Korea
Prior art keywords
cleaning device
wafer backside
prevent wafer
backside contamination
contamination
Prior art date
Application number
KR2019950046866U
Other languages
English (en)
Other versions
KR200148368Y1 (ko
Inventor
홍경호
Original Assignee
현대전자산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업주식회사 filed Critical 현대전자산업주식회사
Priority to KR2019950046866U priority Critical patent/KR200148368Y1/ko
Publication of KR970046723U publication Critical patent/KR970046723U/ko
Application granted granted Critical
Publication of KR200148368Y1 publication Critical patent/KR200148368Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR2019950046866U 1995-12-23 1995-12-23 웨이퍼 백사이드 오염방지를 위한 클리닝 장치 KR200148368Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950046866U KR200148368Y1 (ko) 1995-12-23 1995-12-23 웨이퍼 백사이드 오염방지를 위한 클리닝 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950046866U KR200148368Y1 (ko) 1995-12-23 1995-12-23 웨이퍼 백사이드 오염방지를 위한 클리닝 장치

Publications (2)

Publication Number Publication Date
KR970046723U true KR970046723U (ko) 1997-07-31
KR200148368Y1 KR200148368Y1 (ko) 1999-06-15

Family

ID=19437911

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950046866U KR200148368Y1 (ko) 1995-12-23 1995-12-23 웨이퍼 백사이드 오염방지를 위한 클리닝 장치

Country Status (1)

Country Link
KR (1) KR200148368Y1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100330564B1 (ko) * 1997-03-06 2002-06-20 시바타 마사하루 웨이퍼흡착장치용기판및그제조방법
KR100713398B1 (ko) * 2000-03-07 2007-05-03 동부일렉트로닉스 주식회사 음파를 이용한 반도체 웨이퍼의 현상장치

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100330564B1 (ko) * 1997-03-06 2002-06-20 시바타 마사하루 웨이퍼흡착장치용기판및그제조방법
KR100713398B1 (ko) * 2000-03-07 2007-05-03 동부일렉트로닉스 주식회사 음파를 이용한 반도체 웨이퍼의 현상장치

Also Published As

Publication number Publication date
KR200148368Y1 (ko) 1999-06-15

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